JP2006348298A5 - - Google Patents
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- Publication number
- JP2006348298A5 JP2006348298A5 JP2006166500A JP2006166500A JP2006348298A5 JP 2006348298 A5 JP2006348298 A5 JP 2006348298A5 JP 2006166500 A JP2006166500 A JP 2006166500A JP 2006166500 A JP2006166500 A JP 2006166500A JP 2006348298 A5 JP2006348298 A5 JP 2006348298A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- group
- manganese
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 12
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052596 spinel Inorganic materials 0.000 claims description 8
- 239000011029 spinel Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 239000011135 tin Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052793 cadmium Inorganic materials 0.000 claims description 6
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 6
- 150000001768 cations Chemical class 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- 239000010941 cobalt Substances 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000004643 cyanate ester Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- 239000004811 fluoropolymer Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001195 polyisoprene Polymers 0.000 claims description 2
- 229920005596 polymer binder Polymers 0.000 claims description 2
- 239000002491 polymer binding agent Substances 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 9
- 239000002346 layers by function Substances 0.000 claims 4
- 238000003491 array Methods 0.000 claims 3
- 229920006254 polymer film Polymers 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- -1 bismaleimide triazines Chemical class 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/153,206 | 2005-06-15 | ||
| US11/153,206 US7547849B2 (en) | 2005-06-15 | 2005-06-15 | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006348298A JP2006348298A (ja) | 2006-12-28 |
| JP2006348298A5 true JP2006348298A5 (https=) | 2009-07-30 |
| JP5144037B2 JP5144037B2 (ja) | 2013-02-13 |
Family
ID=37137550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006166500A Expired - Fee Related JP5144037B2 (ja) | 2005-06-15 | 2006-06-15 | 増幅光を使用してパターニングすることが可能な、電子回路タイプの適用例に有用な組成物ならびにそれに関連する方法および組成物 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7547849B2 (https=) |
| EP (2) | EP1734071A1 (https=) |
| JP (1) | JP5144037B2 (https=) |
Families Citing this family (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8323802B2 (en) | 2004-10-20 | 2012-12-04 | E I Du Pont De Nemours And Company | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
| US7547849B2 (en) | 2005-06-15 | 2009-06-16 | E.I. Du Pont De Nemours And Company | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| US7504150B2 (en) * | 2005-06-15 | 2009-03-17 | E.I. Du Pont De Nemours & Company | Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto |
| KR20080080674A (ko) * | 2005-12-30 | 2008-09-04 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자회로형 용도를 위한 기판 |
| DE102006047735A1 (de) * | 2006-10-06 | 2008-04-10 | Tesa Ag | Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
| JP5292398B2 (ja) * | 2007-07-09 | 2013-09-18 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 電子回路構造を製造するための組成物および方法 |
| US8475924B2 (en) | 2007-07-09 | 2013-07-02 | E.I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| US20090017309A1 (en) | 2007-07-09 | 2009-01-15 | E. I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| EP2178976B2 (en) | 2007-08-17 | 2021-11-17 | Mitsubishi Chemical Europe GmbH | Aromatic polycarbonate composition |
| CN101409976B (zh) * | 2007-10-12 | 2011-04-06 | 比亚迪股份有限公司 | 多层柔性线路板 |
| KR100910766B1 (ko) | 2007-11-13 | 2009-08-04 | 삼성정밀화학 주식회사 | 최적화된 수지 함침율을 갖는 프리프레그, 및 상기프리프레그를 채용한 금속박 적층판과 프린트 배선판 |
| US8309640B2 (en) * | 2008-05-23 | 2012-11-13 | Sabic Innovative Plastics Ip B.V. | High dielectric constant laser direct structuring materials |
| US8492464B2 (en) * | 2008-05-23 | 2013-07-23 | Sabic Innovative Plastics Ip B.V. | Flame retardant laser direct structuring materials |
| US10119021B2 (en) * | 2008-05-23 | 2018-11-06 | Sabic Global Technologies B.V. | Flame retardant laser direct structuring materials |
| TWI366421B (en) * | 2008-08-22 | 2012-06-11 | Nanya Plastics Corp | High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards |
| US8512596B2 (en) | 2008-12-08 | 2013-08-20 | Samsung Electronics Co., Ltd. | Composition for producing a board and printed circuit board using the same |
| US8580879B2 (en) | 2009-01-06 | 2013-11-12 | Nan Ya Plastics Corporation | Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof |
| US20100181284A1 (en) * | 2009-01-19 | 2010-07-22 | E. I. Du Pont De Nemours And Company | Method of obtaining electronic circuitry features |
| US20100193950A1 (en) * | 2009-01-30 | 2010-08-05 | E.I.Du Pont De Nemours And Company | Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto |
| EP2233519B1 (de) * | 2009-03-27 | 2011-08-31 | LANXESS Deutschland GmbH | Glühdrahtbeständige Polyester |
| FR2944982B1 (fr) * | 2009-04-30 | 2011-10-14 | Commissariat Energie Atomique | Procede de preparation d'un substrat metallise,ledit substrat et ses utilisations |
| DE102009042036B4 (de) * | 2009-09-17 | 2016-09-01 | Institut für Bioprozess- und Analysenmesstechnik e.V. | Verwendung einer lichthärtenden, biokompatiblen und biologisch abbaubaren Polymermischung |
| US20110095417A1 (en) * | 2009-10-28 | 2011-04-28 | Fairchild Semiconductor Corporation | Leadless semiconductor device terminal |
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| CN102978593B (zh) * | 2009-12-17 | 2015-07-22 | 比亚迪股份有限公司 | 塑料表面选择性金属化的方法 |
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| CN111974318B (zh) * | 2020-07-31 | 2022-03-22 | 哈尔滨师范大学 | 一种复合缺陷型金属有机框架凝胶质子传导材料及其制备方法 |
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| DE102004003890A1 (de) | 2004-01-27 | 2005-08-11 | Mitsubishi Polyester Film Gmbh | Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung |
| DE102004003891A1 (de) | 2004-01-27 | 2005-08-11 | Mitsubishi Polyester Film Gmbh | Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung |
| US20060083939A1 (en) * | 2004-10-20 | 2006-04-20 | Dunbar Meredith L | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
| US7504150B2 (en) * | 2005-06-15 | 2009-03-17 | E.I. Du Pont De Nemours & Company | Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto |
| US7547849B2 (en) | 2005-06-15 | 2009-06-16 | E.I. Du Pont De Nemours And Company | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| US20090017309A1 (en) * | 2007-07-09 | 2009-01-15 | E. I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
-
2005
- 2005-06-15 US US11/153,206 patent/US7547849B2/en not_active Expired - Fee Related
-
2006
- 2006-05-22 EP EP20060010493 patent/EP1734071A1/en not_active Withdrawn
- 2006-05-22 EP EP20090008443 patent/EP2098562A1/en not_active Withdrawn
- 2006-06-15 JP JP2006166500A patent/JP5144037B2/ja not_active Expired - Fee Related
-
2007
- 2007-08-09 US US11/891,129 patent/US7531204B2/en not_active Expired - Fee Related
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