JP4116007B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP4116007B2 JP4116007B2 JP2005060862A JP2005060862A JP4116007B2 JP 4116007 B2 JP4116007 B2 JP 4116007B2 JP 2005060862 A JP2005060862 A JP 2005060862A JP 2005060862 A JP2005060862 A JP 2005060862A JP 4116007 B2 JP4116007 B2 JP 4116007B2
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- 239000004065 semiconductor Substances 0.000 title claims description 76
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000012212 insulator Substances 0.000 claims description 28
- 238000002955 isolation Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 19
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 14
- 239000012535 impurity Substances 0.000 claims description 12
- 239000011148 porous material Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 230000004888 barrier function Effects 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
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- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
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- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
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- H01L29/408—Electrodes ; Multistep manufacturing processes therefor with an insulating layer with a particular dielectric or electrostatic property, e.g. with static charges or for controlling trapped charges or moving ions, or with a plate acting on the insulator potential or the insulator charges, e.g. for controlling charges effect or potential distribution in the insulating layer, or with a semi-insulating layer contacting directly the semiconductor surface
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
上記のように、本発明の実施の形態を記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者にはさまざまな代替実施の形態、実施例及び運用技術が明らかとなろう。
12 半導体層
13 トレンチ
14 第1のピラー領域
16 第2のピラー領域
18 保護膜
20 分離領域
22 ベース領域
23 障壁層
24 コンタクト層
26 ソース領域
28 ゲート絶縁膜
30 ゲート電極
32 絶縁膜
34 ソース電極
36 ドレイン電極
40a〜40c、140a〜140c 活性素子セル
50 粒状絶縁物
52 半導体膜
54 半絶縁性粒子
56、58 不純物注入層
60 気孔
Claims (5)
- 第1導電型の第1のピラー領域と、該第1のピラー領域に挟まれた第2導電型の第2のピラー領域とを備える複数の活性素子セルと、
前記複数の活性素子セルのそれぞれを分離するように前記複数の活性素子セルの間に配置され、粒状絶縁物及び前記粒状絶縁物の表面を覆う半導体膜を有する複数の半絶縁性粒子を埋め込んだ分離領域
とを備えることを特徴とする半導体装置。 - 前記分離領域は、前記複数の半絶縁性粒子間に気孔を有することを特徴とする請求項1に記載の半導体装置。
- 前記粒状絶縁物の平均粒径が、30nm〜500nmであることを特徴とする請求項1又は2に記載の半導体装置。
- 前記半導体膜は、厚さが1μm以下の多結晶シリコンであることを特徴とする請求項1〜3のいずれか1項に記載の半導体装置。
- 第1導電型の半導体基板上に半導体層を成長し、
前記半導体層の一部を除去して複数のトレンチを形成し、該複数のトレンチにより複数の活性素子セルを分離形成し、
前記トレンチの側壁を介して前記活性素子セルに第1導電型の不純物と該第1導電型の不純物より熱拡散係数の大きい第2導電型の不純物を添加し、前記側壁側に第1導電型の第1のピラー領域と、前記第1のピラー領域に挟まれた第2導電型の第2のピラー領域を熱処理により形成し、
前記トレンチを埋め込むように粒状絶縁物を塗布し、前記粒状絶縁物の各々の表面を覆うように半導体膜を堆積して分離領域を形成する
ことを含むことを特徴とする半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005060862A JP4116007B2 (ja) | 2005-03-04 | 2005-03-04 | 半導体装置及びその製造方法 |
US11/117,331 US7439605B2 (en) | 2005-03-04 | 2005-04-29 | Semiconductor device and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005060862A JP4116007B2 (ja) | 2005-03-04 | 2005-03-04 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2006245409A JP2006245409A (ja) | 2006-09-14 |
JP4116007B2 true JP4116007B2 (ja) | 2008-07-09 |
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JP2005060862A Expired - Fee Related JP4116007B2 (ja) | 2005-03-04 | 2005-03-04 | 半導体装置及びその製造方法 |
