JP5144037B2 - 増幅光を使用してパターニングすることが可能な、電子回路タイプの適用例に有用な組成物ならびにそれに関連する方法および組成物 - Google Patents
増幅光を使用してパターニングすることが可能な、電子回路タイプの適用例に有用な組成物ならびにそれに関連する方法および組成物 Download PDFInfo
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- JP5144037B2 JP5144037B2 JP2006166500A JP2006166500A JP5144037B2 JP 5144037 B2 JP5144037 B2 JP 5144037B2 JP 2006166500 A JP2006166500 A JP 2006166500A JP 2006166500 A JP2006166500 A JP 2006166500A JP 5144037 B2 JP5144037 B2 JP 5144037B2
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- HJJVPARKXDDIQD-UHFFFAOYSA-N bromuconazole Chemical compound ClC1=CC(Cl)=CC=C1C1(CN2N=CN=C2)OCC(Br)C1 HJJVPARKXDDIQD-UHFFFAOYSA-N 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
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- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
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- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
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- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
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- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1233—Organic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
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- Chemical Kinetics & Catalysis (AREA)
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- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| US11/153,206 | 2005-06-15 | ||
| US11/153,206 US7547849B2 (en) | 2005-06-15 | 2005-06-15 | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
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| JP2006348298A JP2006348298A (ja) | 2006-12-28 |
| JP2006348298A5 JP2006348298A5 (https=) | 2009-07-30 |
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| EP (2) | EP1734071A1 (https=) |
| JP (1) | JP5144037B2 (https=) |
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| US8323802B2 (en) | 2004-10-20 | 2012-12-04 | E I Du Pont De Nemours And Company | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
| US7547849B2 (en) | 2005-06-15 | 2009-06-16 | E.I. Du Pont De Nemours And Company | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| US7504150B2 (en) * | 2005-06-15 | 2009-03-17 | E.I. Du Pont De Nemours & Company | Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto |
| KR20080080674A (ko) * | 2005-12-30 | 2008-09-04 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자회로형 용도를 위한 기판 |
| DE102006047735A1 (de) * | 2006-10-06 | 2008-04-10 | Tesa Ag | Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
| JP5292398B2 (ja) * | 2007-07-09 | 2013-09-18 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 電子回路構造を製造するための組成物および方法 |
| US8475924B2 (en) | 2007-07-09 | 2013-07-02 | E.I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| US20090017309A1 (en) | 2007-07-09 | 2009-01-15 | E. I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| EP2178976B2 (en) | 2007-08-17 | 2021-11-17 | Mitsubishi Chemical Europe GmbH | Aromatic polycarbonate composition |
| CN101409976B (zh) * | 2007-10-12 | 2011-04-06 | 比亚迪股份有限公司 | 多层柔性线路板 |
| KR100910766B1 (ko) | 2007-11-13 | 2009-08-04 | 삼성정밀화학 주식회사 | 최적화된 수지 함침율을 갖는 프리프레그, 및 상기프리프레그를 채용한 금속박 적층판과 프린트 배선판 |
| US8309640B2 (en) * | 2008-05-23 | 2012-11-13 | Sabic Innovative Plastics Ip B.V. | High dielectric constant laser direct structuring materials |
| US8492464B2 (en) * | 2008-05-23 | 2013-07-23 | Sabic Innovative Plastics Ip B.V. | Flame retardant laser direct structuring materials |
