JP6499007B2 - チップ抵抗器 - Google Patents
チップ抵抗器 Download PDFInfo
- Publication number
- JP6499007B2 JP6499007B2 JP2015096580A JP2015096580A JP6499007B2 JP 6499007 B2 JP6499007 B2 JP 6499007B2 JP 2015096580 A JP2015096580 A JP 2015096580A JP 2015096580 A JP2015096580 A JP 2015096580A JP 6499007 B2 JP6499007 B2 JP 6499007B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating resin
- ceramic substrate
- chip resistor
- back electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010410 layer Substances 0.000 claims description 79
- 229920005989 resin Polymers 0.000 claims description 64
- 239000011347 resin Substances 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 57
- 239000000919 ceramic Substances 0.000 claims description 37
- 239000011241 protective layer Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 27
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 19
- 239000004332 silver Substances 0.000 description 19
- 230000008646 thermal stress Effects 0.000 description 11
- 238000004880 explosion Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 229910052946 acanthite Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 2
- 229940056910 silver sulfide Drugs 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Non-Adjustable Resistors (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
2 セラミック基板
3 表電極
4 抵抗体
5 保護層
6 裏電極
7 端面電極7
8 外部電極
9 絶縁性樹脂層
10 回路基板
11 ランド
12 半田
20A 大判基板
20B 短冊状基板
21 1次分割溝
22 2次分割溝
Claims (2)
- 直方体形状のセラミック基板と、このセラミック基板の表面の長手方向両端部に設けられた一対の表電極と、これら一対の表電極間を接続する抵抗体と、この抵抗体を被覆する保護層と、前記セラミック基板の裏面の長手方向両端部に設けられた一対の裏電極と、前記表電極と前記裏電極を導通する端面電極と、この端面電極を覆う外部電極とを備えたチップ抵抗器において、
前記セラミック基板の裏面に前記裏電極のエッジ部側を直接覆うように一対の絶縁性樹脂層が所定間隔を存して形成されており、前記端面電極が前記裏電極のエッジ部を除く部位に形成されて前記絶縁性樹脂層と接続していると共に、前記外部電極が前記裏電極に重なる部位の前記端面電極を覆って前記絶縁性樹脂層と接続していることを特徴とするチップ抵抗器。 - 請求項1の記載において、前記絶縁性樹脂層が前記セラミック基板の裏面の短手方向一端部から他端部に亘って帯状に形成されていることを特徴とするチップ抵抗器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015096580A JP6499007B2 (ja) | 2015-05-11 | 2015-05-11 | チップ抵抗器 |
PCT/JP2016/061699 WO2016181737A1 (ja) | 2015-05-11 | 2016-04-11 | チップ抵抗器 |
CN201680027278.5A CN107615410B (zh) | 2015-05-11 | 2016-04-11 | 芯片电阻器 |
DE112016002156.9T DE112016002156T5 (de) | 2015-05-11 | 2016-04-11 | Chip-Widerstand |
US15/572,847 US10192659B2 (en) | 2015-05-11 | 2016-04-11 | Chip resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015096580A JP6499007B2 (ja) | 2015-05-11 | 2015-05-11 | チップ抵抗器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018232378A Division JP2019062226A (ja) | 2018-12-12 | 2018-12-12 | チップ抵抗器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016213352A JP2016213352A (ja) | 2016-12-15 |
JP6499007B2 true JP6499007B2 (ja) | 2019-04-10 |
Family
ID=57247939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015096580A Active JP6499007B2 (ja) | 2015-05-11 | 2015-05-11 | チップ抵抗器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10192659B2 (ja) |
JP (1) | JP6499007B2 (ja) |
CN (1) | CN107615410B (ja) |
DE (1) | DE112016002156T5 (ja) |
WO (1) | WO2016181737A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6688025B2 (ja) * | 2015-08-26 | 2020-04-28 | Koa株式会社 | チップ抵抗器およびチップ抵抗器の製造方法 |
JP2018146403A (ja) * | 2017-03-06 | 2018-09-20 | Koa株式会社 | 温度センサ素子 |
US10964457B2 (en) * | 2017-07-19 | 2021-03-30 | Panasonic Intellectual Property Management Co., Ltd. | Chip resistor |
JP2020126002A (ja) * | 2019-02-05 | 2020-08-20 | Koa株式会社 | 硫化検出センサ |
DE112020001355T5 (de) * | 2019-03-18 | 2021-12-02 | Rohm Co., Ltd. | Chip-widerstand |
JP2020169891A (ja) * | 2019-04-03 | 2020-10-15 | Koa株式会社 | 硫化検出センサ、硫化検出センサの製造方法、硫化検出センサの実装方法 |
DE112020005533T5 (de) * | 2019-11-12 | 2022-08-18 | Rohm Co., Ltd. | Chip-widerstand |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01109702A (ja) * | 1987-10-22 | 1989-04-26 | Hokuriku Denki Kogyo Kk | チップ抵抗器とその製造方法 |
JPH09180957A (ja) * | 1995-12-22 | 1997-07-11 | Kyocera Corp | 積層型セラミックコンデンサ |
JPH10256001A (ja) * | 1997-03-12 | 1998-09-25 | Hokuriku Electric Ind Co Ltd | チップ電子部品 |
JP2006066613A (ja) * | 2004-08-26 | 2006-03-09 | Rohm Co Ltd | チップ型部品とその製造方法 |
JP4841914B2 (ja) * | 2005-09-21 | 2011-12-21 | コーア株式会社 | チップ抵抗器 |
JP2008084905A (ja) * | 2006-09-26 | 2008-04-10 | Taiyosha Electric Co Ltd | チップ抵抗器 |
JP5329773B2 (ja) * | 2007-05-31 | 2013-10-30 | コーア株式会社 | チップ抵抗器 |
JP2013074044A (ja) | 2011-09-27 | 2013-04-22 | Koa Corp | チップ抵抗器 |
JP6286914B2 (ja) * | 2013-07-30 | 2018-03-07 | Tdk株式会社 | セラミック電子部品 |
JP6181500B2 (ja) * | 2013-09-30 | 2017-08-16 | Koa株式会社 | チップ抵抗器およびその製造方法 |
-
2015
- 2015-05-11 JP JP2015096580A patent/JP6499007B2/ja active Active
-
2016
- 2016-04-11 WO PCT/JP2016/061699 patent/WO2016181737A1/ja active Application Filing
- 2016-04-11 US US15/572,847 patent/US10192659B2/en active Active
- 2016-04-11 CN CN201680027278.5A patent/CN107615410B/zh active Active
- 2016-04-11 DE DE112016002156.9T patent/DE112016002156T5/de active Pending
Also Published As
Publication number | Publication date |
---|---|
US10192659B2 (en) | 2019-01-29 |
CN107615410B (zh) | 2019-06-11 |
JP2016213352A (ja) | 2016-12-15 |
DE112016002156T5 (de) | 2018-03-15 |
CN107615410A (zh) | 2018-01-19 |
WO2016181737A1 (ja) | 2016-11-17 |
US20180158578A1 (en) | 2018-06-07 |
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