JP2005503030A5 - - Google Patents

Download PDF

Info

Publication number
JP2005503030A5
JP2005503030A5 JP2003528081A JP2003528081A JP2005503030A5 JP 2005503030 A5 JP2005503030 A5 JP 2005503030A5 JP 2003528081 A JP2003528081 A JP 2003528081A JP 2003528081 A JP2003528081 A JP 2003528081A JP 2005503030 A5 JP2005503030 A5 JP 2005503030A5
Authority
JP
Japan
Prior art keywords
substrate
conductive pattern
fibrous material
paper
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003528081A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005503030A (ja
Filing date
Publication date
Priority claimed from US09/952,239 external-priority patent/US6805940B2/en
Application filed filed Critical
Publication of JP2005503030A publication Critical patent/JP2005503030A/ja
Publication of JP2005503030A5 publication Critical patent/JP2005503030A5/ja
Pending legal-status Critical Current

Links

JP2003528081A 2001-09-10 2002-09-03 粉末金属を用いて導電回路を作製する方法 Pending JP2005503030A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/952,239 US6805940B2 (en) 2001-09-10 2001-09-10 Method for making conductive circuits using powdered metals
PCT/US2002/027870 WO2003024173A1 (en) 2001-09-10 2002-09-03 Method for making conductive circuits using powdered metals

Publications (2)

Publication Number Publication Date
JP2005503030A JP2005503030A (ja) 2005-01-27
JP2005503030A5 true JP2005503030A5 (enExample) 2006-01-05

Family

ID=25492688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003528081A Pending JP2005503030A (ja) 2001-09-10 2002-09-03 粉末金属を用いて導電回路を作製する方法

Country Status (7)

Country Link
US (2) US6805940B2 (enExample)
EP (1) EP1437037A1 (enExample)
JP (1) JP2005503030A (enExample)
KR (1) KR20040029472A (enExample)
CN (1) CN1640213A (enExample)
MX (1) MXPA04002222A (enExample)
WO (1) WO2003024173A1 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285486B2 (en) * 2001-01-12 2007-10-23 Nippon Steel Materials Co., Ltd. Ball transferring method and apparatus
US6805940B2 (en) * 2001-09-10 2004-10-19 3M Innovative Properties Company Method for making conductive circuits using powdered metals
US7102522B2 (en) 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
JP4630542B2 (ja) * 2003-12-22 2011-02-09 キヤノン株式会社 配線形成方法
US6999028B2 (en) * 2003-12-23 2006-02-14 3M Innovative Properties Company Ultra high frequency radio frequency identification tag
JP4576286B2 (ja) * 2004-05-10 2010-11-04 昭和電工株式会社 電子回路基板の製造方法および電子部品の実装方法
JP2008512019A (ja) * 2004-08-31 2008-04-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｒｆｉｄアンテナを製造する方法
US7417550B2 (en) * 2004-12-20 2008-08-26 3M Innovative Properties Company Environmentally friendly radio frequency identification (RFID) labels and methods of using such labels
KR101274352B1 (ko) * 2005-03-11 2013-06-13 토요잉크Sc홀딩스주식회사 도전성 잉크, 도전 회로, 및 비접촉형 미디어
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
KR100726241B1 (ko) * 2005-05-02 2007-06-11 삼성전기주식회사 금-구리 층을 포함하는 도전성 기판, 모터, 진동모터 및전기 접점용 금속 단자
US7666494B2 (en) * 2005-05-04 2010-02-23 3M Innovative Properties Company Microporous article having metallic nanoparticle coating
KR20060124306A (ko) * 2005-05-31 2006-12-05 삼성전자주식회사 표시 장치용 배선, 이를 포함하는 박막 트랜지스터 표시판및 그 제조 방법
WO2007007865A1 (en) * 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US7935540B2 (en) * 2005-07-14 2011-05-03 3M Innovative Properties Company Water-soluble polymeric substrate having metallic nanoparticle coating
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
US7411500B2 (en) * 2005-09-14 2008-08-12 3M Innovative Properties Company Methods of monitoring items or material from manufacturing processes
WO2007038950A1 (en) * 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
US20070218258A1 (en) * 2006-03-20 2007-09-20 3M Innovative Properties Company Articles and methods including patterned substrates formed from densified, adhered metal powders
US20080009211A1 (en) * 2006-07-07 2008-01-10 Matthew Raymond Himes Assemblies useful for the preparation of electronic components and methods for making same
WO2008027719A1 (en) * 2006-08-31 2008-03-06 3M Innovative Properties Company Rfid tag including a three-dimensional antenna
JP4858057B2 (ja) * 2006-09-29 2012-01-18 大日本印刷株式会社 導電性基板の製造方法
US20080143519A1 (en) * 2006-12-19 2008-06-19 3M Innovative Properties Company Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag
DE102007042411A1 (de) * 2007-09-06 2009-03-12 Robert Bosch Gmbh Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn
US8289163B2 (en) * 2007-09-27 2012-10-16 3M Innovative Properties Company Signal line structure for a radio-frequency identification system
US20090085750A1 (en) * 2007-09-27 2009-04-02 3M Innovative Properties Company Extended RFID tag
US8717244B2 (en) * 2007-10-11 2014-05-06 3M Innovative Properties Company RFID tag with a modified dipole antenna
KR100889482B1 (ko) * 2007-12-10 2009-03-19 한국전자통신연구원 나노 임프린트 공정을 이용한 촉매의 패턴형성방법
US7982616B2 (en) * 2008-02-14 2011-07-19 3M Innovative Properties Company Radio frequency identification (RFID) tag including a three-dimensional loop antenna
TWI383950B (zh) 2009-04-22 2013-02-01 Ind Tech Res Inst 奈米點狀材料的形成方法
CN103262342B (zh) 2010-12-16 2016-08-10 3M创新有限公司 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品
CN102675960B (zh) * 2011-03-08 2015-08-05 深圳市尊业纳米材料有限公司 一种纳米铜锡合金导电油墨及其制备方法和使用方法
CN102833955A (zh) * 2012-08-27 2012-12-19 中国科学院理化技术研究所 一种印刷电路成型方法
JP2014056747A (ja) * 2012-09-13 2014-03-27 Dainippon Screen Mfg Co Ltd 電池用電極製造方法
DE102013200697A1 (de) * 2013-01-17 2014-07-17 Rwth Aachen Verfahren zur Herstellung von strukturierten elektrischen Trägermaterialien
KR102029480B1 (ko) 2013-09-10 2019-10-07 삼성전기주식회사 인쇄회로기판 제조 방법
GB2621955A (en) * 2021-06-02 2024-02-28 Niagara Bottling Llc Plastic container with oxygen scavenger and passive oxygen barrier in body portion
CN114375103A (zh) * 2022-01-28 2022-04-19 孙宇 一种印制电路板生产组件及生产工艺

