TW200613582A - Method and apparatus for regenerating acidic etchant - Google Patents

Method and apparatus for regenerating acidic etchant

Info

Publication number
TW200613582A
TW200613582A TW094120661A TW94120661A TW200613582A TW 200613582 A TW200613582 A TW 200613582A TW 094120661 A TW094120661 A TW 094120661A TW 94120661 A TW94120661 A TW 94120661A TW 200613582 A TW200613582 A TW 200613582A
Authority
TW
Taiwan
Prior art keywords
oxalic acid
etchant
acidic etchant
regenerating
regenerating acidic
Prior art date
Application number
TW094120661A
Other languages
Chinese (zh)
Inventor
Takamichi Umeeda
Yoshiya Kitagawa
Original Assignee
Nagase & Co Ltd
Nagase Cms Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase & Co Ltd, Nagase Cms Technology Co Ltd filed Critical Nagase & Co Ltd
Publication of TW200613582A publication Critical patent/TW200613582A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Abstract

This invention is to provide a method and an apparatus for regenerating etchant containing oxalic acid capable of reducing the frequency of replacement of an entire amount of etchant containing oxalic acid. The method includes a filtering step, in which the oxalic acid containing etchant used for etching ITO is filtered by an NF membrane 25 into permeate liquid and non-permeate liquid.
TW094120661A 2004-06-25 2005-06-21 Method and apparatus for regenerating acidic etchant TW200613582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004188579A JP2006013158A (en) 2004-06-25 2004-06-25 Method and apparatus for regenerating acidic etchant

Publications (1)

Publication Number Publication Date
TW200613582A true TW200613582A (en) 2006-05-01

Family

ID=35718358

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120661A TW200613582A (en) 2004-06-25 2005-06-21 Method and apparatus for regenerating acidic etchant

Country Status (4)

Country Link
JP (1) JP2006013158A (en)
KR (1) KR20060049695A (en)
CN (1) CN1712567A (en)
TW (1) TW200613582A (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790370B1 (en) * 2006-11-09 2008-01-02 주식회사 에스씨티 Recycling method and apparatus of waste etching solution
JP2008208396A (en) * 2007-02-23 2008-09-11 Kobelco Eco-Solutions Co Ltd Method for collecting indium, and apparatus therefor
KR101021784B1 (en) * 2008-10-22 2011-03-17 주식회사 에스씨티 Recycling method and apparatus of waste etching solution
JP5340760B2 (en) * 2009-02-12 2013-11-13 倉敷紡績株式会社 Fluid control method and fluid control apparatus
JP2011166006A (en) * 2010-02-12 2011-08-25 Sumitomo Precision Prod Co Ltd Etching method
JP2012178424A (en) * 2011-02-25 2012-09-13 Dainippon Screen Mfg Co Ltd Etchant concentration management apparatus
JP5795983B2 (en) * 2012-03-27 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
CN105278566A (en) * 2014-07-17 2016-01-27 株式会社平间理化研究所 Etching solution managing apparatus, dissolved metal concentration measuring apparatus and dissolved metal concentration measuring method
JP6284452B2 (en) * 2014-07-17 2018-02-28 株式会社平間理化研究所 Etching solution management apparatus, etching solution management method, and etching solution component concentration measuring method
KR20160010259A (en) 2014-07-17 2016-01-27 가부시키가이샤 히라마 리카 켄큐쇼 Solid particle recovering and removing apparatus, liquid managing apparatus and etching solution managing apparatus
KR20160010257A (en) * 2014-07-17 2016-01-27 가부시키가이샤 히라마 리카 켄큐쇼 Etching solution managing apparatus, dissolved metal concentration measuring apparatus and dissolved metal concentration measuring method
CN105845604B (en) * 2016-03-10 2019-05-07 深圳市华星光电技术有限公司 The monitoring method and system of acid concentration in a kind of etching process
CN106399984B (en) * 2016-08-30 2019-06-25 嘉善天晟精密铸件有限公司 A kind of metal casting surface passivation device and method
CN106399999B (en) * 2016-08-30 2019-07-16 嘉善天晟精密铸件有限公司 A kind of recycling component for metal casting surface treatment
CN106245010B (en) * 2016-08-30 2019-02-19 嘉善天晟精密铸件有限公司 A kind of metal casting surface passivation device
CN106399998B (en) * 2016-08-30 2019-03-12 嘉善天晟精密铸件有限公司 A kind of metal casting surface passivation method
CN110072342B (en) * 2019-04-30 2024-03-01 昆山沪利微电有限公司 A processingequipment for PCB board preparation
EP3771749A1 (en) * 2019-07-29 2021-02-03 Ewald Dörken Ag Method for passivating metallic substrates
CN113046563A (en) * 2021-03-11 2021-06-29 苏州晶洲装备科技有限公司 Etching liquid regeneration device, etching system device and etching method

Also Published As

Publication number Publication date
JP2006013158A (en) 2006-01-12
CN1712567A (en) 2005-12-28
KR20060049695A (en) 2006-05-19

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