JP7152079B2 - ワイヤボンディング装置及び半導体装置の製造方法 - Google Patents
ワイヤボンディング装置及び半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000002788 crimping Methods 0.000 claims description 43
- 238000010008 shearing Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims 1
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005304 joining Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Description
を含むことを特徴とする。
キャピラリを下降させて切り離したワイヤテールの側面を圧着ボールの上に接合すること、を特徴とする。
Claims (8)
- 第1ボンド点と第2ボンド点との間をワイヤで接続する半導体装置の製造方法であって、
前記ワイヤが挿通されるキャピラリと、前記キャピラリを移動させる移動機構と、を備えるワイヤボンディング装置を準備する準備工程と、
前記キャピラリに挿通された前記ワイヤの先端にフリーエアボールを形成した後、前記キャピラリの先端を圧着高さまで下降させて前記フリーエアボールを前記第1ボンド点に接合して圧着ボールと前記圧着ボールの上側のボールネックとを形成するボールボンディング工程と、
前記キャピラリの先端を水平方向に移動させて、前記ボールネックと前記圧着ボールとの間に断面積を減らした薄肉部を形成する薄肉部形成工程と、
前記薄肉部を形成した後、前記キャピラリを前記第2ボンド点の方向に円弧状に往復移動させて前記ワイヤを曲げ変形させるワイヤテール曲げ工程と、
前記キャピラリを上昇させてワイヤテールを繰り出した後、前記キャピラリを前記第2ボンド点の方向に移動させて、前記薄肉部において前記ワイヤテールと前記圧着ボールとを切り離すワイヤテール切り離し工程と、
前記キャピラリを下降させて切り離した前記ワイヤテールの側面を前記圧着ボールの上に接合するワイヤテール接合工程と、
を含むことを特徴とする半導体装置の製造方法。 - (削除)
- 請求項1に記載の半導体装置の製造方法であって、
前記薄肉部形成工程は、前記キャピラリを前記圧着高さより高い剪断高さまで上昇させて前記キャピラリを水平方向に移動させること、
を特徴とする半導体装置の製造方法。 - 請求項1又は3に記載の半導体装置の製造方法であって、
前記薄肉部形成工程は、前記薄肉部を形成する際に前記キャピラリを水平方向に往復動作させること、
を特徴とする半導体装置の製造方法。 - 請求項1又は3又は4に記載の半導体装置の製造方法であって、
前記ワイヤテール切り離し工程は、前記薄肉部において前記ワイヤテールを前記圧着ボールから切り離す際に、
前記キャピラリを前記第2ボンド点の方向に向かって斜め上方向に移動させること、
を特徴とする半導体装置の製造方法。 - 請求項1又は3から5のいずれか1項に記載の半導体装置の製造方法であって、
前記ワイヤテール接合工程は、前記ワイヤテールの側面を前記圧着ボールの上に接合する際に、前記キャピラリの前記第1ボンド点の側のフェイス部を前記圧着ボールの前記第2ボンド点と反対側の端部の上まで移動させた後、前記キャピラリを下降させて前記キャピラリの前記フェイス部で、曲げ変形した前記ワイヤテールの側面を前記圧着ボールの前記第2ボンド点と反対側の前記端部の上に接合すること、
を特徴とする半導体装置の製造方法。 - 第1ボンド点と第2ボンド点との間をワイヤで接続するワイヤボンディング装置であって、
前記ワイヤが挿通されるキャピラリと、
前記キャピラリを移動させる移動機構と、
前記移動機構の駆動を制御する制御部と、を備え、
前記制御部は、
前記キャピラリに挿通された前記ワイヤの先端にフリーエアボールを形成した後、前記キャピラリの先端を圧着高さまで下降させて前記フリーエアボールを前記第1ボンド点に接合して圧着ボールと前記圧着ボールの上側のボールネックとを形成し、
前記キャピラリの先端を水平方向に移動させて、前記ボールネックと前記圧着ボールとの間に断面積を減らした薄肉部を形成し、
前記薄肉部を形成した後、前記キャピラリを前記第2ボンド点の方向に円弧状に往復移動させて前記ワイヤを曲げ変形させ、
前記キャピラリを上昇させてワイヤテールを繰り出した後、前記キャピラリを前記第2ボンド点の方向に移動させて、前記薄肉部において前記ワイヤテールと前記圧着ボールとを切り離し、
前記キャピラリを下降させて切り離した前記ワイヤテールの側面を前記圧着ボールの上に接合すること、
を特徴とするワイヤボンディング装置。 - 請求項7に記載のワイヤボンディング装置であって、
前記制御部は、
前記薄肉部を形成する際に、前記キャピラリを前記圧着高さより高い剪断高さまで上昇させて前記キャピラリを水平方向に往復移動させ、
前記薄肉部において前記ワイヤテールを前記圧着ボールから切り離す際に、前記キャピラリを前記第2ボンド点の方向に向かって斜め上方向に移動させ、
前記ワイヤテールの側面を前記圧着ボールの上に接合する際に、前記キャピラリの前記第1ボンド点の側のフェイス部を前記圧着ボールの前記第2ボンド点と反対側の端部の上まで移動させた後、前記キャピラリを下降させて前記キャピラリの前記フェイス部で、曲げ変形した前記ワイヤテールの側面を前記圧着ボールの前記第2ボンド点と反対側の前記端部の上に接合すること、
を特徴とするワイヤボンディング装置。
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