| US10119021B2 (en) * | 2008-05-23 | 2018-11-06 | Sabic Global Technologies B.V. | Flame retardant laser direct structuring materials |
| TWI366421B (en) * | 2008-08-22 | 2012-06-11 | Nanya Plastics Corp | High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards |
| US8512596B2 (en) | 2008-12-08 | 2013-08-20 | Samsung Electronics Co., Ltd. | Composition for producing a board and printed circuit board using the same |
| US8580879B2 (en) | 2009-01-06 | 2013-11-12 | Nan Ya Plastics Corporation | Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof |
| US20100181284A1 (en) * | 2009-01-19 | 2010-07-22 | E. I. Du Pont De Nemours And Company | Method of obtaining electronic circuitry features |
| US20100193950A1 (en) * | 2009-01-30 | 2010-08-05 | E.I.Du Pont De Nemours And Company | Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto |
| EP2233519B1 (de) * | 2009-03-27 | 2011-08-31 | LANXESS Deutschland GmbH | Glühdrahtbeständige Polyester |
| FR2944982B1 (fr) * | 2009-04-30 | 2011-10-14 | Commissariat Energie Atomique | Procede de preparation d'un substrat metallise,ledit substrat et ses utilisations |
| DE102009042036B4 (de) * | 2009-09-17 | 2016-09-01 | Institut für Bioprozess- und Analysenmesstechnik e.V. | Verwendung einer lichthärtenden, biokompatiblen und biologisch abbaubaren Polymermischung |
| US20110095417A1 (en) * | 2009-10-28 | 2011-04-28 | Fairchild Semiconductor Corporation | Leadless semiconductor device terminal |
| US20110095410A1 (en) * | 2009-10-28 | 2011-04-28 | Fairchild Semiconductor Corporation | Wafer level semiconductor device connector |
| TWI412564B (zh) * | 2009-12-07 | 2013-10-21 | Ind Tech Res Inst | 介電材料配方及電路基板 |
| KR101313151B1 (ko) * | 2009-12-17 | 2013-09-30 | 비와이디 컴퍼니 리미티드 | 표면 금속화 방법, 플라스틱 제품 제조 방법 및 이로부터 제조된 플라스틱 제품 |
| CN102978593B (zh) * | 2009-12-17 | 2015-07-22 | 比亚迪股份有限公司 | 塑料表面选择性金属化的方法 |
| CN102071421B (zh) * | 2010-01-15 | 2012-01-04 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
| US9435035B2 (en) | 2010-01-15 | 2016-09-06 | Byd Company Limited | Metalized plastic articles and methods thereof |
| CN102071424B (zh) * | 2010-02-26 | 2012-05-09 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
| CN102071411B (zh) | 2010-08-19 | 2012-05-30 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
| US8309210B1 (en) * | 2010-09-13 | 2012-11-13 | Rockell Collins, Inc. | Printed wiring board pad cratering inhibitor |
| WO2012128219A1 (ja) * | 2011-03-18 | 2012-09-27 | ミツビシ ケミカル ヨーロッパ ゲーエムベーハー | 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法 |
| DE102011007537A1 (de) * | 2011-04-15 | 2012-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | In einem Kunststoffkörper eingebettetes Funktionselement und Verfahren zur elektrischen Kontaktierung eines in einem Kunststoffkörper eingebetteten Funktionselements |
| US8528203B2 (en) * | 2011-06-07 | 2013-09-10 | International Business Machines Corporation | Providing selective via plating using laser resin activation |
| CN102950836A (zh) * | 2011-08-29 | 2013-03-06 | 深圳富泰宏精密工业有限公司 | 塑料制品及其制造方法 |
| KR20140091029A (ko) | 2011-10-31 | 2014-07-18 | 티코나 엘엘씨 | 레이저 직접 구조체 기판의 형성에 사용하기 위한 열가소성 조성물 |
| FR2984542B1 (fr) * | 2011-12-19 | 2014-09-19 | Affiliated Computer Services Solutions France | Protection pour dalle tactile |
| CN103540151B (zh) * | 2012-07-13 | 2016-05-25 | 金发科技股份有限公司 | 用于沉积金属薄膜的改性树脂组合物、其制备方法以及其应用 |
| WO2014008669A1 (zh) * | 2012-07-13 | 2014-01-16 | 金发科技股份有限公司 | 用于沉积金属薄膜的改性树脂组合物、其制备方法以及其应用 |
