JP2005503030A - 粉末金属を用いて導電回路を作製する方法 - Google Patents

粉末金属を用いて導電回路を作製する方法 Download PDF

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Publication number
JP2005503030A
JP2005503030A JP2003528081A JP2003528081A JP2005503030A JP 2005503030 A JP2005503030 A JP 2005503030A JP 2003528081 A JP2003528081 A JP 2003528081A JP 2003528081 A JP2003528081 A JP 2003528081A JP 2005503030 A JP2005503030 A JP 2005503030A
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JP
Japan
Prior art keywords
substrate
metal powder
pressure
article
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003528081A
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English (en)
Japanese (ja)
Other versions
JP2005503030A5 (enExample
Inventor
シー． コスケンマキ，デイビッド
ダブリュ． クーンズ，デイビッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2005503030A publication Critical patent/JP2005503030A/ja
Publication of JP2005503030A5 publication Critical patent/JP2005503030A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2003528081A 2001-09-10 2002-09-03 粉末金属を用いて導電回路を作製する方法 Pending JP2005503030A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/952,239 US6805940B2 (en) 2001-09-10 2001-09-10 Method for making conductive circuits using powdered metals
PCT/US2002/027870 WO2003024173A1 (en) 2001-09-10 2002-09-03 Method for making conductive circuits using powdered metals

Publications (2)

Publication Number Publication Date
JP2005503030A true JP2005503030A (ja) 2005-01-27
JP2005503030A5 JP2005503030A5 (enExample) 2006-01-05

Family

ID=25492688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003528081A Pending JP2005503030A (ja) 2001-09-10 2002-09-03 粉末金属を用いて導電回路を作製する方法

Country Status (7)

Country Link
US (2) US6805940B2 (enExample)
EP (1) EP1437037A1 (enExample)
JP (1) JP2005503030A (enExample)
KR (1) KR20040029472A (enExample)
CN (1) CN1640213A (enExample)
MX (1) MXPA04002222A (enExample)
WO (1) WO2003024173A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008086895A (ja) * 2006-09-29 2008-04-17 Dainippon Printing Co Ltd 導電性基板の製造方法及び導電性基板
JP2009510747A (ja) * 2005-09-28 2009-03-12 スティッチング ダッチ ポリマー インスティテュート 金属表面構造物を発生させる方法およびそのための装置

