JP2006508406A5 - - Google Patents
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- Publication number
- JP2006508406A5 JP2006508406A5 JP2005510343A JP2005510343A JP2006508406A5 JP 2006508406 A5 JP2006508406 A5 JP 2006508406A5 JP 2005510343 A JP2005510343 A JP 2005510343A JP 2005510343 A JP2005510343 A JP 2005510343A JP 2006508406 A5 JP2006508406 A5 JP 2006508406A5
- Authority
- JP
- Japan
- Prior art keywords
- backplane
- electro
- display
- metal foil
- optic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims description 106
- 239000002184 metal Substances 0.000 claims description 104
- 229910052751 metal Inorganic materials 0.000 claims description 104
- 239000002861 polymer material Substances 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 37
- 238000001962 electrophoresis Methods 0.000 claims description 35
- 239000010409 thin film Substances 0.000 claims description 31
- 239000010410 layer Substances 0.000 description 116
- 238000000034 method Methods 0.000 description 86
- 239000000758 substrate Substances 0.000 description 51
- 229920000642 polymer Polymers 0.000 description 20
- 238000000576 coating method Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive Effects 0.000 description 17
- 239000000382 optic material Substances 0.000 description 16
- 230000002093 peripheral Effects 0.000 description 13
- 230000035969 Vmax Effects 0.000 description 12
- 239000002775 capsule Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 12
- 238000005452 bending Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005755 formation reaction Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 Polyimide Polymers 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 230000003287 optical Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 210000004027 cells Anatomy 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000000443 aerosol Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000003094 microcapsule Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000002633 protecting Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000009958 sewing Methods 0.000 description 3
- 210000003932 Urinary Bladder Anatomy 0.000 description 2
- 210000003934 Vacuoles Anatomy 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 230000002452 interceptive Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920005596 polymer binder Polymers 0.000 description 2
- 239000002491 polymer binding agent Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- 239000004698 Polyethylene (PE) Substances 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium(0) Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000001627 detrimental Effects 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000009685 knife-over-roll coating Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000006194 liquid suspension Substances 0.000 description 1
- 238000011068 load Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 230000001617 migratory Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000051 modifying Effects 0.000 description 1