| EP2706092B1 (de) * | 2012-08-28 | 2014-12-24 | Ems-Patent Ag | Polyamidformmasse und deren Verwendung |
| US20140142571A1 (en) * | 2012-11-21 | 2014-05-22 | Ticona Llc | Liquid Crystalline Polymer Composition for Melt-Extruded Substrates |
| DE102013100016A1 (de) * | 2013-01-02 | 2014-07-03 | Lpkf Laser & Electronics Ag | Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial |
| KR102058072B1 (ko) | 2013-06-21 | 2019-12-20 | 사빅 글로벌 테크놀러지스 비.브이. | 난연성 레이저 직접 구조화 물질 |
| TWI501713B (zh) * | 2013-08-26 | 2015-09-21 | Unimicron Technology Corp | 軟硬板模組以及軟硬板模組的製造方法 |
| JP6489795B2 (ja) * | 2013-12-17 | 2019-03-27 | 三菱エンジニアリングプラスチックス株式会社 | 繊維強化樹脂材料、樹脂成形品、メッキ層付樹脂成形品、メッキ層付樹脂成形品の製造方法、および繊維強化樹脂材料の製造方法 |
| WO2015094805A1 (en) * | 2013-12-19 | 2015-06-25 | Ticona Llc | Polyarylene sulfide composition for use in forming a laser direct structured substrate |
| JP6488486B2 (ja) | 2014-03-25 | 2019-03-27 | ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． | ポリマー組成物、その物品、及びそれを調製するためのプロセス |
| WO2015160209A1 (ko) * | 2014-04-16 | 2015-10-22 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| CN104130575B (zh) * | 2014-05-28 | 2016-05-18 | 黑龙江科大志茂复合材料有限公司 | 一种具有高尺寸稳定性树脂混合物及其制备方法 |
| WO2016031691A1 (ja) * | 2014-08-29 | 2016-03-03 | 株式会社村田製作所 | 多層回路基板の製造方法および多層回路基板 |
| JP6405818B2 (ja) * | 2014-09-16 | 2018-10-17 | 株式会社村田製作所 | 電子回路基板用フィルムおよび電子回路基板 |
| JP6405817B2 (ja) * | 2014-09-16 | 2018-10-17 | 株式会社村田製作所 | 電子回路基板用積層体および電子回路基板 |
| TWI563886B (en) | 2015-10-28 | 2016-12-21 | Ind Tech Res Inst | Insulating colloidal material and multilayer circuit structure |
| JP6441874B2 (ja) * | 2015-12-24 | 2018-12-19 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法 |
| CN109641984B (zh) * | 2016-08-31 | 2024-09-06 | 日本化药株式会社 | 顺丁烯二酰亚胺树脂成形体、顺丁烯二酰亚胺树脂成形体的制造方法、顺丁烯二酰亚胺树脂组成物及其固化物 |
| JP6482511B2 (ja) * | 2016-08-31 | 2019-03-13 | 日本化薬株式会社 | マレイミド樹脂成型体、マレイミド樹脂成型体の製造方法、マレイミド樹脂組成物及びその硬化物 |
| JP6926423B2 (ja) * | 2016-09-21 | 2021-08-25 | Dic株式会社 | 硬化性樹脂組成物、熱伝導性接着剤、熱伝導性接着シート及び積層体 |
| EP3543291A1 (en) | 2018-03-21 | 2019-09-25 | SABIC Global Technologies B.V. | Laser platable thermoplastic compositions with good flame retardancy, high heat property and good ductility and shaped articles made therefrom |
| CN109504327A (zh) * | 2018-11-13 | 2019-03-22 | 烟台德邦科技有限公司 | 一种高Tg高可靠性的环氧树脂封装导电胶及其制备方法 |
| US12441879B2 (en) | 2019-08-21 | 2025-10-14 | Ticona Llc | Polymer composition for laser direct structuring |
| US11258184B2 (en) | 2019-08-21 | 2022-02-22 | Ticona Llc | Antenna system including a polymer composition having a low dissipation factor |
| US11637365B2 (en) | 2019-08-21 | 2023-04-25 | Ticona Llc | Polymer composition for use in an antenna system |
| US12209164B2 (en) | 2019-09-10 | 2025-01-28 | Ticona Llc | Polymer composition and film for use in 5G applications |
| US11912817B2 (en) | 2019-09-10 | 2024-02-27 | Ticona Llc | Polymer composition for laser direct structuring |
| US11555113B2 (en) | 2019-09-10 | 2023-01-17 | Ticona Llc | Liquid crystalline polymer composition |
| US12294185B2 (en) | 2019-09-10 | 2025-05-06 | Ticona Llc | Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor |
| US12142820B2 (en) | 2019-09-10 | 2024-11-12 | Ticona Llc | 5G system containing a polymer composition |
| US11917753B2 (en) | 2019-09-23 | 2024-02-27 | Ticona Llc | Circuit board for use at 5G frequencies |
| US11646760B2 (en) | 2019-09-23 | 2023-05-09 | Ticona Llc | RF filter for use at 5G frequencies |
