JP2006278407A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP2006278407A
JP2006278407A JP2005091023A JP2005091023A JP2006278407A JP 2006278407 A JP2006278407 A JP 2006278407A JP 2005091023 A JP2005091023 A JP 2005091023A JP 2005091023 A JP2005091023 A JP 2005091023A JP 2006278407 A JP2006278407 A JP 2006278407A
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Japan
Prior art keywords
wire
capillary
pads
forming
bump electrode
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JP2005091023A
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English (en)
Japanese (ja)
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JP2006278407A5 (enExample
Inventor
Hideyuki Shinkawa
秀之 新川
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Renesas Technology Corp
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Renesas Technology Corp
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Priority to JP2005091023A priority Critical patent/JP2006278407A/ja
Priority to US11/347,231 priority patent/US20060216863A1/en
Publication of JP2006278407A publication Critical patent/JP2006278407A/ja
Publication of JP2006278407A5 publication Critical patent/JP2006278407A5/ja
Pending legal-status Critical Current

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2005091023A 2005-03-28 2005-03-28 半導体装置の製造方法 Pending JP2006278407A (ja)

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JP2007294581A (ja) * 2006-04-24 2007-11-08 Shinkawa Ltd ボンディング装置のテールワイヤ切断方法及びプログラム
US10804238B2 (en) 2017-02-22 2020-10-13 Murata Manufacturing Co., Ltd. Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
WO2022013955A1 (ja) * 2020-07-15 2022-01-20 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法

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US20100320592A1 (en) * 2006-12-29 2010-12-23 Sanyo Electric Co., Ltd. Semiconductor device and method for manufacturing the same
JP2009158750A (ja) * 2007-12-27 2009-07-16 Fujifilm Corp ワイヤボンディング方法及び半導体装置
EP2133915A1 (de) * 2008-06-09 2009-12-16 Micronas GmbH Halbleiteranordnung mit besonders gestalteten Bondleitungen und Verfahren zum Herstellen einer solchen Anordnung
MY152355A (en) * 2011-04-11 2014-09-15 Carsem M Sdn Bhd Short and low loop wire bonding
MY181180A (en) * 2011-09-09 2020-12-21 Carsem M Sdn Bhd Low loop wire bonding
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9087815B2 (en) * 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
US10877231B2 (en) * 2017-02-24 2020-12-29 Reflex Photonics Inc. Wirebonding for side-packaged optical engine
JP7576927B2 (ja) * 2020-04-30 2024-11-01 浜松ホトニクス株式会社 半導体素子及び半導体素子製造方法
CN113871310B (zh) * 2021-09-27 2025-08-26 江西省纳米技术研究院 一种极细金线焊接方法、焊接结构及其应用

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JP2007294581A (ja) * 2006-04-24 2007-11-08 Shinkawa Ltd ボンディング装置のテールワイヤ切断方法及びプログラム
US10804238B2 (en) 2017-02-22 2020-10-13 Murata Manufacturing Co., Ltd. Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
US11417625B2 (en) 2017-02-22 2022-08-16 Murata Manufacturing Co., Ltd. Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
WO2022013955A1 (ja) * 2020-07-15 2022-01-20 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
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KR20220009937A (ko) * 2020-07-15 2022-01-25 가부시키가이샤 신가와 와이어 본딩 장치 및 반도체 장치의 제조 방법
CN114207790A (zh) * 2020-07-15 2022-03-18 株式会社新川 打线接合装置及半导体装置的制造方法
JP7152079B2 (ja) 2020-07-15 2022-10-12 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
KR102488240B1 (ko) 2020-07-15 2023-01-13 가부시키가이샤 신가와 와이어 본딩 장치 및 반도체 장치의 제조 방법
US12107070B2 (en) 2020-07-15 2024-10-01 Shinkawa Ltd. Wire bonding apparatus and method for manufacturing semiconductor device

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