JP2006074003A - 基板支持ピンを備えるソフトベーク装置及びこれを利用したベーキング方法 - Google Patents
基板支持ピンを備えるソフトベーク装置及びこれを利用したベーキング方法 Download PDFInfo
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- JP2006074003A JP2006074003A JP2005191262A JP2005191262A JP2006074003A JP 2006074003 A JP2006074003 A JP 2006074003A JP 2005191262 A JP2005191262 A JP 2005191262A JP 2005191262 A JP2005191262 A JP 2005191262A JP 2006074003 A JP2006074003 A JP 2006074003A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
【解決手段】チャンバーの内部に形成される加熱プレート305と、該加熱プレート305にローディングされる基板300と、該基板300を加熱する加熱手段と、前記加熱プレート305の表面に設置され、前記基板300の非表示領域を選択して支持する複数の基板支持ピン302a,302bと、これら支持ピン毎に設置され、個別的に前記基板支持ピン302a、302bを駆動する基板支持ピン駆動手段310とを備える。
【選択図】図1
Description
305:加熱プレート
302a、302b:基板支持ピン
304:非液晶表示パネル領域
Claims (8)
- チャンバーの内部に形成される加熱プレートと、
該加熱プレートにローディングされる基板と、
該基板を加熱する加熱手段と、
前記加熱プレートの表面に設置され、前記基板の非表示領域を選択して支持する複数の基板支持ピンと、
これら支持ピン毎に設置され、個別に前記基板支持ピンを駆動する基板支持ピン駆動手段と、を備えていることを特徴とするソフトベーク装置。 - 前記基板支持ピン駆動手段の動作を制御する制御部を更に備えることを特徴とする請求項1に記載のソフトベーク装置。
- 前記基板は、液晶表示パネルが形成される表示領域と液晶表示パネルが形成されない非表示領域に分けられることを特徴とする請求項1に記載のソフトベーク装置。
- 前記基板支持ピンは、前記非表示領域を選択して接触して基板を支持することを特徴とする請求項3に記載のソフトベーク装置。
- 前記加熱手段は、前記基板プレートに埋設される電熱線であることを特徴とする請求項1に記載のソフトベーク装置。
- 加熱プレート上に形成される複数の基板支持ピンの中で所定の基板支持ピンを選択する段階と、
該選択された基板支持ピンを上昇させる段階と、
基板をソフトベーク装置の内部に搬入させる段階と、
前記上昇した基板支持ピン上に前記基板を安定して装着させる段階と、
前記基板をソフトベークする段階と、を順次行うことを特徴とするフォトレジストベーク方法。 - 前記選択された基板支持ピンを上昇させる段階において、
前記基板支持ピンは、基板の非表示領域に接触することを特徴とする請求項6に記載のフォトレジストベーク方法。 - 前記基板支持ピンの中で所定の基板支持ピンを選択する段階は、
基板上に配列される単位液晶表示パネル領域の配列情報を判断する段階と、
前記単位液晶表示パネル領域の配列情報によって基板支持ピンを選択する段階と、を順次行うことを特徴とする請求項6に記載のフォトレジストベーク方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040069339A KR100966430B1 (ko) | 2004-08-31 | 2004-08-31 | 기판지지핀을 구비하는 소프트 베이크 장치 및 이를이용한 소프트 베이킹 방법 |
Publications (1)
Publication Number | Publication Date |
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JP2006074003A true JP2006074003A (ja) | 2006-03-16 |
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JP2005191262A Pending JP2006074003A (ja) | 2004-08-31 | 2005-06-30 | 基板支持ピンを備えるソフトベーク装置及びこれを利用したベーキング方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8148665B2 (ja) |
JP (1) | JP2006074003A (ja) |
KR (1) | KR100966430B1 (ja) |
CN (1) | CN100501576C (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008029943A1 (fr) * | 2006-09-08 | 2008-03-13 | Semiconductor & Display Corporation | Mécanisme de lamelles élévatrices |
WO2011007616A1 (ja) * | 2009-07-13 | 2011-01-20 | シャープ株式会社 | 支持装置およびこの支持装置を備える乾燥装置 |
WO2012141082A1 (ja) * | 2011-04-13 | 2012-10-18 | シャープ株式会社 | 基板支持装置、及び乾燥装置 |
WO2012147600A1 (ja) * | 2011-04-26 | 2012-11-01 | シャープ株式会社 | 基板保持装置 |
