JP2005529487A5 - - Google Patents
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- Publication number
- JP2005529487A5 JP2005529487A5 JP2004511910A JP2004511910A JP2005529487A5 JP 2005529487 A5 JP2005529487 A5 JP 2005529487A5 JP 2004511910 A JP2004511910 A JP 2004511910A JP 2004511910 A JP2004511910 A JP 2004511910A JP 2005529487 A5 JP2005529487 A5 JP 2005529487A5
- Authority
- JP
- Japan
- Prior art keywords
- cleaning composition
- hydroxide
- composition according
- cleaning
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38680002P | 2002-06-07 | 2002-06-07 | |
| PCT/US2003/016828 WO2003104900A2 (en) | 2002-06-07 | 2003-05-27 | Microelectronic cleaning compositions containing oxidizers and organic solvents |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005529487A JP2005529487A (ja) | 2005-09-29 |
| JP2005529487A5 true JP2005529487A5 (enExample) | 2007-05-24 |
| JP4304154B2 JP4304154B2 (ja) | 2009-07-29 |
Family
ID=29736216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004511910A Expired - Fee Related JP4304154B2 (ja) | 2002-06-07 | 2003-05-27 | 酸化剤および有機溶媒を含有するマイクロエレクトロニクス洗浄組成物 |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US7419945B2 (enExample) |
| EP (2) | EP1520211A2 (enExample) |
| JP (1) | JP4304154B2 (enExample) |
| KR (1) | KR100958069B1 (enExample) |
| CN (2) | CN102061228B (enExample) |
| AU (1) | AU2003238773A1 (enExample) |
| BR (1) | BR0311827A (enExample) |
| CA (1) | CA2488735A1 (enExample) |
| IL (1) | IL165580A (enExample) |
| IN (1) | IN2004CH02761A (enExample) |
| MY (1) | MY139208A (enExample) |
| NO (1) | NO20050076L (enExample) |
| PL (1) | PL208299B1 (enExample) |
| RS (1) | RS50930B (enExample) |
| TW (1) | TWI322827B (enExample) |
| WO (1) | WO2003104900A2 (enExample) |
| ZA (1) | ZA200409621B (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY143399A (en) * | 2001-07-09 | 2011-05-13 | Avantor Performance Mat Inc | Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning |
| TW200505975A (en) * | 2003-04-18 | 2005-02-16 | Ekc Technology Inc | Aqueous fluoride compositions for cleaning semiconductor devices |
| WO2005083523A1 (en) * | 2004-02-11 | 2005-09-09 | Mallinckrodt Baker Inc. | Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof |
| EP1847880A3 (en) | 2004-02-11 | 2010-02-17 | Mallinckrodt Baker, Inc. | Composition for cleaning microelectronic substrates containing halogen oxygen acids and derivatives thereof |
| BRPI0508291A (pt) * | 2004-03-01 | 2007-07-31 | Mallinckrodt Baker Inc | composições e processo de limpeza para substratos nanoeletrÈnicas e microeletrÈnicas para limpeza |
| JP4524744B2 (ja) * | 2004-04-14 | 2010-08-18 | 日本電気株式会社 | 有機マスクの形成方法及び該有機マスクを利用したパターン形成方法 |
| US7867779B2 (en) | 2005-02-03 | 2011-01-11 | Air Products And Chemicals, Inc. | System and method comprising same for measurement and/or analysis of particles in gas stream |
| EP1875493A2 (en) * | 2005-04-04 | 2008-01-09 | MALLINCKRODT BAKER, Inc. | Composition for cleaning ion implanted photoresist in front end of line applications |
| KR20080005408A (ko) * | 2005-05-06 | 2008-01-11 | 말린크로트 베이커, 인코포레이티드 | 포스트-에치 및 애싱된 포토레지스트 잔류물 및 벌크포토레지스트의 제거를 위한 조성물 |
| CN1862391B (zh) * | 2005-05-13 | 2013-07-10 | 安集微电子(上海)有限公司 | 除光阻层的组合物及其使用方法 |
| CN1862392B (zh) * | 2005-05-13 | 2011-08-03 | 安集微电子(上海)有限公司 | 一种去除光阻层的组合物及其使用方法 |
