CN1769348B - 可光活化的聚酰亚胺组合物和相关的方法 - Google Patents

可光活化的聚酰亚胺组合物和相关的方法 Download PDF

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Publication number
CN1769348B
CN1769348B CN2005101162038A CN200510116203A CN1769348B CN 1769348 B CN1769348 B CN 1769348B CN 2005101162038 A CN2005101162038 A CN 2005101162038A CN 200510116203 A CN200510116203 A CN 200510116203A CN 1769348 B CN1769348 B CN 1769348B
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China
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polyimide
film
composite
weight
layer
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Expired - Fee Related
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CN2005101162038A
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Chinese (zh)
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CN1769348A (zh
Inventor
M·L·邓巴
李玥玲
C·B·王
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN2005101162038A 2004-10-20 2005-10-20 可光活化的聚酰亚胺组合物和相关的方法 Expired - Fee Related CN1769348B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/969,430 2004-10-20
US10/969,430 US20060083939A1 (en) 2004-10-20 2004-10-20 Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto

Publications (2)

Publication Number Publication Date
CN1769348A CN1769348A (zh) 2006-05-10
CN1769348B true CN1769348B (zh) 2010-09-29

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Country Status (6)

Country Link
US (1) US20060083939A1 (https=)
EP (1) EP1650249A1 (https=)
JP (1) JP4996841B2 (https=)
KR (1) KR101233609B1 (https=)
CN (1) CN1769348B (https=)
TW (1) TWI312352B (https=)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8323802B2 (en) 2004-10-20 2012-12-04 E I Du Pont De Nemours And Company Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
US7504150B2 (en) * 2005-06-15 2009-03-17 E.I. Du Pont De Nemours & Company Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto
US7547849B2 (en) * 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
KR20080080674A (ko) * 2005-12-30 2008-09-04 이 아이 듀폰 디 네모아 앤드 캄파니 전자회로형 용도를 위한 기판
KR100840514B1 (ko) * 2006-10-10 2008-06-23 주식회사 이엠따블유안테나 안테나 모듈, 이의 형성방법 및 이를 포함하는 무선 통신단말기
US20080182115A1 (en) * 2006-12-07 2008-07-31 Briney Gary C Multi-functional circuitry substrates and compositions and methods relating thereto
US20090017309A1 (en) * 2007-07-09 2009-01-15 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
JP5292398B2 (ja) * 2007-07-09 2013-09-18 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電子回路構造を製造するための組成物および方法
US8475924B2 (en) 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
DE102007046026A1 (de) * 2007-09-26 2009-04-02 Rohde & Schwarz Sit Gmbh Schutzanordnung und Herstellungsverfahren für eine Schutzanordnung
US8309640B2 (en) 2008-05-23 2012-11-13 Sabic Innovative Plastics Ip B.V. High dielectric constant laser direct structuring materials
US20100193950A1 (en) * 2009-01-30 2010-08-05 E.I.Du Pont De Nemours And Company Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto
US20110287243A1 (en) * 2009-03-06 2011-11-24 E.I. Du Pont De Nemours And Company Multilayer film for electronic circuitry applications and methods relating thereto
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
KR20120096003A (ko) * 2009-11-20 2012-08-29 이 아이 듀폰 디 네모아 앤드 캄파니 반도체 패키징 응용에 유용한 인터포저 필름, 및 그 관련 방법
KR101313151B1 (ko) * 2009-12-17 2013-09-30 비와이디 컴퍼니 리미티드 표면 금속화 방법, 플라스틱 제품 제조 방법 및 이로부터 제조된 플라스틱 제품
CN102978593B (zh) * 2009-12-17 2015-07-22 比亚迪股份有限公司 塑料表面选择性金属化的方法
US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
CN102071421B (zh) * 2010-01-15 2012-01-04 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
US8974869B2 (en) * 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates
CN102071424B (zh) * 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
EP3046401A1 (en) * 2010-10-26 2016-07-20 SABIC Global Technologies B.V. Laser direct structuring materials with all color capability
CN103154135B (zh) * 2011-03-18 2014-10-15 三菱化学欧洲合资公司 生产电路载体的方法
WO2012128219A1 (ja) * 2011-03-18 2012-09-27 ミツビシ ケミカル ヨーロッパ ゲーエムベーハー 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP5930549B2 (ja) * 2011-06-09 2016-06-08 住友精化株式会社 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池
TW201302858A (zh) 2011-06-24 2013-01-16 Du Pont 有色聚醯亞胺膜及與其有關之方法
CN103597037B (zh) * 2012-03-23 2015-08-19 三菱工程塑料株式会社 热塑性树脂组合物、树脂成型品和带镀层的树脂成型品的制造方法
WO2014008669A1 (zh) * 2012-07-13 2014-01-16 金发科技股份有限公司 用于沉积金属薄膜的改性树脂组合物、其制备方法以及其应用
WO2014042069A1 (ja) * 2012-09-14 2014-03-20 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP2014058604A (ja) * 2012-09-14 2014-04-03 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP5579908B2 (ja) * 2012-09-14 2014-08-27 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
CN104583330B (zh) * 2012-09-14 2016-09-21 三菱工程塑料株式会社 热塑性树脂组合物、树脂成型品和带镀层的树脂成型品的制造方法
US10148006B2 (en) 2012-09-14 2018-12-04 Mitsubishi Engineering-Plastics Corporation Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer
JP5579909B2 (ja) * 2012-09-14 2014-08-27 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
KR101574736B1 (ko) * 2013-04-26 2015-12-07 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
KR101823660B1 (ko) 2013-08-09 2018-01-30 주식회사 엘지화학 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
TWI501713B (zh) * 2013-08-26 2015-09-21 Unimicron Technology Corp 軟硬板模組以及軟硬板模組的製造方法
KR101717753B1 (ko) * 2013-11-29 2017-03-17 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
CN104744696B (zh) * 2013-12-30 2017-09-29 比亚迪股份有限公司 聚酰亚胺膜和柔性电路板及其制备方法
EP3108033B1 (en) * 2014-01-27 2019-10-16 BYD Company Limited Method for metalizing polymer substrate
KR101770350B1 (ko) * 2014-08-29 2017-08-22 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
WO2016031691A1 (ja) * 2014-08-29 2016-03-03 株式会社村田製作所 多層回路基板の製造方法および多層回路基板
KR101737566B1 (ko) * 2014-09-11 2017-05-18 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
US9590292B2 (en) 2014-12-08 2017-03-07 Industrial Technology Research Institute Beam antenna
JP6441874B2 (ja) * 2015-12-24 2018-12-19 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法
LT6517B (lt) * 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Selektyvus polimerinio gaminio paviršiaus metalizavimo būdas
JP7188309B2 (ja) * 2019-07-26 2022-12-13 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物及び半導体装置
CN111818674B (zh) * 2020-07-07 2021-06-04 安徽宇航派蒙健康科技股份有限公司 一种基于lig法制备石墨烯高温电热膜的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0902048A1 (en) * 1997-09-11 1999-03-17 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation
CN1214129A (zh) * 1996-09-27 1999-04-14 部鲁尔科学公司 超薄有机黑色基质

