JP2006013158A - 酸性エッチング液再生方法及び酸性エッチング液再生装置 - Google Patents

酸性エッチング液再生方法及び酸性エッチング液再生装置 Download PDF

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Publication number
JP2006013158A
JP2006013158A JP2004188579A JP2004188579A JP2006013158A JP 2006013158 A JP2006013158 A JP 2006013158A JP 2004188579 A JP2004188579 A JP 2004188579A JP 2004188579 A JP2004188579 A JP 2004188579A JP 2006013158 A JP2006013158 A JP 2006013158A
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JP
Japan
Prior art keywords
acidic
etching solution
permeate
etching
oxalic acid
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Pending
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JP2004188579A
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English (en)
Japanese (ja)
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JP2006013158A5 (enExample
Inventor
Takamichi Umeeda
孝道 梅枝
Yoshiya Kitagawa
悌也 北川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagase and Co Ltd
Nagase CMS Technology Co Ltd
Original Assignee
Nagase and Co Ltd
Nagase CMS Technology Co Ltd
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Filing date
Publication date
Application filed by Nagase and Co Ltd, Nagase CMS Technology Co Ltd filed Critical Nagase and Co Ltd
Priority to JP2004188579A priority Critical patent/JP2006013158A/ja
Priority to TW094120661A priority patent/TW200613582A/zh
Priority to KR1020050055145A priority patent/KR20060049695A/ko
Priority to CNA2005100809375A priority patent/CN1712567A/zh
Publication of JP2006013158A publication Critical patent/JP2006013158A/ja
Publication of JP2006013158A5 publication Critical patent/JP2006013158A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
JP2004188579A 2004-06-25 2004-06-25 酸性エッチング液再生方法及び酸性エッチング液再生装置 Pending JP2006013158A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004188579A JP2006013158A (ja) 2004-06-25 2004-06-25 酸性エッチング液再生方法及び酸性エッチング液再生装置
TW094120661A TW200613582A (en) 2004-06-25 2005-06-21 Method and apparatus for regenerating acidic etchant
KR1020050055145A KR20060049695A (ko) 2004-06-25 2005-06-24 산성 에칭액 재생방법 및 산성 에칭액 재생장치
CNA2005100809375A CN1712567A (zh) 2004-06-25 2005-06-24 酸性蚀刻液再生方法和酸性蚀刻液再生装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004188579A JP2006013158A (ja) 2004-06-25 2004-06-25 酸性エッチング液再生方法及び酸性エッチング液再生装置

Publications (2)

Publication Number Publication Date
JP2006013158A true JP2006013158A (ja) 2006-01-12
JP2006013158A5 JP2006013158A5 (enExample) 2007-05-10

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ID=35718358

Family Applications (1)

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JP2004188579A Pending JP2006013158A (ja) 2004-06-25 2004-06-25 酸性エッチング液再生方法及び酸性エッチング液再生装置

Country Status (4)

Country Link
JP (1) JP2006013158A (enExample)
KR (1) KR20060049695A (enExample)
CN (1) CN1712567A (enExample)
TW (1) TW200613582A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008208396A (ja) * 2007-02-23 2008-09-11 Kobelco Eco-Solutions Co Ltd インジウムの回収方法とその装置
WO2010092985A1 (ja) * 2009-02-12 2010-08-19 倉敷紡績株式会社 流体制御方法及び流体制御装置
JP2011166006A (ja) * 2010-02-12 2011-08-25 Sumitomo Precision Prod Co Ltd エッチング方法
JP2012178424A (ja) * 2011-02-25 2012-09-13 Dainippon Screen Mfg Co Ltd エッチング液濃度管理装置
KR20160010259A (ko) 2014-07-17 2016-01-27 가부시키가이샤 히라마 리카 켄큐쇼 고체입자 회수 제거장치, 액체 관리장치 및 에칭액 관리장치
JP2016025138A (ja) * 2014-07-17 2016-02-08 株式会社平間理化研究所 エッチング液管理装置、エッチング液管理方法、及び、エッチング液の成分濃度測定方法
JP2016029208A (ja) * 2014-07-17 2016-03-03 株式会社平間理化研究所 エッチング液管理装置、溶解金属濃度測定装置、及び、溶解金属濃度測定方法
EP3771749A1 (de) * 2019-07-29 2021-02-03 Ewald Dörken Ag Verfahren zur passivierung metallischer substrate

