JP2006124701A5 - - Google Patents
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- Publication number
- JP2006124701A5 JP2006124701A5 JP2005305981A JP2005305981A JP2006124701A5 JP 2006124701 A5 JP2006124701 A5 JP 2006124701A5 JP 2005305981 A JP2005305981 A JP 2005305981A JP 2005305981 A JP2005305981 A JP 2005305981A JP 2006124701 A5 JP2006124701 A5 JP 2006124701A5
- Authority
- JP
- Japan
- Prior art keywords
- composite
- polyimide
- coating
- film
- plateable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 claims description 54
- 239000002131 composite material Substances 0.000 claims description 51
- 239000004642 Polyimide Substances 0.000 claims description 50
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 15
- 229910052596 spinel Inorganic materials 0.000 claims description 15
- 239000011029 spinel Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 230000008033 biological extinction Effects 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 150000001768 cations Chemical class 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 239000003607 modifier Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229920005575 poly(amic acid) Polymers 0.000 claims description 4
- 229920002959 polymer blend Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- 235000019739 Dicalciumphosphate Nutrition 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000001506 calcium phosphate Substances 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims description 2
- NEFBYIFKOOEVPA-UHFFFAOYSA-K dicalcium phosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])([O-])=O NEFBYIFKOOEVPA-UHFFFAOYSA-K 0.000 claims description 2
- 229940038472 dicalcium phosphate Drugs 0.000 claims description 2
- 229910000390 dicalcium phosphate Inorganic materials 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000012760 heat stabilizer Substances 0.000 claims description 2
- 239000004611 light stabiliser Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000012744 reinforcing agent Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 claims 1
- 230000002186 photoactivation Effects 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000010408 film Substances 0.000 description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/969,430 | 2004-10-20 | ||
| US10/969,430 US20060083939A1 (en) | 2004-10-20 | 2004-10-20 | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006124701A JP2006124701A (ja) | 2006-05-18 |
| JP2006124701A5 true JP2006124701A5 (https=) | 2008-12-04 |
| JP4996841B2 JP4996841B2 (ja) | 2012-08-08 |
Family
ID=35311940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005305981A Expired - Fee Related JP4996841B2 (ja) | 2004-10-20 | 2005-10-20 | 選択的メタライゼーションを受容するための、光活性化可能なポリイミド組成物ならびにそれに関する方法および組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060083939A1 (https=) |
| EP (1) | EP1650249A1 (https=) |
| JP (1) | JP4996841B2 (https=) |
| KR (1) | KR101233609B1 (https=) |
| CN (1) | CN1769348B (https=) |
| TW (1) | TWI312352B (https=) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8323802B2 (en) | 2004-10-20 | 2012-12-04 | E I Du Pont De Nemours And Company | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
| US7504150B2 (en) * | 2005-06-15 | 2009-03-17 | E.I. Du Pont De Nemours & Company | Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto |
| US7547849B2 (en) * | 2005-06-15 | 2009-06-16 | E.I. Du Pont De Nemours And Company | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| KR20080080674A (ko) * | 2005-12-30 | 2008-09-04 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자회로형 용도를 위한 기판 |
| KR100840514B1 (ko) * | 2006-10-10 | 2008-06-23 | 주식회사 이엠따블유안테나 | 안테나 모듈, 이의 형성방법 및 이를 포함하는 무선 통신단말기 |