- 239000002365 multiple layer Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001568 sexual Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007767 slide coating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31973202P | 2002-11-26 | 2002-11-26 | |
| US60/319,732 | 2002-11-26 | ||
| US48139603P | 2003-09-18 | 2003-09-18 | |
| US60/481,396 | 2003-09-18 | ||
| PCT/US2003/038009 WO2004049045A2 (fr) | 2002-11-26 | 2003-11-26 | Circuits electroniques et affichages souples |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010294223A Division JP2011103000A (ja) | 2002-11-26 | 2010-12-28 | 可撓性電子回路およびディスプレイ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006508406A JP2006508406A (ja) | 2006-03-09 |
| JP2006508406A5 true JP2006508406A5 (fr) | 2011-02-24 |
| JP4885541B2 JP4885541B2 (ja) | 2012-02-29 |
Family
ID=32396748
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005510343A Expired - Lifetime JP4885541B2 (ja) | 2002-11-26 | 2003-11-26 | バックプレーンおよび電気光学的ディスプレイ |
| JP2010294223A Ceased JP2011103000A (ja) | 2002-11-26 | 2010-12-28 | 可撓性電子回路およびディスプレイ |
| JP2013022223A Expired - Lifetime JP5758419B2 (ja) | 2002-11-26 | 2013-02-07 | 可撓性電子回路およびディスプレイ |
| JP2014129870A Withdrawn JP2014238582A (ja) | 2002-11-26 | 2014-06-25 | 可撓性電子回路およびディスプレイ |
| JP2015253058A Ceased JP2016042207A (ja) | 2002-11-26 | 2015-12-25 | 可撓性電子回路およびディスプレイ |
| JP2017020907A Expired - Lifetime JP6407321B2 (ja) | 2002-11-26 | 2017-02-08 | 可撓性電子回路およびディスプレイ |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010294223A Ceased JP2011103000A (ja) | 2002-11-26 | 2010-12-28 | 可撓性電子回路およびディスプレイ |
| JP2013022223A Expired - Lifetime JP5758419B2 (ja) | 2002-11-26 | 2013-02-07 | 可撓性電子回路およびディスプレイ |
| JP2014129870A Withdrawn JP2014238582A (ja) | 2002-11-26 | 2014-06-25 | 可撓性電子回路およびディスプレイ |
| JP2015253058A Ceased JP2016042207A (ja) | 2002-11-26 | 2015-12-25 | 可撓性電子回路およびディスプレイ |
| JP2017020907A Expired - Lifetime JP6407321B2 (ja) | 2002-11-26 | 2017-02-08 | 可撓性電子回路およびディスプレイ |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1565785A2 (fr) |
| JP (6) | JP4885541B2 (fr) |
| KR (3) | KR100985418B1 (fr) |
| AU (1) | AU2003293161A1 (fr) |
| WO (1) | WO2004049045A2 (fr) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7327511B2 (en) | 2004-03-23 | 2008-02-05 | E Ink Corporation | Light modulators |
| JP4806634B2 (ja) | 2003-08-19 | 2011-11-02 | イー インク コーポレイション | 電気光学ディスプレイおよび電気光学ディスプレイを動作させる方法 |
| CN101142510B (zh) | 2003-11-05 | 2010-04-14 | 伊英克公司 | 电光显示器 |
| WO2005054933A2 (fr) | 2003-11-26 | 2005-06-16 | E Ink Corporation | Afficheurs electro-optiques a tension residuelle reduite |
| JP2006119495A (ja) * | 2004-10-25 | 2006-05-11 | Toppan Printing Co Ltd | 電子ディスプレイ |
| JP2008542834A (ja) * | 2005-05-31 | 2008-11-27 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 柔軟なディスプレイデバイス |
| KR100879207B1 (ko) * | 2005-12-30 | 2009-01-16 | 주식회사 엘지화학 | 플렉시블 디스플레이장치 및 이의 제조방법 |
| US7733554B2 (en) * | 2006-03-08 | 2010-06-08 | E Ink Corporation | Electro-optic displays, and materials and methods for production thereof |
| GB0612777D0 (en) * | 2006-06-28 | 2006-08-09 | Polymertronics Ltd | Multi-layered ultra-violet cured organic electronic device |
| KR101359916B1 (ko) * | 2007-05-08 | 2014-02-10 | 삼성디스플레이 주식회사 | 가요성 표시 장치의 제조 방법 |
