JP2006066613A - チップ型部品とその製造方法 - Google Patents

チップ型部品とその製造方法 Download PDF

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Publication number
JP2006066613A
JP2006066613A JP2004246916A JP2004246916A JP2006066613A JP 2006066613 A JP2006066613 A JP 2006066613A JP 2004246916 A JP2004246916 A JP 2004246916A JP 2004246916 A JP2004246916 A JP 2004246916A JP 2006066613 A JP2006066613 A JP 2006066613A
Authority
JP
Japan
Prior art keywords
insulating substrate
terminal electrode
chip
electrode films
type component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004246916A
Other languages
English (en)
Japanese (ja)
Inventor
Hisahiro Kuriyama
尚大 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2004246916A priority Critical patent/JP2006066613A/ja
Priority to CNA2005800006045A priority patent/CN1860560A/zh
Priority to PCT/JP2005/008716 priority patent/WO2006022055A1/ja
Priority to US11/661,017 priority patent/US7629872B2/en
Priority to KR1020057019384A priority patent/KR20070049530A/ko
Priority to TW094115986A priority patent/TWI369692B/zh
Publication of JP2006066613A publication Critical patent/JP2006066613A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
JP2004246916A 2004-08-26 2004-08-26 チップ型部品とその製造方法 Pending JP2006066613A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004246916A JP2006066613A (ja) 2004-08-26 2004-08-26 チップ型部品とその製造方法
CNA2005800006045A CN1860560A (zh) 2004-08-26 2005-05-12 芯片型部件及其制造方法
PCT/JP2005/008716 WO2006022055A1 (ja) 2004-08-26 2005-05-12 チップ型部品とその製造方法
US11/661,017 US7629872B2 (en) 2004-08-26 2005-05-12 Chip type component and its manufacturing process
KR1020057019384A KR20070049530A (ko) 2004-08-26 2005-05-12 칩형 부품과 그 제조방법
TW094115986A TWI369692B (en) 2004-08-26 2005-05-17 Chip type component and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004246916A JP2006066613A (ja) 2004-08-26 2004-08-26 チップ型部品とその製造方法

Publications (1)

Publication Number Publication Date
JP2006066613A true JP2006066613A (ja) 2006-03-09

Family

ID=35967276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004246916A Pending JP2006066613A (ja) 2004-08-26 2004-08-26 チップ型部品とその製造方法

Country Status (6)

Country Link
US (1) US7629872B2 (ko)
JP (1) JP2006066613A (ko)
KR (1) KR20070049530A (ko)
CN (1) CN1860560A (ko)
TW (1) TWI369692B (ko)
WO (1) WO2006022055A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090231763A1 (en) * 2008-03-12 2009-09-17 Polytronics Technology Corporation Over-voltage protection device
JP6499007B2 (ja) * 2015-05-11 2019-04-10 Koa株式会社 チップ抵抗器
JPWO2019017237A1 (ja) * 2017-07-19 2020-05-28 パナソニックＩｐマネジメント株式会社 チップ抵抗器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599503A (ja) 1982-07-08 1984-01-18 Toyota Motor Corp 判定回路を備えた表面粗さ測定器
JPS599503U (ja) * 1982-07-09 1984-01-21 アルプス電気株式会社 チツプ抵抗
JP3231370B2 (ja) 1991-11-15 2001-11-19 松下電器産業株式会社 角形チップ抵抗器の製造方法
JP2806802B2 (ja) 1994-07-11 1998-09-30 北陸電気工業株式会社 チップ抵抗器
JPH0864401A (ja) 1994-08-26 1996-03-08 Rohm Co Ltd チップ状電子部品
JP2000030903A (ja) 1998-07-09 2000-01-28 Taiyosha Denki Kk チップ型部品
JPH11260602A (ja) * 1998-12-18 1999-09-24 Matsushita Electric Ind Co Ltd 角形チップ抵抗器およびそれに用いる絶縁基板
JP4722318B2 (ja) * 2000-06-05 2011-07-13 ローム株式会社 チップ抵抗器
JP2002025802A (ja) * 2000-07-10 2002-01-25 Rohm Co Ltd チップ抵抗器

Also Published As

Publication number Publication date
US20070296542A1 (en) 2007-12-27
CN1860560A (zh) 2006-11-08
US7629872B2 (en) 2009-12-08
TW200608419A (en) 2006-03-01
TWI369692B (en) 2012-08-01
KR20070049530A (ko) 2007-05-11
WO2006022055A1 (ja) 2006-03-02

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