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159414A (en) * 1978-04-25 1979-06-26 Massachusetts Institute Of Technology Method for forming electrically conductive paths
JPS60167491A (ja) * 1984-02-10 1985-08-30 株式会社東芝 導体路形成方法
JPS6178873A (ja) * 1984-09-25 1986-04-22 Tdk Corp 電磁シ−ルド材およびその製造方法
EP0256778A3 (en) * 1986-08-08 1989-03-08 Ronald Krajewski Multi-layer printed circuit structure
TW477905B (en) * 1995-06-14 2002-03-01 Hitachi Ltd Liquid crystal display device formed of high resistance black matrix with wide view angle
DE19723734C2 (de) * 1997-06-06 2002-02-07 Gerhard Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung
DE19731346C2 (de) * 1997-06-06 2003-09-25 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
JP3409714B2 (ja) * 1998-10-20 2003-05-26 株式会社村田製作所 チップ状電子部品の製造方法
WO2003005784A2 (de) * 2001-07-05 2003-01-16 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und verfahren zu ihrer herstellung
DE10132092A1 (de) * 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
JP4221290B2 (ja) * 2001-07-09 2009-02-12 株式会社カネカ 樹脂組成物
JP3979159B2 (ja) * 2002-04-19 2007-09-19 東レ株式会社 プリント回路用基板およびそれを用いたプリント回路基板
GB0212632D0 (en) * 2002-05-31 2002-07-10 Shipley Co Llc Laser-activated dielectric material and method for using the same in an electroless deposition process
US20040185388A1 (en) * 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
DE102004003890A1 (de) * 2004-01-27 2005-08-11 Mitsubishi Polyester Film Gmbh Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1214129A (zh) * 1996-09-27 1999-04-14 部鲁尔科学公司 超薄有机黑色基质
EP0902048A1 (en) * 1997-09-11 1999-03-17 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation

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CN1769348A (zh) 2006-05-10
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