| KR101483193B1 (ko) * | 2008-04-22 | 2015-01-16 | 주성엔지니어링(주) | 박막 패터닝 방법 및 이를 이용한 전기 광학 소자 |
| JP2011013554A (ja) * | 2009-07-03 | 2011-01-20 | Takao Hayashi | 電子ペーパー、外観可変装置、外観可変構造体 |
| JP5757083B2 (ja) | 2010-12-01 | 2015-07-29 | セイコーエプソン株式会社 | 薄膜トランジスタ形成用基板、半導体装置、電気装置 |
| KR101878251B1 (ko) * | 2011-04-08 | 2018-07-13 | 삼성전자주식회사 | 굽힘 감지 센서 및 그를 제조하는 방법 |
| WO2018130278A1 (fr) * | 2017-01-11 | 2018-07-19 | Applied Materials, Inc. | Procédé et appareil de traitement d'un substrat |
| CN106935720B (zh) * | 2017-03-13 | 2019-06-14 | 京东方科技集团股份有限公司 | 显示基板、显示面板、显示设备和制造其的方法 |
| JP2019078793A (ja) * | 2017-10-20 | 2019-05-23 | 株式会社ジャパンディスプレイ | 表示装置 |
| US20210132459A1 (en) | 2019-11-04 | 2021-05-06 | E Ink Corporation | Three-dimensional, color-changing objects including a light-transmissive substrate and an electrophoretic medium |
| US20240302705A1 (en) * | 2023-03-08 | 2024-09-12 | The Boeing Company | Systems and methods for forming a dynamic display |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346848U (fr) * | 1976-09-25 | 1978-04-20 | ||
| JPS552240A (en) * | 1978-06-19 | 1980-01-09 | Matsushita Electric Ind Co Ltd | Electrochromic display device |
| JPS5782883A (en) * | 1980-11-12 | 1982-05-24 | Ricoh Watch | Package of liquid crystal indicator |
| JPH0633107B2 (ja) * | 1983-12-28 | 1994-05-02 | 富士写真フイルム株式会社 | 包装材料 |
| JP2551794B2 (ja) * | 1987-11-28 | 1996-11-06 | エヌオーケー株式会社 | 電気泳動表示装置及びその製造法 |
| JPH01166018A (ja) * | 1987-12-22 | 1989-06-29 | Matsushita Electric Ind Co Ltd | 湾曲液晶パネルとその製造方法 |
| JPH0736346Y2 (ja) * | 1990-11-27 | 1995-08-16 | スタンレー電気株式会社 | 曲面表示パネル装置 |
| KR960002202B1 (ko) * | 1991-02-04 | 1996-02-13 | 가부시끼가이샤 한도다이 에네르기 겐뀨쇼 | 액정 전기 광학 장치 제작 방법 |
| US5288541A (en) * | 1991-10-17 | 1994-02-22 | International Business Machines Corporation | Method for metallizing through holes in thin film substrates, and resulting devices |
| JPH06202567A (ja) * | 1992-12-28 | 1994-07-22 | Iwasaki Electric Co Ltd | Ｅｌ表示装置 |
| JPH07175090A (ja) * | 1993-12-21 | 1995-07-14 | Nikon Corp | エレクトロクロミック眼鏡レンズ |
| JPH08211406A (ja) * | 1995-02-02 | 1996-08-20 | A G Technol Kk | アクティブマトリクス表示素子 |
| JPH09179106A (ja) * | 1995-12-21 | 1997-07-11 | Dainippon Printing Co Ltd | 薄型ディスプレイ用基板とこれを使用したフィルム液晶ディスプレイおよびフィールドエミッションディスプレイ |
| JPH10265572A (ja) * | 1996-02-13 | 1998-10-06 | Nitto Denko Corp | 回路基板、回路付きサスペンション基板及びそれらの製造方法 |
| US5825526A (en) * | 1996-04-24 | 1998-10-20 | Minnesota Mining And Manufacturing Company | Tape for use in manufacturing electrochromic devices |
| US6067185A (en) * | 1997-08-28 | 2000-05-23 | E Ink Corporation | Process for creating an encapsulated electrophoretic display |
| KR100502091B1 (ko) * | 1998-04-10 | 2005-11-23 | 삼성전자주식회사 | 유기 절연막을 이용한 액정 표시 장치 및 그 제조 방법 |
| JP2000098930A (ja) * | 1998-06-10 | 2000-04-07 | Matsushita Electric Ind Co Ltd | ディスプレイデバイス |
| US6127725A (en) * | 1998-08-03 | 2000-10-03 | Harris; Ellis D. | Thin film electronics on insulator on metal |
| JP2000066248A (ja) * | 1998-08-18 | 2000-03-03 | Sony Corp | 電気泳動表示装置 |
| JP2000098349A (ja) * | 1998-09-18 | 2000-04-07 | Casio Comput Co Ltd | フィルム表示装置 |
| JP2000122571A (ja) * | 1998-10-16 | 2000-04-28 | Noritake Co Ltd | タイル型画像表示装置 |