| US11721888B2 (en) | 2019-11-11 | 2023-08-08 | Ticona Llc | Antenna cover including a polymer composition having a low dielectric constant and dissipation factor |
| TWI881041B (zh) | 2020-02-07 | 2025-04-21 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板、及印刷配線板 |
| KR20220145385A (ko) | 2020-02-26 | 2022-10-28 | 티코나 엘엘씨 | 회로 구조체 |
| CN111974318B (zh) * | 2020-07-31 | 2022-03-22 | 哈尔滨师范大学 | 一种复合缺陷型金属有机框架凝胶质子传导材料及其制备方法 |
| US11728559B2 (en) | 2021-02-18 | 2023-08-15 | Ticona Llc | Polymer composition for use in an antenna system |
| CN113844129A (zh) * | 2021-09-13 | 2021-12-28 | 山东金宝电子股份有限公司 | 一种无卤、低介电损耗、高耐热覆铜板的制备方法 |
Family Cites Families (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2833686A (en) * | 1955-06-20 | 1958-05-06 | Du Pont | Bonding polytetrafluoroethylene resins |
| BE560454A (https=) * | 1957-03-29 | |||
| US3056881A (en) * | 1961-06-07 | 1962-10-02 | United Aircraft Corp | Method of making electrical conductor device |
| US3991013A (en) * | 1974-05-10 | 1976-11-09 | E. I. Du Pont De Nemours And Company | Copolyesters of derivatives of hydroquinone |
| US3991014A (en) * | 1974-05-10 | 1976-11-09 | E. I. Du Pont De Nemours And Company | Polyesters of derivatives of hydroquinone and bis(carboxyphenyl)ether |
| PH15509A (en) * | 1974-05-10 | 1983-02-03 | Du Pont | Improvements in an relating to synthetic polyesters |
| US4048148A (en) * | 1975-05-09 | 1977-09-13 | E. I. Du Pont De Nemours And Company | Polyazomethine fibers and films |
| US4075262A (en) * | 1975-08-12 | 1978-02-21 | E. I. Du Pont De Nemours And Company | Copolyesters capable of forming an anisotropic melt |
| US4011199A (en) * | 1975-11-28 | 1977-03-08 | Eastman Kodak Company | Acidolysis process |
| US4122070A (en) * | 1976-03-19 | 1978-10-24 | E. I. Du Pont De Nemours And Company | Fibers and anisotropic melts of polyazomethines |
| US4083829A (en) * | 1976-05-13 | 1978-04-11 | Celanese Corporation | Melt processable thermotropic wholly aromatic polyester |
| FR2356697A1 (fr) * | 1976-06-30 | 1978-01-27 | Sumitomo Chemical Co | Composition de resine de polyester renfermant un polycarbonate et un polyester aromatique |
| US4159365A (en) * | 1976-11-19 | 1979-06-26 | E. I. Du Pont De Nemours And Company | Polyphenyl-1,4-phenylene terephthalates and fibers therefrom |
| US4169933A (en) * | 1977-08-08 | 1979-10-02 | Eastman Kodak Company | Liquid crystal copolyesters containing terephthalic acid and 2,6-naphthalenedicarboxylic acid |
| US4130545A (en) * | 1977-09-12 | 1978-12-19 | Celanese Corporation | Melt processable thermotropic wholly aromatic polyester comprising both para-oxybenzoyl and meta-oxybenzoyl moieties |
| US4184996A (en) * | 1977-09-12 | 1980-01-22 | Celanese Corporation | Melt processable thermotropic wholly aromatic polyester |
| US4161470A (en) * | 1977-10-20 | 1979-07-17 | Celanese Corporation | Polyester of 6-hydroxy-2-naphthoic acid and para-hydroxy benzoic acid capable of readily undergoing melt processing |
| US4159414A (en) * | 1978-04-25 | 1979-06-26 | Massachusetts Institute Of Technology | Method for forming electrically conductive paths |
| US4242496A (en) * | 1978-12-21 | 1980-12-30 | Eastman Kodak Company | Liquid crystal copolyesters containing phenylhydroquinone |
| US4153779A (en) * | 1978-06-26 | 1979-05-08 | Eastman Kodak Company | Liquid crystal copolyester containing a substituted phenylhydroquinone |
| IT1172891B (it) * | 1978-07-04 | 1987-06-18 | Fiat Spa | Procedimento per rivestire con materiale antiusura una superficie metallica |