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US7285486B2 (en) * 2001-01-12 2007-10-23 Nippon Steel Materials Co., Ltd. Ball transferring method and apparatus
US6805940B2 (en) * 2001-09-10 2004-10-19 3M Innovative Properties Company Method for making conductive circuits using powdered metals
US7102522B2 (en) 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
JP4630542B2 (ja) * 2003-12-22 2011-02-09 キヤノン株式会社 配線形成方法
US6999028B2 (en) * 2003-12-23 2006-02-14 3M Innovative Properties Company Ultra high frequency radio frequency identification tag
JP4576286B2 (ja) * 2004-05-10 2010-11-04 昭和電工株式会社 電子回路基板の製造方法および電子部品の実装方法
JP2008512019A (ja) * 2004-08-31 2008-04-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｒｆｉｄアンテナを製造する方法
US7417550B2 (en) * 2004-12-20 2008-08-26 3M Innovative Properties Company Environmentally friendly radio frequency identification (RFID) labels and methods of using such labels
KR101274352B1 (ko) * 2005-03-11 2013-06-13 토요잉크Sc홀딩스주식회사 도전성 잉크, 도전 회로, 및 비접촉형 미디어
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
KR100726241B1 (ko) * 2005-05-02 2007-06-11 삼성전기주식회사 금-구리 층을 포함하는 도전성 기판, 모터, 진동모터 및전기 접점용 금속 단자
US7666494B2 (en) * 2005-05-04 2010-02-23 3M Innovative Properties Company Microporous article having metallic nanoparticle coating
KR20060124306A (ko) * 2005-05-31 2006-12-05 삼성전자주식회사 표시 장치용 배선, 이를 포함하는 박막 트랜지스터 표시판및 그 제조 방법
WO2007007865A1 (en) * 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US7935540B2 (en) * 2005-07-14 2011-05-03 3M Innovative Properties Company Water-soluble polymeric substrate having metallic nanoparticle coating
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
US7411500B2 (en) * 2005-09-14 2008-08-12 3M Innovative Properties Company Methods of monitoring items or material from manufacturing processes
US20070218258A1 (en) * 2006-03-20 2007-09-20 3M Innovative Properties Company Articles and methods including patterned substrates formed from densified, adhered metal powders
US20080009211A1 (en) * 2006-07-07 2008-01-10 Matthew Raymond Himes Assemblies useful for the preparation of electronic components and methods for making same
WO2008027719A1 (en) * 2006-08-31 2008-03-06 3M Innovative Properties Company Rfid tag including a three-dimensional antenna
US20080143519A1 (en) * 2006-12-19 2008-06-19 3M Innovative Properties Company Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag
DE102007042411A1 (de) * 2007-09-06 2009-03-12 Robert Bosch Gmbh Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn
US8289163B2 (en) * 2007-09-27 2012-10-16 3M Innovative Properties Company Signal line structure for a radio-frequency identification system
US20090085750A1 (en) * 2007-09-27 2009-04-02 3M Innovative Properties Company Extended RFID tag
US8717244B2 (en) * 2007-10-11 2014-05-06 3M Innovative Properties Company RFID tag with a modified dipole antenna
KR100889482B1 (ko) * 2007-12-10 2009-03-19 한국전자통신연구원 나노 임프린트 공정을 이용한 촉매의 패턴형성방법
US7982616B2 (en) * 2008-02-14 2011-07-19 3M Innovative Properties Company Radio frequency identification (RFID) tag including a three-dimensional loop antenna
TWI383950B (zh) 2009-04-22 2013-02-01 Ind Tech Res Inst 奈米點狀材料的形成方法
CN103262342B (zh) 2010-12-16 2016-08-10 3M创新有限公司 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品
CN102675960B (zh) * 2011-03-08 2015-08-05 深圳市尊业纳米材料有限公司 一种纳米铜锡合金导电油墨及其制备方法和使用方法
CN102833955A (zh) * 2012-08-27 2012-12-19 中国科学院理化技术研究所 一种印刷电路成型方法
JP2014056747A (ja) * 2012-09-13 2014-03-27 Dainippon Screen Mfg Co Ltd 電池用電極製造方法
DE102013200697A1 (de) * 2013-01-17 2014-07-17 Rwth Aachen Verfahren zur Herstellung von strukturierten elektrischen Trägermaterialien
KR102029480B1 (ko) 2013-09-10 2019-10-07 삼성전기주식회사 인쇄회로기판 제조 방법
GB2621955A (en) * 2021-06-02 2024-02-28 Niagara Bottling Llc Plastic container with oxygen scavenger and passive oxygen barrier in body portion
CN114375103A (zh) * 2022-01-28 2022-04-19 孙宇 一种印制电路板生产组件及生产工艺

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US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009510747A (ja) * 2005-09-28 2009-03-12 スティッチング ダッチ ポリマー インスティテュート 金属表面構造物を発生させる方法およびそのための装置
JP2008086895A (ja) * 2006-09-29 2008-04-17 Dainippon Printing Co Ltd 導電性基板の製造方法及び導電性基板

Also Published As

Publication number Publication date
CN1640213A (zh) 2005-07-13
US20050039329A1 (en) 2005-02-24
US20030091789A1 (en) 2003-05-15
KR20040029472A (ko) 2004-04-06
WO2003024173A1 (en) 2003-03-20
EP1437037A1 (en) 2004-07-14
US7237330B2 (en) 2007-07-03
US6805940B2 (en) 2004-10-19
MXPA04002222A (es) 2004-07-08

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