JP2006191117A - 集積受動デバイス - Google Patents
集積受動デバイス Download PDFInfo
- Publication number
- JP2006191117A JP2006191117A JP2006000985A JP2006000985A JP2006191117A JP 2006191117 A JP2006191117 A JP 2006191117A JP 2006000985 A JP2006000985 A JP 2006000985A JP 2006000985 A JP2006000985 A JP 2006000985A JP 2006191117 A JP2006191117 A JP 2006191117A
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- ipd
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- H01L2924/30107—Inductance
Abstract
【解決手段】寄生電気相互作用は、インタフェースから金属を除去することによって、またはMCMの影響されやすいデバイス構成要素から離れた部分において金属を選択的に使用することによって、IPDの一方または両方のインタフェースで制御される。この影響されやすいデバイス構成要素は、主にアナログ回路構成要素、特にRFインダクタ要素である。IPD配置では、影響されやすい構成要素は、他の構成要素から分離されている。これにより選択性を持つ金属手法の実装が可能になる。さらにIPD基板の上部の上の寄生相互作用を、IC半導体チップおよびICチップの接地平面の選択的な配置によって低減させることも可能にしている。本発明のIPD MCMの好ましい実施形態では、IPD基板は、多結晶である。
【選択図】図6
Description
現況技術の無線周波数(Radio Frequency:RF)電気回路は、多量の受動素子を使用する。これらの回路の多くは、ハンドヘルドの無線製造物内で使用される。したがって、受動素子および受動素子回路の小型化が、RF素子技術では重要な目標となる。
Claims (10)
- 集積受動デバイス・マルチチップ・モジュール(IPD MCM)であって、
a.基板と、
b.接続層を持つ前記基板に取り付けられているIPDとを含み、前記接続層の少なくとも一部が非導電性であることを特徴とするIPD MCM。 - 前記接続層全体が非導電性であることを特徴とする請求項1に記載のIPD MCM。
- 前記接続層の第1の部分が非導電性であり、前記接続層の第2の部分が導電性であることを特徴とする請求項1に記載のIPD MCM。
- 前記IPDが、少なくとも1つのインダクタ構成要素を含む第1の部分と、少なくとも1つのデジタル構成要素を含む第2の部分とを含み、前記接続層の前記IPDの前記第1の部分の下の部分が非導電性であり、前記接続層の前記デジタル構成要素の下の部分が導電性であることを特徴とする請求項1に記載のIPD MCM。
- 前記IPD MCMが、前記IPDの上部の上に実装された少なくとも1つの集積回路(IC)チップをさらに含むことを特徴とする請求項4に記載のIPD MCM。
- 前記IPDの上部が選択的に接地平面で覆われることを特徴とする請求項4に記載のIPD MCM。
- 前記接地平面が前記IPDの前記第2の部分上だけに選択的に配置されることを特徴とする請求項6に記載のIPD MCM。
- 前記接続層の非導電性部分が電気的絶縁熱伝導ダイ接着材料であることを特徴とする請求項1に記載のIPD MCM。
- 前記IPDが、多結晶ウェハ上の少なくとも1つの薄膜受動素子を含む多結晶ウェハ基板を含むことを特徴とする請求項1に記載のIPD MCM。
- 測定された前記IPD MCMの厚さ全体が、前記IPDの厚さ、前記ICチップの厚さ、および前記保護物体の厚さを含めて、1.2mm未満であることを特徴とする請求項1に記載のIPD MCM。
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US11/030,754 US7382056B2 (en) | 2004-04-29 | 2005-01-06 | Integrated passive devices |
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JP4589237B2 JP4589237B2 (ja) | 2010-12-01 |
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JP2006000985A Expired - Fee Related JP4589237B2 (ja) | 2005-01-06 | 2006-01-06 | 集積受動デバイス |
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US (1) | US7382056B2 (ja) |
EP (1) | EP1681720A3 (ja) |
JP (1) | JP4589237B2 (ja) |
KR (1) | KR101070181B1 (ja) |
CN (2) | CN100585849C (ja) |
TW (1) | TW200701434A (ja) |
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CN100585849C (zh) | 2010-01-27 |
KR101070181B1 (ko) | 2011-10-05 |
JP4589237B2 (ja) | 2010-12-01 |
TW200701434A (en) | 2007-01-01 |
EP1681720A3 (en) | 2008-12-24 |
CN101645444A (zh) | 2010-02-10 |
US20050253257A1 (en) | 2005-11-17 |
CN1855483A (zh) | 2006-11-01 |
US7382056B2 (en) | 2008-06-03 |
KR20060080896A (ko) | 2006-07-11 |
EP1681720A2 (en) | 2006-07-19 |
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