TW200613582A - Method and apparatus for regenerating acidic etchant - Google Patents

Method and apparatus for regenerating acidic etchant

Info

Publication number
TW200613582A
TW200613582A TW094120661A TW94120661A TW200613582A TW 200613582 A TW200613582 A TW 200613582A TW 094120661 A TW094120661 A TW 094120661A TW 94120661 A TW94120661 A TW 94120661A TW 200613582 A TW200613582 A TW 200613582A
Authority
TW
Taiwan
Prior art keywords
oxalic acid
etchant
acidic etchant
regenerating
regenerating acidic
Prior art date
Application number
TW094120661A
Other languages
English (en)
Chinese (zh)
Inventor
Takamichi Umeeda
Yoshiya Kitagawa
Original Assignee
Nagase & Co Ltd
Nagase Cms Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase & Co Ltd, Nagase Cms Technology Co Ltd filed Critical Nagase & Co Ltd
Publication of TW200613582A publication Critical patent/TW200613582A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
TW094120661A 2004-06-25 2005-06-21 Method and apparatus for regenerating acidic etchant TW200613582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004188579A JP2006013158A (ja) 2004-06-25 2004-06-25 酸性エッチング液再生方法及び酸性エッチング液再生装置

Publications (1)

Publication Number Publication Date
TW200613582A true TW200613582A (en) 2006-05-01

Family

ID=35718358

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120661A TW200613582A (en) 2004-06-25 2005-06-21 Method and apparatus for regenerating acidic etchant

Country Status (4)

Country Link
JP (1) JP2006013158A (enExample)
KR (1) KR20060049695A (enExample)
CN (1) CN1712567A (enExample)
TW (1) TW200613582A (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790370B1 (ko) * 2006-11-09 2008-01-02 주식회사 에스씨티 폐에칭액의 재생장치 및 그 재생방법
JP2008208396A (ja) * 2007-02-23 2008-09-11 Kobelco Eco-Solutions Co Ltd インジウムの回収方法とその装置
KR101021784B1 (ko) * 2008-10-22 2011-03-17 주식회사 에스씨티 나노막필터를 이용한 에칭액의 재생 장치 및 그 재생방법
JP5340760B2 (ja) * 2009-02-12 2013-11-13 倉敷紡績株式会社 流体制御方法及び流体制御装置
JP2011166006A (ja) * 2010-02-12 2011-08-25 Sumitomo Precision Prod Co Ltd エッチング方法
JP2012178424A (ja) * 2011-02-25 2012-09-13 Dainippon Screen Mfg Co Ltd エッチング液濃度管理装置
JP5795983B2 (ja) 2012-03-27 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6284452B2 (ja) * 2014-07-17 2018-02-28 株式会社平間理化研究所 エッチング液管理装置、エッチング液管理方法、及び、エッチング液の成分濃度測定方法
CN105278566A (zh) * 2014-07-17 2016-01-27 株式会社平间理化研究所 蚀刻液管理装置、溶解金属浓度测定装置及测定方法
KR20160010257A (ko) * 2014-07-17 2016-01-27 가부시키가이샤 히라마 리카 켄큐쇼 에칭액 관리장치, 용해금속 농도 측정장치 및 용해금속 농도 측정방법
KR20160010259A (ko) 2014-07-17 2016-01-27 가부시키가이샤 히라마 리카 켄큐쇼 고체입자 회수 제거장치, 액체 관리장치 및 에칭액 관리장치
CN105845604B (zh) * 2016-03-10 2019-05-07 深圳市华星光电技术有限公司 一种蚀刻过程中酸浓度的监控方法及系统
CN106399984B (zh) * 2016-08-30 2019-06-25 嘉善天晟精密铸件有限公司 一种金属铸件表面钝化装置和方法
CN106399998B (zh) * 2016-08-30 2019-03-12 嘉善天晟精密铸件有限公司 一种金属铸件表面钝化方法
CN106245010B (zh) * 2016-08-30 2019-02-19 嘉善天晟精密铸件有限公司 一种金属铸件表面钝化装置
CN106399999B (zh) * 2016-08-30 2019-07-16 嘉善天晟精密铸件有限公司 一种用于金属铸件表面处理的回收组件
CN110072342B (zh) * 2019-04-30 2024-03-01 昆山沪利微电有限公司 一种用于pcb板制作的加工装置
EP3771749A1 (de) 2019-07-29 2021-02-03 Ewald Dörken Ag Verfahren zur passivierung metallischer substrate
CN113046563A (zh) * 2021-03-11 2021-06-29 苏州晶洲装备科技有限公司 一种刻蚀液再生装置、刻蚀系统装置和刻蚀方法
CN116153812A (zh) * 2022-12-29 2023-05-23 华灿光电（浙江）有限公司 湿法刻蚀装置和湿法刻蚀的控制方法

Also Published As

Publication number Publication date
KR20060049695A (ko) 2006-05-19
JP2006013158A (ja) 2006-01-12
CN1712567A (zh) 2005-12-28

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