JP2006114853A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 131
- 239000010419 fine particle Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000002245 particle Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 26
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 17
- 239000000377 silicon dioxide Substances 0.000 abstract description 57
- 238000002955 isolation Methods 0.000 abstract description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 5
- 239000011800 void material Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 76
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 26
- 239000010703 silicon Substances 0.000 description 26
- 229910052710 silicon Inorganic materials 0.000 description 23
- 235000012239 silicon dioxide Nutrition 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 208000032750 Device leakage Diseases 0.000 description 1
- 241000255777 Lepidoptera Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
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- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
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- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
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- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
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- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】 Nch パワーMOSトランジスタには、小さな粒径を有するシリカ微粒子7がトレンチゲート底部に埋め込まれ、トレンチゲート上部には、シリカ微粒子と接するN+多結晶シリコン膜からなるゲート電極8が埋め込まれている。シリカ微粒子7の空隙には、ゲート電極8が形成されていない。
【選択図】 図1
Description
社団法人 電気学会編者[パワーデバイス・ICハンドブック](株)コロナ社1996年7月30日発行(P140 図6.2、P174 図7.36)
2 N−層
3、3a シリコン基板
4 P層
5、5a N+ソース層
6、6a ゲート絶縁膜
7 シリカ微粒子
8、8a ゲート電極
9 P+層
10 絶縁膜
11 コンタクト開口部
12 ソース電極
13 ドレイン電極
21 シリコン酸化膜
22 二酸化シリコン膜
23 N層
24 N+ドレイン層
25 ゲート電極保護膜
26 側壁絶縁膜
27 ビア
28 配線
Claims (5)
- 第1導電型の半導体基板と、
前記半導体基板の第1主面に選択的に設けられた第2導電型の第1の半導体層と、
前記第1の半導体層に選択的に設けられた第1導電型の第2の半導体層と、
前記第2の半導体層及び前記第1の半導体層を貫いて前記半導体基板の途中の深さまで達するトレンチと、
前記トレンチ内部に設けられたゲート絶縁膜と、
前記トレンチ内底部に、前記ゲート絶縁膜と接して埋め込まれた誘電体の微粒子と、
前記トレンチ内部に、側面が前記ゲート絶縁膜と接し、且つ底部が前記微粒子と接し、前記半導体基板の第1主面まで埋め込まれたゲート電極と
を具備することを特徴とする半導体装置。 - 第1導電型の第1の半導体層及び前記第1の半導体層の第1主面に設けられた第2導電型の第2の半導体層を有する半導体基板と、
前記第2の半導体層に選択的に設けられた第1導電型の第3の半導体層と、
前記第3の半導体層に選択的に設けられた第2導電型の第4の半導体層と、
前記第4の半導体層及び前記第3の半導体層を貫いて前記第2の半導体層の途中の深さまで達するトレンチと、
前記トレンチ内部に設けられたゲート絶縁膜と、
前記トレンチ内底部に、前記ゲート絶縁膜と接して埋め込まれた誘電体の微粒子と、
前記トレンチ内部に、側面が前記ゲート絶縁膜と接し、且つ底部が前記微粒子と接し、前記半導体基板の第1主面まで埋め込まれたゲート電極と
を具備することを特徴とする半導体装置。 - 第1導電型の半導体基板と、
前記半導体基板の第1主面に設けられたトレンチと、
前記トレンチ内側部に設けられたシリコン酸化膜と、
前記トレンチ底部に、前記シリコン酸化膜と接して埋め込まれた誘電体の微粒子と、
前記トレンチ内部に、側面が前記シリコン酸化膜と接し、且つ底面が前記微粒子と接し、前記半導体基板の第1主面まで埋め込まれた誘電体層と、
前記シリコン酸化膜と接し、前記半導体基板の第1主面に選択的に設けられ、トランジスタのソース又はドレインである第2導電型の半導体層と
