KR20040029472A - 분말 금속을 사용하여 도전성 회로를 제조하는 방법 - Google Patents
분말 금속을 사용하여 도전성 회로를 제조하는 방법 Download PDFInfo
- Publication number
- KR20040029472A KR20040029472A KR10-2004-7003465A KR20047003465A KR20040029472A KR 20040029472 A KR20040029472 A KR 20040029472A KR 20047003465 A KR20047003465 A KR 20047003465A KR 20040029472 A KR20040029472 A KR 20040029472A
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- South Korea
- Prior art keywords
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- metal powder
- pressure
- conductive pattern
- composition
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/24331—Composite web or sheet including nonapertured component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/952,239 US6805940B2 (en) | 2001-09-10 | 2001-09-10 | Method for making conductive circuits using powdered metals |
| US09/952,239 | 2001-09-10 | ||
| PCT/US2002/027870 WO2003024173A1 (en) | 2001-09-10 | 2002-09-03 | Method for making conductive circuits using powdered metals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040029472A true KR20040029472A (ko) | 2004-04-06 |
Family
ID=25492688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2004-7003465A Ceased KR20040029472A (ko) | 2001-09-10 | 2002-09-03 | 분말 금속을 사용하여 도전성 회로를 제조하는 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6805940B2 (enExample) |
| EP (1) | EP1437037A1 (enExample) |
| JP (1) | JP2005503030A (enExample) |
| KR (1) | KR20040029472A (enExample) |
| CN (1) | CN1640213A (enExample) |
| MX (1) | MXPA04002222A (enExample) |
| WO (1) | WO2003024173A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100726241B1 (ko) * | 2005-05-02 | 2007-06-11 | 삼성전기주식회사 | 금-구리 층을 포함하는 도전성 기판, 모터, 진동모터 및전기 접점용 금속 단자 |
| KR20150029383A (ko) | 2013-09-10 | 2015-03-18 | 삼성전기주식회사 | 인쇄회로기판 제조 방법 |
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| US20080009211A1 (en) * | 2006-07-07 | 2008-01-10 | Matthew Raymond Himes | Assemblies useful for the preparation of electronic components and methods for making same |
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| DE102007042411A1 (de) * | 2007-09-06 | 2009-03-12 | Robert Bosch Gmbh | Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn |
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| US6586683B2 (en) * | 2001-04-27 | 2003-07-01 | International Business Machines Corporation | Printed circuit board with mixed metallurgy pads and method of fabrication |
| JP3670987B2 (ja) | 2001-08-13 | 2005-07-13 | インターナショナル・ビジネス・マシーンズ・コーポレーション | アンテナユニット及びそれを備えたコンピュータ端末 |
| US6805940B2 (en) | 2001-09-10 | 2004-10-19 | 3M Innovative Properties Company | Method for making conductive circuits using powdered metals |
| US6816125B2 (en) * | 2003-03-01 | 2004-11-09 | 3M Innovative Properties Company | Forming electromagnetic communication circuit components using densified metal powder |
-
2001
- 2001-09-10 US US09/952,239 patent/US6805940B2/en not_active Expired - Lifetime
-
2002
- 2002-09-03 WO PCT/US2002/027870 patent/WO2003024173A1/en not_active Ceased
- 2002-09-03 CN CNA028176170A patent/CN1640213A/zh active Pending
- 2002-09-03 MX MXPA04002222A patent/MXPA04002222A/es active IP Right Grant
- 2002-09-03 JP JP2003528081A patent/JP2005503030A/ja active Pending
- 2002-09-03 KR KR10-2004-7003465A patent/KR20040029472A/ko not_active Ceased
- 2002-09-03 EP EP02763596A patent/EP1437037A1/en not_active Withdrawn
-
2004
- 2004-09-29 US US10/952,673 patent/US7237330B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100726241B1 (ko) * | 2005-05-02 | 2007-06-11 | 삼성전기주식회사 | 금-구리 층을 포함하는 도전성 기판, 모터, 진동모터 및전기 접점용 금속 단자 |
| KR20150029383A (ko) | 2013-09-10 | 2015-03-18 | 삼성전기주식회사 | 인쇄회로기판 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1640213A (zh) | 2005-07-13 |
| US20050039329A1 (en) | 2005-02-24 |
| US20030091789A1 (en) | 2003-05-15 |
| WO2003024173A1 (en) | 2003-03-20 |
| EP1437037A1 (en) | 2004-07-14 |
| US7237330B2 (en) | 2007-07-03 |
| US6805940B2 (en) | 2004-10-19 |
| MXPA04002222A (es) | 2004-07-08 |
| JP2005503030A (ja) | 2005-01-27 |
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