MXPA04002222A - Metodo para elaborar circuitos conductivos usando metales en polvo. - Google Patents
Metodo para elaborar circuitos conductivos usando metales en polvo.Info
- Publication number
- MXPA04002222A MXPA04002222A MXPA04002222A MXPA04002222A MXPA04002222A MX PA04002222 A MXPA04002222 A MX PA04002222A MX PA04002222 A MXPA04002222 A MX PA04002222A MX PA04002222 A MXPA04002222 A MX PA04002222A MX PA04002222 A MXPA04002222 A MX PA04002222A
- Authority
- MX
- Mexico
- Prior art keywords
- substrate
- metal powder
- materials
- template
- pressure
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 64
- 239000012255 powdered metal Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims abstract description 125
- 239000002184 metal Substances 0.000 claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 125
- 239000000843 powder Substances 0.000 claims abstract description 107
- 239000000203 mixture Substances 0.000 claims abstract description 74
- 239000000463 material Substances 0.000 claims abstract description 54
- 238000000151 deposition Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 45
- 239000010949 copper Substances 0.000 claims description 31
- 239000011135 tin Substances 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 238000000280 densification Methods 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
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- 238000012545 processing Methods 0.000 description 6
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
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- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
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- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
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- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
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- 240000000491 Corchorus aestuans Species 0.000 description 1
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
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- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
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- QNZFKUWECYSYPS-UHFFFAOYSA-N lead zirconium Chemical compound [Zr].[Pb] QNZFKUWECYSYPS-UHFFFAOYSA-N 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/952,239 US6805940B2 (en) | 2001-09-10 | 2001-09-10 | Method for making conductive circuits using powdered metals |
| PCT/US2002/027870 WO2003024173A1 (en) | 2001-09-10 | 2002-09-03 | Method for making conductive circuits using powdered metals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA04002222A true MXPA04002222A (es) | 2004-07-08 |
Family
ID=25492688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA04002222A MXPA04002222A (es) | 2001-09-10 | 2002-09-03 | Metodo para elaborar circuitos conductivos usando metales en polvo. |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6805940B2 (enExample) |
| EP (1) | EP1437037A1 (enExample) |
| JP (1) | JP2005503030A (enExample) |
| KR (1) | KR20040029472A (enExample) |
| CN (1) | CN1640213A (enExample) |
| MX (1) | MXPA04002222A (enExample) |
| WO (1) | WO2003024173A1 (enExample) |
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| US7285486B2 (en) * | 2001-01-12 | 2007-10-23 | Nippon Steel Materials Co., Ltd. | Ball transferring method and apparatus |
| US6805940B2 (en) * | 2001-09-10 | 2004-10-19 | 3M Innovative Properties Company | Method for making conductive circuits using powdered metals |
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| JP2008512019A (ja) * | 2004-08-31 | 2008-04-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Ｒｆｉｄアンテナを製造する方法 |
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| WO2007007865A1 (en) * | 2005-07-11 | 2007-01-18 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
| US7935540B2 (en) * | 2005-07-14 | 2011-05-03 | 3M Innovative Properties Company | Water-soluble polymeric substrate having metallic nanoparticle coating |
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| US20080009211A1 (en) * | 2006-07-07 | 2008-01-10 | Matthew Raymond Himes | Assemblies useful for the preparation of electronic components and methods for making same |
| WO2008027719A1 (en) * | 2006-08-31 | 2008-03-06 | 3M Innovative Properties Company | Rfid tag including a three-dimensional antenna |
| JP4858057B2 (ja) * | 2006-09-29 | 2012-01-18 | 大日本印刷株式会社 | 導電性基板の製造方法 |
| US20080143519A1 (en) * | 2006-12-19 | 2008-06-19 | 3M Innovative Properties Company | Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag |
| DE102007042411A1 (de) * | 2007-09-06 | 2009-03-12 | Robert Bosch Gmbh | Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn |
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| US20090085750A1 (en) * | 2007-09-27 | 2009-04-02 | 3M Innovative Properties Company | Extended RFID tag |
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| KR100889482B1 (ko) * | 2007-12-10 | 2009-03-19 | 한국전자통신연구원 | 나노 임프린트 공정을 이용한 촉매의 패턴형성방법 |
| US7982616B2 (en) * | 2008-02-14 | 2011-07-19 | 3M Innovative Properties Company | Radio frequency identification (RFID) tag including a three-dimensional loop antenna |
| TWI383950B (zh) | 2009-04-22 | 2013-02-01 | Ind Tech Res Inst | 奈米點狀材料的形成方法 |
| CN103262342B (zh) | 2010-12-16 | 2016-08-10 | 3M创新有限公司 | 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品 |
| CN102675960B (zh) * | 2011-03-08 | 2015-08-05 | 深圳市尊业纳米材料有限公司 | 一种纳米铜锡合金导电油墨及其制备方法和使用方法 |
| CN102833955A (zh) * | 2012-08-27 | 2012-12-19 | 中国科学院理化技术研究所 | 一种印刷电路成型方法 |
| JP2014056747A (ja) * | 2012-09-13 | 2014-03-27 | Dainippon Screen Mfg Co Ltd | 電池用電極製造方法 |
| DE102013200697A1 (de) * | 2013-01-17 | 2014-07-17 | Rwth Aachen | Verfahren zur Herstellung von strukturierten elektrischen Trägermaterialien |
| KR102029480B1 (ko) | 2013-09-10 | 2019-10-07 | 삼성전기주식회사 | 인쇄회로기판 제조 방법 |
| GB2621955A (en) * | 2021-06-02 | 2024-02-28 | Niagara Bottling Llc | Plastic container with oxygen scavenger and passive oxygen barrier in body portion |
| CN114375103A (zh) * | 2022-01-28 | 2022-04-19 | 孙宇 | 一种印制电路板生产组件及生产工艺 |
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| US6805940B2 (en) | 2001-09-10 | 2004-10-19 | 3M Innovative Properties Company | Method for making conductive circuits using powdered metals |
| US6816125B2 (en) * | 2003-03-01 | 2004-11-09 | 3M Innovative Properties Company | Forming electromagnetic communication circuit components using densified metal powder |
-
2001
- 2001-09-10 US US09/952,239 patent/US6805940B2/en not_active Expired - Lifetime
-
2002
- 2002-09-03 WO PCT/US2002/027870 patent/WO2003024173A1/en not_active Ceased
- 2002-09-03 CN CNA028176170A patent/CN1640213A/zh active Pending
- 2002-09-03 MX MXPA04002222A patent/MXPA04002222A/es active IP Right Grant
- 2002-09-03 JP JP2003528081A patent/JP2005503030A/ja active Pending
- 2002-09-03 KR KR10-2004-7003465A patent/KR20040029472A/ko not_active Ceased
- 2002-09-03 EP EP02763596A patent/EP1437037A1/en not_active Withdrawn
-
2004
- 2004-09-29 US US10/952,673 patent/US7237330B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1640213A (zh) | 2005-07-13 |
| US20050039329A1 (en) | 2005-02-24 |
| US20030091789A1 (en) | 2003-05-15 |
| KR20040029472A (ko) | 2004-04-06 |
| WO2003024173A1 (en) | 2003-03-20 |
| EP1437037A1 (en) | 2004-07-14 |
| US7237330B2 (en) | 2007-07-03 |
| US6805940B2 (en) | 2004-10-19 |
| JP2005503030A (ja) | 2005-01-27 |
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