を具備することを特徴とする半導体装置。 - 前記微粒子の粒径は、前記トレンチ底部の幅の1/100以上、1/10以下の範囲であることを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置。
- 第1導電型の半導体基板の第1主面に第2導電型の第1の半導体層を選択的に形成する工程と、
前記第1の半導体層の第1主面に第1導電型の第2の半導体層を選択的に形成する工程と、
前記第2の半導体層及び前記第1の半導体層を貫いて前記半導体基板の途中の深さまで達するトレンチを形成する工程と、
前記トレンチ内部にゲート絶縁膜を形成する工程と、
誘電体の微粒子が分散された溶液を前記半導体基板の第1主面に塗布し、前記トレンチ底部に、前記ゲート絶縁膜と接する誘電体の微粒子を埋め込む工程と、
前記トレンチ内部に、側面が前記ゲート絶縁膜と接し、且つ底部が前記微粒子と接し、前記半導体基板の第1主面近傍までゲート電極を埋め込む工程と
を具備することを特徴とする半導体装置の製造方法。
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JP2004303442A JP4791723B2 (ja) | 2004-10-18 | 2004-10-18 | 半導体装置及びその製造方法 |
US11/249,265 US20060081903A1 (en) | 2004-10-18 | 2005-10-14 | Semiconductor device and method of fabricating the same |
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JP2004303442A JP4791723B2 (ja) | 2004-10-18 | 2004-10-18 | 半導体装置及びその製造方法 |
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JP4791723B2 JP4791723B2 (ja) | 2011-10-12 |
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Cited By (6)
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JP2009152551A (ja) * | 2007-10-22 | 2009-07-09 | Applied Materials Inc | ボイドフリーギャップ充填に対する誘電体膜品質を向上させる方法及びシステム |
JP2009224365A (ja) * | 2008-03-13 | 2009-10-01 | Rohm Co Ltd | 半導体装置およびその製造方法 |
JP2011071292A (ja) * | 2009-09-25 | 2011-04-07 | Asahi Kasei E-Materials Corp | エアギャップ構造体及びエアギャップ形成方法 |
JP2014082520A (ja) * | 2014-01-06 | 2014-05-08 | Rohm Co Ltd | 半導体装置およびその製造方法 |
WO2019088241A1 (ja) * | 2017-11-03 | 2019-05-09 | 株式会社デンソー | 半導体装置 |
US10304969B2 (en) | 2015-09-11 | 2019-05-28 | Kabushiki Kaisha Toshiba | Semiconductor device |
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JP6426642B2 (ja) | 2016-03-08 | 2018-11-21 | 株式会社東芝 | 半導体装置 |
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JP4116007B2 (ja) * | 2005-03-04 | 2008-07-09 | 株式会社東芝 | 半導体装置及びその製造方法 |
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JP2009152551A (ja) * | 2007-10-22 | 2009-07-09 | Applied Materials Inc | ボイドフリーギャップ充填に対する誘電体膜品質を向上させる方法及びシステム |
JP2009224365A (ja) * | 2008-03-13 | 2009-10-01 | Rohm Co Ltd | 半導体装置およびその製造方法 |
JP2011071292A (ja) * | 2009-09-25 | 2011-04-07 | Asahi Kasei E-Materials Corp | エアギャップ構造体及びエアギャップ形成方法 |
JP2014082520A (ja) * | 2014-01-06 | 2014-05-08 | Rohm Co Ltd | 半導体装置およびその製造方法 |
US10304969B2 (en) | 2015-09-11 | 2019-05-28 | Kabushiki Kaisha Toshiba | Semiconductor device |
WO2019088241A1 (ja) * | 2017-11-03 | 2019-05-09 | 株式会社デンソー | 半導体装置 |
JP2019087591A (ja) * | 2017-11-03 | 2019-06-06 | 株式会社デンソー | 半導体装置 |
JP7009933B2 (ja) | 2017-11-03 | 2022-01-26 | 株式会社デンソー | 半導体装置 |
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US20060081903A1 (en) | 2006-04-20 |
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