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790370B1 (ko) * 2006-11-09 2008-01-02 주식회사 에스씨티 폐에칭액의 재생장치 및 그 재생방법
KR101021784B1 (ko) * 2008-10-22 2011-03-17 주식회사 에스씨티 나노막필터를 이용한 에칭액의 재생 장치 및 그 재생방법
JP5795983B2 (ja) 2012-03-27 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN105278566A (zh) * 2014-07-17 2016-01-27 株式会社平间理化研究所 蚀刻液管理装置、溶解金属浓度测定装置及测定方法
CN105845604B (zh) * 2016-03-10 2019-05-07 深圳市华星光电技术有限公司 一种蚀刻过程中酸浓度的监控方法及系统
CN106399984B (zh) * 2016-08-30 2019-06-25 嘉善天晟精密铸件有限公司 一种金属铸件表面钝化装置和方法
CN106399998B (zh) * 2016-08-30 2019-03-12 嘉善天晟精密铸件有限公司 一种金属铸件表面钝化方法
CN106245010B (zh) * 2016-08-30 2019-02-19 嘉善天晟精密铸件有限公司 一种金属铸件表面钝化装置
CN106399999B (zh) * 2016-08-30 2019-07-16 嘉善天晟精密铸件有限公司 一种用于金属铸件表面处理的回收组件
CN110072342B (zh) * 2019-04-30 2024-03-01 昆山沪利微电有限公司 一种用于pcb板制作的加工装置
CN113046563A (zh) * 2021-03-11 2021-06-29 苏州晶洲装备科技有限公司 一种刻蚀液再生装置、刻蚀系统装置和刻蚀方法
CN116153812A (zh) * 2022-12-29 2023-05-23 华灿光电（浙江）有限公司 湿法刻蚀装置和湿法刻蚀的控制方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008208396A (ja) * 2007-02-23 2008-09-11 Kobelco Eco-Solutions Co Ltd インジウムの回収方法とその装置
WO2010092985A1 (ja) * 2009-02-12 2010-08-19 倉敷紡績株式会社 流体制御方法及び流体制御装置
JP2010184203A (ja) * 2009-02-12 2010-08-26 Kurabo Ind Ltd 流体制御方法及び流体制御装置
JP2011166006A (ja) * 2010-02-12 2011-08-25 Sumitomo Precision Prod Co Ltd エッチング方法
JP2012178424A (ja) * 2011-02-25 2012-09-13 Dainippon Screen Mfg Co Ltd エッチング液濃度管理装置
KR20160010259A (ko) 2014-07-17 2016-01-27 가부시키가이샤 히라마 리카 켄큐쇼 고체입자 회수 제거장치, 액체 관리장치 및 에칭액 관리장치
KR20160010329A (ko) 2014-07-17 2016-01-27 가부시키가이샤 히라마 리카 켄큐쇼 고체입자 회수 제거장치, 액체 관리장치 및 에칭액 관리장치
JP2016025138A (ja) * 2014-07-17 2016-02-08 株式会社平間理化研究所 エッチング液管理装置、エッチング液管理方法、及び、エッチング液の成分濃度測定方法
JP2016029208A (ja) * 2014-07-17 2016-03-03 株式会社平間理化研究所 エッチング液管理装置、溶解金属濃度測定装置、及び、溶解金属濃度測定方法
JP2016028807A (ja) * 2014-07-17 2016-03-03 株式会社平間理化研究所 固体粒子回収除去装置、液体管理装置及びエッチング液管理装置
EP3771749A1 (de) * 2019-07-29 2021-02-03 Ewald Dörken Ag Verfahren zur passivierung metallischer substrate
US11987887B2 (en) 2019-07-29 2024-05-21 Ewald Dörken Ag Method for passivating metallic substances

Also Published As

Publication number Publication date
KR20060049695A (ko) 2006-05-19
TW200613582A (en) 2006-05-01
CN1712567A (zh) 2005-12-28

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