| KR100295111B1 (ko) * | 1998-11-26 | 2001-07-12 | 구자홍 | 인쇄회로기판일체형플라즈마표시장치 |
| US6506438B2 (en) * | 1998-12-15 | 2003-01-14 | E Ink Corporation | Method for printing of transistor arrays on plastic substrates |
| US6312304B1 (en) * | 1998-12-15 | 2001-11-06 | E Ink Corporation | Assembly of microencapsulated electronic displays |
| JP2000231621A (ja) * | 1999-02-12 | 2000-08-22 | Hitachi Ltd | Ｉｃカード |
| JP3815102B2 (ja) * | 1999-02-15 | 2006-08-30 | セイコーエプソン株式会社 | 液晶表示装置 |
| JP2000286549A (ja) * | 1999-03-24 | 2000-10-13 | Fujitsu Ltd | バイアコネクションを備えた基板の製造方法 |
| JP2001133761A (ja) * | 1999-11-04 | 2001-05-18 | Toshiba Corp | 液晶表示素子及び有機ｌｅｄ素子 |
| JP4338849B2 (ja) * | 1999-11-04 | 2009-10-07 | 三菱樹脂株式会社 | Ｉｃカード |
| US6456272B1 (en) * | 1999-11-12 | 2002-09-24 | Xerox Corporation | Field addressed displays using charge discharging in conjunction with charge retaining island structures |
| JP4296668B2 (ja) * | 2000-01-31 | 2009-07-15 | コニカミノルタホールディングス株式会社 | 可逆性画像表示方法 |
| US6825068B2 (en) | 2000-04-18 | 2004-11-30 | E Ink Corporation | Process for fabricating thin film transistors |
| JP2002014377A (ja) * | 2000-04-25 | 2002-01-18 | Fuji Xerox Co Ltd | 画像表示媒体 |
| KR20020003067A (ko) * | 2000-06-30 | 2002-01-10 | 박종섭 | 습식 세정 공정에서 접착층의 손실을 효과적으로 방지할수 있는 반도체 메모리 소자 제조 방법 |
| JP2002072911A (ja) * | 2000-08-28 | 2002-03-12 | Canon Inc | 表示装置 |
| TWI304909B (fr) * | 2000-10-04 | 2009-01-01 | Matsushita Electric Ind Co Ltd | |
| JP2002116454A (ja) * | 2000-10-10 | 2002-04-19 | Seiko Epson Corp | 液晶装置および電子機器 |
| GB2367788A (en) * | 2000-10-16 | 2002-04-17 | Seiko Epson Corp | Etching using an ink jet print head |
| JP2002287121A (ja) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 反射型液晶表示基板 |
| US6864435B2 (en) * | 2001-04-25 | 2005-03-08 | Alien Technology Corporation | Electrical contacts for flexible displays |
| KR20030017748A (ko) * | 2001-08-22 | 2003-03-04 | 한국전자통신연구원 | 유기물 전계 효과 트랜지스터와 유기물 발광 다이오드가일체화된 유기물 전기 발광 소자 및 그 제조 방법 |
| JP4567941B2 (ja) * | 2001-12-28 | 2010-10-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法及び表示装置の作製方法 |
-
2003
- 2003-11-26 KR KR1020097021931A patent/KR100985418B1/ko active IP Right Grant
- 2003-11-26 KR KR1020057009457A patent/KR20050086839A/ko not_active Application Discontinuation
- 2003-11-26 EP EP03790150A patent/EP1565785A2/fr not_active Withdrawn
- 2003-11-26 AU AU2003293161A patent/AU2003293161A1/en not_active Abandoned
- 2003-11-26 KR KR1020097008077A patent/KR100955438B1/ko active IP Right Grant
- 2003-11-26 WO PCT/US2003/038009 patent/WO2004049045A2/fr active Application Filing
- 2003-11-26 JP JP2005510343A patent/JP4885541B2/ja not_active Expired - Lifetime
-
2010
- 2010-12-28 JP JP2010294223A patent/JP2011103000A/ja not_active Ceased
-
2013
- 2013-02-07 JP JP2013022223A patent/JP5758419B2/ja not_active Expired - Lifetime
-
2014
- 2014-06-25 JP JP2014129870A patent/JP2014238582A/ja not_active Withdrawn
-
2015
- 2015-12-25 JP JP2015253058A patent/JP2016042207A/ja not_active Ceased
-
2017
- 2017-02-08 JP JP2017020907A patent/JP6407321B2/ja not_active Expired - Lifetime
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