| DE2966721D1 (en) * | 1978-07-24 | 1984-04-05 | Ici Plc | Thermotropic polyesteramides |
| US4245082A (en) * | 1979-07-09 | 1981-01-13 | E. I. Du Pont De Nemours And Company | Polyesters derived from 3,4'-dihydroxy-benzophenones or 3-hydroxy-4'-(4-hydroxyphenyl-)benzophenone and certain aromatic dicarboxylic acids and filaments thereof |
| US4310596A (en) * | 1978-09-25 | 1982-01-12 | E. I. Du Pont De Nemours And Company | Solar selective surfaces |
| US4181538A (en) * | 1978-09-26 | 1980-01-01 | The United States Of America As Represented By The United States Department Of Energy | Method for making defect-free zone by laser-annealing of doped silicon |
| US4219461A (en) * | 1979-04-23 | 1980-08-26 | Celanese Corporation | Polyester of 6-hydroxy-2-naphthoic acid, para-hydroxy benzoic acid, aromatic diol, and aromatic diacid capable of readily undergoing melt processing |
| US4286250A (en) * | 1979-05-04 | 1981-08-25 | New England Instrument Company | Laser formed resistor elements |
| US4256624A (en) * | 1979-07-02 | 1981-03-17 | Celanese Corporation | Polyester of 6-hydroxy-2-naphthoic acid, aromatic diol, and aromatic diacid capable of undergoing melt processing |
| US4338506A (en) * | 1979-09-07 | 1982-07-06 | Motorola, Inc. | Method of trimming thick film capacitor |
| US4232143A (en) * | 1979-09-17 | 1980-11-04 | E. I. Du Pont De Nemours And Company | Polyester which exhibits anisotropy in the melt containing p-oxybenzoyl units and 4,4'-dioxybenzophenone units or methyl and chloro derivatives thereof |
| US4269965A (en) * | 1979-09-17 | 1981-05-26 | E. I. Du Pont De Nemours And Company | Aromatic polyester which forms optically anisotropic melts and filaments thereof |
| US4232144A (en) * | 1979-09-17 | 1980-11-04 | E. I. Du Pont De Nemours And Company | Polyester which exhibits anisotropy in the melt containing p-oxybenzoyl units and 4-oxy-3'-carbonylbenzophenone units or methyl and chloro derivatives of said units |
| US4238600A (en) * | 1979-11-19 | 1980-12-09 | Eastman Kodak Company | Copolyesters derived from terephthalic acid, phenylhydroquinone and t-butylhydroquinone |
| JPS5812392A (ja) | 1981-07-15 | 1983-01-24 | 株式会社日立製作所 | 平坦化配線 |
| US4370466A (en) * | 1981-09-28 | 1983-01-25 | E. I. Du Pont De Nemours And Company | Optically anisotropic melt forming polyesters |
| US4383105A (en) * | 1981-12-28 | 1983-05-10 | E. I. Du Pont De Nemours And Company | Polyimide-esters and filaments |
| JPS58139405A (ja) * | 1982-02-15 | 1983-08-18 | アルプス電気株式会社 | 抵抗素子の製造方法 |
| US4522974A (en) * | 1982-07-26 | 1985-06-11 | Celanese Corporation | Melt processable polyester capable of forming an anisotropic melt comprising a relatively low concentration of 6-oxy-2-naphthoyl moiety-4-benzoyl moiety, 1,4-dioxyphenylene moiety, isophthaloyl moiety and terephthaloyl moiety |
| JPS5943021A (ja) * | 1982-09-02 | 1984-03-09 | Ueno Seiyaku Oyo Kenkyusho:Kk | 芳香族（コ）ポリエステルの製法 |
| US4447592A (en) * | 1983-06-13 | 1984-05-08 | E. I. Du Pont De Nemours And Company | Anisotropic melt polyesters of 6-hydroxy-2-naphthoic acid |
| JPS60167491A (ja) * | 1984-02-10 | 1985-08-30 | 株式会社東芝 | 導体路形成方法 |
| US4617369A (en) * | 1985-09-04 | 1986-10-14 | E. I. Du Pont De Nemours And Company | Polyester polymers of 3-hydroxy-4'-(4-hydroxyphenyl)benzophenone or 3,4'-dihydroxybenzophenone and dicarboxylic acids |
| DE3542798A1 (de) * | 1985-12-04 | 1987-06-11 | Basf Ag | Vollaromatische mesomorphe polyesteramidimide, deren herstellung und verwendung |