| WO2006133249A2 (en) * | 2005-06-06 | 2006-12-14 | Advanced Technology Materials, Inc. | Integrated chemical mechanical polishing composition and process for single platen processing |
| KR101477455B1 (ko) * | 2005-06-07 | 2014-12-29 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 금속 및 유전체 상용성 희생 반사 방지 코팅 세정 및 제거 조성물 |
| KR101221560B1 (ko) * | 2005-09-02 | 2013-01-14 | 주식회사 동진쎄미켐 | 변성된 포토레지스트 제거를 위한 반도체 소자용 박리액조성물 |
| CN101366107B (zh) | 2005-10-05 | 2011-08-24 | 高级技术材料公司 | 用于除去蚀刻后残余物的含水氧化清洗剂 |
| AU2006340825A1 (en) | 2005-11-09 | 2007-10-04 | Advanced Technology Materials, Inc. | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon |
| KR101319113B1 (ko) * | 2006-04-13 | 2013-10-17 | 동우 화인켐 주식회사 | 금속용 세정제 |
| KR101449774B1 (ko) * | 2006-12-21 | 2014-10-14 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 에칭 후 잔류물의 제거를 위한 액체 세정제 |
| WO2008114616A1 (ja) * | 2007-03-16 | 2008-09-25 | Mitsubishi Gas Chemical Company, Inc. | 洗浄用組成物、半導体素子の製造方法 |
| JP4952375B2 (ja) | 2007-05-23 | 2012-06-13 | 株式会社明電舎 | レジスト除去方法及びその装置 |
| US8110508B2 (en) | 2007-11-22 | 2012-02-07 | Samsung Electronics Co., Ltd. | Method of forming a bump structure using an etching composition for an under bump metallurgy layer |
| US20100320457A1 (en) * | 2007-11-22 | 2010-12-23 | Masahito Matsubara | Etching solution composition |
| KR101214643B1 (ko) | 2007-12-04 | 2012-12-21 | 메이덴샤 코포레이션 | 레지스트 제거방법 및 그를 위한 장치 |
| CN101359189B (zh) * | 2008-09-17 | 2011-04-27 | 电子科技大学 | 正性光敏聚酰亚胺光刻胶用显影液 |
| US8366954B2 (en) | 2009-01-13 | 2013-02-05 | Avantor Performance Materials, Bv | Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level |
| RU2011139105A (ru) * | 2009-02-25 | 2013-04-10 | Авантор Перформанс Матириалз, Инк. | Композиции для удаления фоторезиста для очистки ионно-имплантированного фоторезиста с пластин полупроводниковых устройств |
| EP2401655B1 (en) * | 2009-02-25 | 2014-03-12 | Avantor Performance Materials, Inc. | Multipurpose acidic, organic solvent based microelectronic cleaning composition |
| US8754021B2 (en) | 2009-02-27 | 2014-06-17 | Advanced Technology Materials, Inc. | Non-amine post-CMP composition and method of use |
| KR20120092501A (ko) * | 2009-06-25 | 2012-08-21 | 램 리서치 아게 | 반도체 웨이퍼의 처리 방법 |
| SG176144A1 (en) | 2009-06-25 | 2011-12-29 | Lam Res Ag | Method for treating a semiconductor wafer |
| ES2711924T3 (es) * | 2010-01-25 | 2019-05-08 | Westinghouse Electric Co Llc | Procedimiento y composición para eliminar depósitos de cal formados en una superficie metálica dentro de un sistema generador de vapor |
| WO2011093849A1 (en) | 2010-01-26 | 2011-08-04 | Dominion Engineering Inc. | Method and composition for removing deposits |
| CN101908503A (zh) * | 2010-07-21 | 2010-12-08 | 河北工业大学 | 超大规模集成电路多层铜布线化学机械抛光后的洁净方法 |
| US8921295B2 (en) | 2010-07-23 | 2014-12-30 | American Sterilizer Company | Biodegradable concentrated neutral detergent composition |
| CN101968610A (zh) * | 2010-08-12 | 2011-02-09 | 武汉华灿光电有限公司 | 一种全湿刻蚀后去胶的方法 |
| CN105869997A (zh) * | 2011-10-21 | 2016-08-17 | 安格斯公司 | 无胺cmp后组合物及其使用方法 |
| JP6066552B2 (ja) | 2011-12-06 | 2017-01-25 | 関東化學株式会社 | 電子デバイス用洗浄液組成物 |
| KR102105381B1 (ko) | 2012-02-15 | 2020-04-29 | 엔테그리스, 아이엔씨. | 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법 |
| EP2927937B1 (en) * | 2012-12-03 | 2018-01-03 | Mitsubishi Gas Chemical Company, Inc. | Cleaning liquid for semiconductor elements and cleaning method using same |