| US20080182115A1 (en) * | 2006-12-07 | 2008-07-31 | Briney Gary C | Multi-functional circuitry substrates and compositions and methods relating thereto |
| US20090017309A1 (en) * | 2007-07-09 | 2009-01-15 | E. I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| JP5292398B2 (ja) * | 2007-07-09 | 2013-09-18 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 電子回路構造を製造するための組成物および方法 |
| US8475924B2 (en) | 2007-07-09 | 2013-07-02 | E.I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| DE102007046026A1 (de) * | 2007-09-26 | 2009-04-02 | Rohde & Schwarz Sit Gmbh | Schutzanordnung und Herstellungsverfahren für eine Schutzanordnung |
| US8309640B2 (en) | 2008-05-23 | 2012-11-13 | Sabic Innovative Plastics Ip B.V. | High dielectric constant laser direct structuring materials |
| US20100193950A1 (en) * | 2009-01-30 | 2010-08-05 | E.I.Du Pont De Nemours And Company | Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto |
| US20110287243A1 (en) * | 2009-03-06 | 2011-11-24 | E.I. Du Pont De Nemours And Company | Multilayer film for electronic circuitry applications and methods relating thereto |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| KR20120096003A (ko) * | 2009-11-20 | 2012-08-29 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 반도체 패키징 응용에 유용한 인터포저 필름, 및 그 관련 방법 |
| KR101313151B1 (ko) * | 2009-12-17 | 2013-09-30 | 비와이디 컴퍼니 리미티드 | 표면 금속화 방법, 플라스틱 제품 제조 방법 및 이로부터 제조된 플라스틱 제품 |
| CN102978593B (zh) * | 2009-12-17 | 2015-07-22 | 比亚迪股份有限公司 | 塑料表面选择性金属化的方法 |
| US9435035B2 (en) | 2010-01-15 | 2016-09-06 | Byd Company Limited | Metalized plastic articles and methods thereof |
| CN102071421B (zh) * | 2010-01-15 | 2012-01-04 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
| US8974869B2 (en) * | 2010-01-26 | 2015-03-10 | Robert Hamilton | Method for improving plating on non-conductive substrates |
| CN102071424B (zh) * | 2010-02-26 | 2012-05-09 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
| CN102071411B (zh) | 2010-08-19 | 2012-05-30 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
| EP3046401A1 (en) * | 2010-10-26 | 2016-07-20 | SABIC Global Technologies B.V. | Laser direct structuring materials with all color capability |
| CN103154135B (zh) * | 2011-03-18 | 2014-10-15 | 三菱化学欧洲合资公司 | 生产电路载体的方法 |
| WO2012128219A1 (ja) * | 2011-03-18 | 2012-09-27 | ミツビシ ケミカル ヨーロッパ ゲーエムベーハー | 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法 |
| JP5930549B2 (ja) * | 2011-06-09 | 2016-06-08 | 住友精化株式会社 | 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池 |
| TW201302858A (zh) | 2011-06-24 | 2013-01-16 | Du Pont | 有色聚醯亞胺膜及與其有關之方法 |
| CN103597037B (zh) * | 2012-03-23 | 2015-08-19 | 三菱工程塑料株式会社 | 热塑性树脂组合物、树脂成型品和带镀层的树脂成型品的制造方法 |
| WO2014008669A1 (zh) * | 2012-07-13 | 2014-01-16 | 金发科技股份有限公司 | 用于沉积金属薄膜的改性树脂组合物、其制备方法以及其应用 |
| WO2014042069A1 (ja) * | 2012-09-14 | 2014-03-20 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法 |
| JP2014058604A (ja) * | 2012-09-14 | 2014-04-03 | Mitsubishi Engineering Plastics Corp | 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法 |
| JP5579908B2 (ja) * | 2012-09-14 | 2014-08-27 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法 |
| CN104583330B (zh) * | 2012-09-14 | 2016-09-21 | 三菱工程塑料株式会社 | 热塑性树脂组合物、树脂成型品和带镀层的树脂成型品的制造方法 |
| US10148006B2 (en) | 2012-09-14 | 2018-12-04 | Mitsubishi Engineering-Plastics Corporation | Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer |
| JP5579909B2 (ja) * | 2012-09-14 | 2014-08-27 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法 |
| KR101574736B1 (ko) * | 2013-04-26 | 2015-12-07 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| KR101823660B1 (ko) | 2013-08-09 | 2018-01-30 | 주식회사 엘지화학 | 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| TWI501713B (zh) * | 2013-08-26 | 2015-09-21 | Unimicron Technology Corp | 軟硬板模組以及軟硬板模組的製造方法 |