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US (1) | US7439605B2 (ja) |
JP (1) | JP4116007B2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4791723B2 (ja) * | 2004-10-18 | 2011-10-12 | 株式会社東芝 | 半導体装置及びその製造方法 |
US7781797B2 (en) * | 2006-06-29 | 2010-08-24 | International Business Machines Corporation | One-transistor static random access memory with integrated vertical PNPN device |
US8580651B2 (en) * | 2007-04-23 | 2013-11-12 | Icemos Technology Ltd. | Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material |
TWI357108B (en) * | 2007-08-21 | 2012-01-21 | Nat Univ Tsing Hua | Semiconductor device structure |
DE112007003638T5 (de) * | 2007-09-10 | 2010-08-12 | Fujitsu Ltd., Kawasaki | Prozess zum Herstellen einer siliziumhaltigen Beschichtung, siliziumhaltige Beschichtung und Halbleitervorrichtung |
US8298889B2 (en) * | 2008-12-10 | 2012-10-30 | Semiconductor Components Industries, Llc | Process of forming an electronic device including a trench and a conductive structure therein |
US8916927B2 (en) * | 2012-07-19 | 2014-12-23 | Taiwan Semiconductor Manufacturing | Vertical tunnel field effect transistor (FET) |
US9472667B2 (en) | 2015-01-08 | 2016-10-18 | International Business Machines Corporation | III-V MOSFET with strained channel and semi-insulating bottom barrier |
CN105529369B (zh) * | 2016-03-08 | 2019-05-14 | 中国电子科技集团公司第二十四研究所 | 一种半导体元胞结构和功率半导体器件 |
US11056581B2 (en) * | 2017-08-21 | 2021-07-06 | Semiconductor Components Industries, Llc | Trench-gate insulated-gate bipolar transistors |
KR20200027816A (ko) | 2018-09-05 | 2020-03-13 | 삼성전자주식회사 | 소자분리층을 갖는 반도체 소자 및 그 제조 방법 |
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US2974062A (en) * | 1956-02-14 | 1961-03-07 | Owens Corning Fiberglass Corp | Epoxy-glass fiber systems and method for improving the bonding relation therebetween |
US5219606A (en) * | 1989-05-23 | 1993-06-15 | Kabushiki Kaisha Toshiba | Method of manufacturing phosphor screen for intensifier |
JPH0493362A (ja) * | 1990-08-10 | 1992-03-26 | Toshiba Ceramics Co Ltd | 電子部品封止用充填剤およびその製造方法 |
US6329062B1 (en) * | 2000-02-29 | 2001-12-11 | Novellus Systems, Inc. | Dielectric layer including silicalite crystals and binder and method for producing same for microelectronic circuits |
US6608350B2 (en) | 2000-12-07 | 2003-08-19 | International Rectifier Corporation | High voltage vertical conduction superjunction semiconductor device |
US6653718B2 (en) * | 2001-01-11 | 2003-11-25 | Honeywell International, Inc. | Dielectric films for narrow gap-fill applications |
JP3993458B2 (ja) | 2002-04-17 | 2007-10-17 | 株式会社東芝 | 半導体装置 |
JP3947127B2 (ja) | 2002-04-30 | 2007-07-18 | 株式会社東芝 | 半導体装置 |
US20040016962A1 (en) * | 2002-04-30 | 2004-01-29 | Hideki Okumura | Semiconductor device |
US7262477B2 (en) * | 2002-04-30 | 2007-08-28 | Kabushiki Kaisha Toshiba | Semiconductor device |
-
2005
- 2005-03-04 JP JP2005060862A patent/JP4116007B2/ja not_active Expired - Fee Related
- 2005-04-29 US US11/117,331 patent/US7439605B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7439605B2 (en) | 2008-10-21 |
US20060197151A1 (en) | 2006-09-07 |
JP2006245409A (ja) | 2006-09-14 |
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