JP2015510656A (ja) * | 2012-01-09 | 2015-04-09 | 京東方科技集團股▲ふん▼有限公司 | 導光板のドット、導光板の製造方法、バックライトモジュール、及び表示装置 |
Families Citing this family (9)
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TWI357519B (en) * | 2008-08-20 | 2012-02-01 | Pegatron Corp | Heating module of lcd device and method for heatin |
CN104096667A (zh) * | 2013-04-08 | 2014-10-15 | 广达电脑股份有限公司 | 烘胶设备 |
CN103466927B (zh) * | 2013-09-09 | 2016-06-08 | 深圳市华星光电技术有限公司 | 对基板进行烤焙处理的装置及方法 |
US9809491B2 (en) * | 2013-09-09 | 2017-11-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Device and method for baking substrate |
CN105843000B (zh) * | 2016-03-30 | 2019-11-15 | 深圳市华星光电技术有限公司 | 烘烤炉及其调整显示器件上的光阻线的线宽的方法 |
CN106526984B (zh) * | 2017-01-24 | 2019-10-22 | 京东方科技集团股份有限公司 | 显示基板制备方法及装置 |
KR102640172B1 (ko) | 2019-07-03 | 2024-02-23 | 삼성전자주식회사 | 기판 처리 장치 및 이의 구동 방법 |
KR102322679B1 (ko) * | 2020-01-08 | 2021-11-05 | 세메스 주식회사 | 진공 건조 장치 |
CN114690472A (zh) * | 2020-12-31 | 2022-07-01 | 上海仪电显示材料有限公司 | 彩色滤光基板的形成方法和加热装置 |
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JP2000047398A (ja) * | 1998-07-29 | 2000-02-18 | Tokyo Electron Ltd | 加熱処理装置 |
JP2000124127A (ja) * | 1998-08-11 | 2000-04-28 | Tokyo Electron Ltd | レジスト塗布・現像装置、ならびにそれに用いる基板加熱処理装置および基板搬送装置 |
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2005
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- 2005-06-30 CN CNB2005100801852A patent/CN100501576C/zh active Active
- 2005-06-30 JP JP2005191262A patent/JP2006074003A/ja active Pending
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JP2000124127A (ja) * | 1998-08-11 | 2000-04-28 | Tokyo Electron Ltd | レジスト塗布・現像装置、ならびにそれに用いる基板加熱処理装置および基板搬送装置 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008029943A1 (fr) * | 2006-09-08 | 2008-03-13 | Semiconductor & Display Corporation | Mécanisme de lamelles élévatrices |
WO2011007616A1 (ja) * | 2009-07-13 | 2011-01-20 | シャープ株式会社 | 支持装置およびこの支持装置を備える乾燥装置 |
WO2012141082A1 (ja) * | 2011-04-13 | 2012-10-18 | シャープ株式会社 | 基板支持装置、及び乾燥装置 |
CN103443913A (zh) * | 2011-04-13 | 2013-12-11 | 夏普株式会社 | 基板支撑装置和干燥装置 |
JP5678177B2 (ja) * | 2011-04-13 | 2015-02-25 | シャープ株式会社 | 基板支持装置、及び乾燥装置 |
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JP2015510656A (ja) * | 2012-01-09 | 2015-04-09 | 京東方科技集團股▲ふん▼有限公司 | 導光板のドット、導光板の製造方法、バックライトモジュール、及び表示装置 |
Also Published As
Publication number | Publication date |
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US20060054791A1 (en) | 2006-03-16 |
CN1743964A (zh) | 2006-03-08 |
US8148665B2 (en) | 2012-04-03 |
KR20060020493A (ko) | 2006-03-06 |
CN100501576C (zh) | 2009-06-17 |
KR100966430B1 (ko) | 2010-06-28 |
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