| WO2015002272A1 (ja) * | 2013-07-05 | 2015-01-08 | 和光純薬工業株式会社 | エッチング剤、エッチング方法およびエッチング剤調製液 |
| JP2015108041A (ja) * | 2013-12-03 | 2015-06-11 | ダイキン工業株式会社 | 洗浄用組成物 |
| WO2015119925A1 (en) * | 2014-02-05 | 2015-08-13 | Advanced Technology Materials, Inc. | Non-amine post-cmp compositions and method of use |
| CN103955123A (zh) * | 2014-04-11 | 2014-07-30 | 武汉高芯科技有限公司 | 一种离子注入后晶片的湿法去胶液及光刻胶去除方法 |
| US9567493B2 (en) * | 2014-04-25 | 2017-02-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMP slurry solution for hardened fluid material |
| US9908821B2 (en) | 2015-09-29 | 2018-03-06 | Winfield Solutions, Llc | Micronutrient compositions and systems and methods of using same |
| US9938201B1 (en) | 2016-02-25 | 2018-04-10 | Winfield Solutions, Llc | Micronutrient compositions containing zinc and systems and methods of using same |
| CN108885412B (zh) * | 2016-03-31 | 2022-04-05 | 富士胶片株式会社 | 半导体制造用处理液及图案形成方法 |
| WO2018151164A1 (ja) | 2017-02-20 | 2018-08-23 | 富士フイルム株式会社 | 薬液、薬液収容体、及び、パターン形成方法 |
| AT519943A1 (de) * | 2017-04-29 | 2018-11-15 | Thonhauser Gmbh | Zusammensetzung |
| CN107338126A (zh) * | 2017-06-23 | 2017-11-10 | 昆山欣谷微电子材料有限公司 | 一种水基微电子剥离和清洗液组合物 |
| CN107357143B (zh) | 2017-07-25 | 2018-06-19 | 上海新阳半导体材料股份有限公司 | 一种清洗剂、其制备方法和应用 |
| SG11202107061TA (en) * | 2019-01-11 | 2021-07-29 | Versum Materials Us Llc | Hafnium oxide corrosion inhibitor |
| JP7271993B2 (ja) * | 2019-02-19 | 2023-05-12 | 三菱ケミカル株式会社 | セリウム化合物除去用洗浄液、洗浄方法及び半導体ウェハの製造方法 |
| TWI824299B (zh) * | 2020-09-22 | 2023-12-01 | 美商恩特葛瑞斯股份有限公司 | 蝕刻劑組合物 |
| CN112430508B (zh) * | 2020-12-09 | 2021-10-19 | 淄博鑫欧瑞环保科技有限公司 | 一种消毒粉雾化装置清洁剂、应用及其清洁方法 |
| TW202313944A (zh) * | 2021-07-23 | 2023-04-01 | 美商阿散德性能材料營運公司 | 含有氨基羧酸螯合劑的水溶液 |
| JP2024060243A (ja) * | 2022-10-19 | 2024-05-02 | Jsr株式会社 | 半導体処理用組成物及び処理方法 |
| CN120690667A (zh) * | 2024-03-20 | 2025-09-23 | 达兴材料股份有限公司 | 半导体装置的清洗方法、半导体装置的清洗设备与半导体清洗用组合物 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3673099A (en) | 1970-10-19 | 1972-06-27 | Bell Telephone Labor Inc | Process and composition for stripping cured resins from substrates |
| BE789090A (fr) * | 1971-09-22 | 1973-01-15 | Western Electric Co | Procede et solution d'attaque de semi-conducteurs |
| US4096243A (en) * | 1976-02-09 | 1978-06-20 | Clairol Incorporated | Composition for lightening hair containing an oxidizing agent and certain quaternary amines |
| FR2372904A1 (fr) * | 1976-11-19 | 1978-06-30 | Ibm | Composition de decapage du silicium polycristallin contenant de l'hydroxyde de tetramethylammonium et procede d'application |
| JPS60203944A (ja) * | 1984-03-28 | 1985-10-15 | Mitsubishi Gas Chem Co Inc | ポジ型フオトレジストの除去法 |
| US4744834A (en) | 1986-04-30 | 1988-05-17 | Noor Haq | Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide |
| US5037724A (en) * | 1988-02-25 | 1991-08-06 | Hoya Corporation | Peeling solution for photo- or electron beam-sensitive resin |
| US5002687A (en) * | 1989-04-13 | 1991-03-26 | Lever Brothers Company, Division Of Conopco, Inc. | Fabric washing compositions |
| EP0482275B1 (en) * | 1990-10-22 | 1996-07-10 | The Procter & Gamble Company | Stable liquid detergent compositions containing bleach |
| TW263531B (enExample) * | 1992-03-11 | 1995-11-21 | Mitsubishi Gas Chemical Co | |
| JP3183310B2 (ja) * | 1992-09-25 | 2001-07-09 | 三菱瓦斯化学株式会社 | 半導体基板の洗浄液 |
| US5308745A (en) * | 1992-11-06 | 1994-05-03 | J. T. Baker Inc. | Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins |
| US5498293A (en) * | 1994-06-23 | 1996-03-12 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| US5885362A (en) * | 1995-07-27 | 1999-03-23 | Mitsubishi Chemical Corporation | Method for treating surface of substrate |
| US5911836A (en) * | 1996-02-05 | 1999-06-15 | Mitsubishi Gas Chemical Company, Inc. | Method of producing semiconductor device and rinse for cleaning semiconductor device |
| US6096138A (en) * | 1997-04-30 | 2000-08-01 | Bausch & Lomb Incorporated | Method for inhibiting the deposition of protein on contact lens |
| US5989353A (en) * | 1996-10-11 | 1999-11-23 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| US5993685A (en) * | 1997-04-02 | 1999-11-30 | Advanced Technology Materials | Planarization composition for removing metal films |
| JPH11121418A (ja) * | 1997-10-14 | 1999-04-30 | Kao Corp | 洗浄剤組成物及び洗浄方法 |
| ATE436043T1 (de) * | 1998-05-18 | 2009-07-15 | Mallinckrodt Baker Inc | Alkalische, silikat enthaltende reinigungslösungen für mikroelektronische substrate |
| JP2000056478A (ja) * | 1998-08-04 | 2000-02-25 | Showa Denko Kk | サイドウォール除去液 |
| JP2000202617A (ja) * | 1999-01-06 | 2000-07-25 | Nippon Steel Corp | 溶融金属容器の調心・傾転装置 |
| EP1039518A1 (en) * | 1999-03-24 | 2000-09-27 | Interuniversitair Micro-Elektronica Centrum Vzw | Chemical solution and method for reducing the metal contamination on the surface of a semiconductor substrate |
| JP4224652B2 (ja) * | 1999-03-08 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離液およびそれを用いたレジストの剥離方法 |
| JP2002113431A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄方法 |
| US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
| KR100822236B1 (ko) * | 2000-11-30 | 2008-04-16 | 토소가부시키가이샤 | 레지스트 박리제 |
| JP2003005383A (ja) * | 2000-11-30 | 2003-01-08 | Tosoh Corp | レジスト剥離剤 |
| JP4267359B2 (ja) * | 2002-04-26 | 2009-05-27 | 花王株式会社 | レジスト用剥離剤組成物 |
-
2003
- 2003-05-27 RS YUP-1062/04A patent/RS50930B/sr unknown
- 2003-05-27 JP JP2004511910A patent/JP4304154B2/ja not_active Expired - Fee Related
- 2003-05-27 EP EP03734237A patent/EP1520211A2/en not_active Withdrawn
- 2003-05-27 KR KR1020047019578A patent/KR100958069B1/ko not_active Expired - Lifetime
- 2003-05-27 CA CA002488735A patent/CA2488735A1/en not_active Abandoned
- 2003-05-27 US US10/515,392 patent/US7419945B2/en not_active Expired - Lifetime
- 2003-05-27 WO PCT/US2003/016828 patent/WO2003104900A2/en not_active Ceased
- 2003-05-27 PL PL373809A patent/PL208299B1/pl not_active IP Right Cessation
- 2003-05-27 CN CN2011100064160A patent/CN102061228B/zh not_active Expired - Lifetime
- 2003-05-27 BR BR0311827-4A patent/BR0311827A/pt not_active IP Right Cessation
- 2003-05-27 EP EP08075596A patent/EP2034365A3/en not_active Withdrawn
- 2003-05-27 AU AU2003238773A patent/AU2003238773A1/en not_active Abandoned
- 2003-05-27 CN CN038130351A patent/CN1659481A/zh active Pending
- 2003-06-03 TW TW092115125A patent/TWI322827B/zh not_active IP Right Cessation
- 2003-06-06 MY MYPI20032125A patent/MY139208A/en unknown
-
2004
- 2004-11-29 ZA ZA200409621A patent/ZA200409621B/en unknown
- 2004-12-06 IL IL165580A patent/IL165580A/en unknown
- 2004-12-07 IN IN2761CH2004 patent/IN2004CH02761A/en unknown
-
2005
- 2005-01-06 NO NO20050076A patent/NO20050076L/no not_active Application Discontinuation
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