| KR101717753B1 (ko) * | 2013-11-29 | 2017-03-17 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| CN104744696B (zh) * | 2013-12-30 | 2017-09-29 | 比亚迪股份有限公司 | 聚酰亚胺膜和柔性电路板及其制备方法 |
| EP3108033B1 (en) * | 2014-01-27 | 2019-10-16 | BYD Company Limited | Method for metalizing polymer substrate |
| KR101770350B1 (ko) * | 2014-08-29 | 2017-08-22 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| WO2016031691A1 (ja) * | 2014-08-29 | 2016-03-03 | 株式会社村田製作所 | 多層回路基板の製造方法および多層回路基板 |
| KR101737566B1 (ko) * | 2014-09-11 | 2017-05-18 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| US9590292B2 (en) | 2014-12-08 | 2017-03-07 | Industrial Technology Research Institute | Beam antenna |
| JP6441874B2 (ja) * | 2015-12-24 | 2018-12-19 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法 |
| LT6517B (lt) * | 2016-09-13 | 2018-04-25 | Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras | Selektyvus polimerinio gaminio paviršiaus metalizavimo būdas |
| JP7188309B2 (ja) * | 2019-07-26 | 2022-12-13 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物及び半導体装置 |
| CN111818674B (zh) * | 2020-07-07 | 2021-06-04 | 安徽宇航派蒙健康科技股份有限公司 | 一种基于lig法制备石墨烯高温电热膜的方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4159414A (en) * | 1978-04-25 | 1979-06-26 | Massachusetts Institute Of Technology | Method for forming electrically conductive paths |
| JPS60167491A (ja) * | 1984-02-10 | 1985-08-30 | 株式会社東芝 | 導体路形成方法 |
| JPS6178873A (ja) * | 1984-09-25 | 1986-04-22 | Tdk Corp | 電磁シ−ルド材およびその製造方法 |
| EP0256778A3 (en) * | 1986-08-08 | 1989-03-08 | Ronald Krajewski | Multi-layer printed circuit structure |
| TW477905B (en) * | 1995-06-14 | 2002-03-01 | Hitachi Ltd | Liquid crystal display device formed of high resistance black matrix with wide view angle |
| US5780201A (en) * | 1996-09-27 | 1998-07-14 | Brewer Science, Inc. | Ultra thin photolithographically imageable organic black matrix coating material |
| DE19723734C2 (de) * | 1997-06-06 | 2002-02-07 | Gerhard Naundorf | Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung |
| DE19731346C2 (de) * | 1997-06-06 | 2003-09-25 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und ein Verfahren zu deren Herstellung |
| EP0902048B1 (en) * | 1997-09-11 | 2005-11-23 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible polyimide film and process of preparation |
| JP3409714B2 (ja) * | 1998-10-20 | 2003-05-26 | 株式会社村田製作所 | チップ状電子部品の製造方法 |
| WO2003005784A2 (de) * | 2001-07-05 | 2003-01-16 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und verfahren zu ihrer herstellung |
| DE10132092A1 (de) * | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
| JP4221290B2 (ja) * | 2001-07-09 | 2009-02-12 | 株式会社カネカ | 樹脂組成物 |
| JP3979159B2 (ja) * | 2002-04-19 | 2007-09-19 | 東レ株式会社 | プリント回路用基板およびそれを用いたプリント回路基板 |
| GB0212632D0 (en) * | 2002-05-31 | 2002-07-10 | Shipley Co Llc | Laser-activated dielectric material and method for using the same in an electroless deposition process |
| US20040185388A1 (en) * | 2003-01-29 | 2004-09-23 | Hiroyuki Hirai | Printed circuit board, method for producing same, and ink therefor |
| DE102004003890A1 (de) * | 2004-01-27 | 2005-08-11 | Mitsubishi Polyester Film Gmbh | Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung |
-
2004
- 2004-10-20 US US10/969,430 patent/US20060083939A1/en not_active Abandoned
-
2005
- 2005-09-26 EP EP20050020895 patent/EP1650249A1/en not_active Withdrawn
- 2005-10-12 TW TW94135529A patent/TWI312352B/zh not_active IP Right Cessation
- 2005-10-19 KR KR1020050098377A patent/KR101233609B1/ko not_active Expired - Fee Related
- 2005-10-20 JP JP2005305981A patent/JP4996841B2/ja not_active Expired - Fee Related
- 2005-10-20 CN CN2005101162038A patent/CN1769348B/zh not_active Expired - Fee Related
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