| DE3542814A1 (de) * | 1985-12-04 | 1987-06-11 | Basf Ag | Vollaromatische mesomorphe polyester, deren herstellung sowie verwendung |
| DE3542797A1 (de) * | 1985-12-04 | 1987-06-11 | Basf Ag | Vollaromatische mesomorphe polyesterimide, deren herstellung sowie verwendung |
| DE3542777A1 (de) * | 1985-12-04 | 1987-06-11 | Basf Ag | Vollaromatische polyestercarbamide, deren herstellung und verwendung |
| DE3542855A1 (de) * | 1985-12-04 | 1987-06-11 | Basf Ag | Vollaromatische mesomorphe polyesteramide, deren herstellung und verwendung |
| DE3542779A1 (de) * | 1985-12-04 | 1987-06-11 | Basf Ag | Vollaromatische mesomorphe polyesteramide, deren herstellung und verwendung |
| US4664972A (en) * | 1986-04-23 | 1987-05-12 | E. I. Du Pont De Nemours And Company | Optically anisotropic melt forming aromatic copolyesters based on t-butylhydroquinone |
| DE3621519A1 (de) * | 1986-06-27 | 1988-01-07 | Basf Ag | Vollaromatische mesomorphe polyester, deren herstellung sowie verwendung |
| EP0256778A3 (en) | 1986-08-08 | 1989-03-08 | Ronald Krajewski | Multi-layer printed circuit structure |
| JPH0717748B2 (ja) * | 1986-12-19 | 1995-03-01 | 川崎製鉄株式会社 | 芳香族ポリエステルアミド |
| EP0272676A3 (en) * | 1986-12-23 | 1989-03-29 | Mitsubishi Chemical Corporation | Wholly aromatic polyester and process for its production |
| GB8700923D0 (en) * | 1987-01-16 | 1987-02-18 | Ici Plc | Aromatic copolyesters |
| ATE86266T1 (de) * | 1987-10-05 | 1993-03-15 | Polyplastics Co | Harz mit ausgezeichneter waermebestaendigkeit und anisotropischen eigenschaften in der schmelze. |
| IT1223401B (it) * | 1987-12-02 | 1990-09-19 | Montedison Spa | Poliesteri aromatici liquido cristallini termotropici |
| DE3742205A1 (de) * | 1987-12-12 | 1989-06-22 | Huels Chemische Werke Ag | Formmassen bestehend aus einem thermotropen, aromatischen polyester |
| IT1215682B (it) * | 1988-01-12 | 1990-02-22 | Montedison Spa | Poliesteri aromatici liquido cristallini termotropici. |
| DE3802511A1 (de) * | 1988-01-28 | 1989-08-10 | Huels Chemische Werke Ag | Formmassen bestehend aus einem thermoplastisch verarbeitbaren, aromatischen polyesterimid |
| US4849499A (en) * | 1988-08-01 | 1989-07-18 | Eastman Kodak Company | Melt processable, liquid crystalline polyesters |
| US5025082A (en) | 1988-08-24 | 1991-06-18 | Mitsubishi Kasei Corporation | Aromatic polyester, aromatic polyester-amide and processes for producing the same |
| DE3914048A1 (de) * | 1988-09-13 | 1990-03-22 | Bayer Ag | Leichtfliessende polyamid-formmassen und -legierungen |
| JPH02196819A (ja) * | 1989-01-25 | 1990-08-03 | Nippon Oil Co Ltd | 全芳香族ポリエステル |
| JP3086231B2 (ja) * | 1989-11-01 | 2000-09-11 | ポリプラスチックス株式会社 | 溶融時に異方性を示すポリエステル樹脂及び樹脂組成物 |
| DE4006404A1 (de) * | 1990-03-01 | 1991-09-05 | Bayer Ag | Leichtfliessende polyamid-formmassen |
| US5015722A (en) * | 1990-04-04 | 1991-05-14 | Hoechst Celanese Corporation | Melt-processable polyester capable of forming an anisotropic melt which exhibits a highly attractive balance between its molding and heat deflection temperatures |
| US5110896A (en) * | 1990-12-10 | 1992-05-05 | E. I. Du Pont De Nemours And Company | Thermotropic liquid crystalline polyester compositions |
| US5162977A (en) * | 1991-08-27 | 1992-11-10 | Storage Technology Corporation | Printed circuit board having an integrated decoupling capacitive element |
| JP2956370B2 (ja) | 1992-08-17 | 1999-10-04 | 日立化成工業株式会社 | 銅張積層板及びその製造方法 |
| US5721150A (en) * | 1993-10-25 | 1998-02-24 | Lsi Logic Corporation | Use of silicon for integrated circuit device interconnection by direct writing of patterns therein |
| US5883000A (en) * | 1995-05-03 | 1999-03-16 | Lsi Logic Corporation | Circuit device interconnection by direct writing of patterns therein |
| DE19723734C2 (de) * | 1997-06-06 | 2002-02-07 | Gerhard Naundorf | Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung |
| EP0902048B1 (en) * | 1997-09-11 | 2005-11-23 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible polyimide film and process of preparation |
| US6417486B1 (en) * | 1999-04-12 | 2002-07-09 | Ticona Gmbh | Production of conductor tracks on plastics by means of laser energy |
| US6657849B1 (en) * | 2000-08-24 | 2003-12-02 | Oak-Mitsui, Inc. | Formation of an embedded capacitor plane using a thin dielectric |
| SG98017A1 (en) * | 2000-12-19 | 2003-08-20 | Inst Materials Research & Eng | Method of forming selective electronics plating on polymer surfaces |
| DE10132092A1 (de) * | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
| GB0212632D0 (en) | 2002-05-31 | 2002-07-10 | Shipley Co Llc | Laser-activated dielectric material and method for using the same in an electroless deposition process |
| DE10344511A1 (de) * | 2003-09-24 | 2005-04-28 | Mitsubishi Polyester Film Gmbh | Orientierte, mittels elektromagnetischer Strahlung strukturierbare und mit Aminosilan beschichtete Folie aus thermoplastischem Polyester zur Herstellung selektiv metallisierter Folien |
| DE10344513A1 (de) * | 2003-09-24 | 2005-04-28 | Mitsubishi Polyester Film Gmbh | Mehrschichtige, orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester zur Herstellung selektiv metallisierter Folien |
| US7285321B2 (en) | 2003-11-12 | 2007-10-23 | E.I. Du Pont De Nemours And Company | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto |
| DE102004003890A1 (de) | 2004-01-27 | 2005-08-11 | Mitsubishi Polyester Film Gmbh | Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung |
| DE102004003891A1 (de) | 2004-01-27 | 2005-08-11 | Mitsubishi Polyester Film Gmbh | Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung |
| US20060083939A1 (en) * | 2004-10-20 | 2006-04-20 | Dunbar Meredith L | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
| US7504150B2 (en) * | 2005-06-15 | 2009-03-17 | E.I. Du Pont De Nemours & Company | Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto |
| US7547849B2 (en) | 2005-06-15 | 2009-06-16 | E.I. Du Pont De Nemours And Company | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| US20090017309A1 (en) * | 2007-07-09 | 2009-01-15 | E. I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
-
2005
- 2005-06-15 US US11/153,206 patent/US7547849B2/en not_active Expired - Fee Related
-
2006
- 2006-05-22 EP EP20060010493 patent/EP1734071A1/en not_active Withdrawn
- 2006-05-22 EP EP20090008443 patent/EP2098562A1/en not_active Withdrawn
- 2006-06-15 JP JP2006166500A patent/JP5144037B2/ja not_active Expired - Fee Related
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2007
- 2007-08-09 US US11/891,129 patent/US7531204B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1734071A1 (en) | 2006-12-20 |
| EP2098562A1 (en) | 2009-09-09 |
| JP2006348298A (ja) | 2006-12-28 |
| US7531204B2 (en) | 2009-05-12 |
| US20080015320A1 (en) | 2008-01-17 |
| US7547849B2 (en) | 2009-06-16 |
| US20060286365A1 (en) | 2006-12-21 |
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