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB690478A (en) 1948-11-12 1953-04-22 Ward Blenkinsop & Co Ltd Improvements in or relating to electrical resistors
US2757443A (en) * 1953-01-21 1956-08-07 Erie Resistor Corp Method of making printed circuits
US2963748A (en) 1957-05-27 1960-12-13 Young Lawrence John Printed circuits
US3628243A (en) * 1969-11-14 1971-12-21 Bell Telephone Labor Inc Fabrication of printed circuit
US3800020A (en) 1972-03-23 1974-03-26 Cramer P Co Method of making a circuit board
US4247498A (en) 1976-08-30 1981-01-27 Akzona Incorporated Methods for making microporous products
US4247489A (en) * 1979-10-01 1981-01-27 Olin Corporation Process for preparing tetrachloro-butyl secondary phosphites
US4403107A (en) 1980-12-15 1983-09-06 Amp Incorporated Stamped circuit board
US5061438A (en) 1983-09-21 1991-10-29 Allied-Signal Inc. Method of making a printed circuit board
US4614837A (en) 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
CA1298740C (en) * 1987-06-30 1992-04-14 William John Parr Conductive metallization of substrates without developing agents
US4799983A (en) * 1987-07-20 1989-01-24 International Business Machines Corporation Multilayer ceramic substrate and process for forming therefor
US4867881A (en) 1987-09-14 1989-09-19 Minnesota Minning And Manufacturing Company Orientied microporous film
US5059485A (en) 1988-06-08 1991-10-22 Akzo America Inc. Conductive metallization of substances without developing agents
US5032450A (en) 1990-01-31 1991-07-16 Ppg Industries, Inc. Microporous material having a coating of hydrophobic polymer
US5196262A (en) 1990-10-10 1993-03-23 Ppg Industries, Inc. Microporous material
US5087494A (en) * 1991-04-12 1992-02-11 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
US5761801A (en) * 1995-06-07 1998-06-09 The Dexter Corporation Method for making a conductive film composite
US5817834A (en) 1998-02-09 1998-10-06 American Cyanamid Company Process for the preparation of 2-aryl-5-(perfluoro-alkyl) pyrrole compounds from N-(perfluoroalkyl-methyl) arylimidoyl chloride compounds
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US6271793B1 (en) 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
US6524758B2 (en) 1999-12-20 2003-02-25 Electrox Corporation Method of manufacture of printed wiring boards and flexible circuitry
ES2351549T3 (es) 2000-03-21 2011-02-07 Mikoh Corporation Una etiqueta de identificación por radiofrecuencia con indicación de manipulación indebida.
US6586683B2 (en) * 2001-04-27 2003-07-01 International Business Machines Corporation Printed circuit board with mixed metallurgy pads and method of fabrication
JP3670987B2 (ja) 2001-08-13 2005-07-13 インターナショナル・ビジネス・マシーンズ・コーポレーション アンテナユニット及びそれを備えたコンピュータ端末
US6805940B2 (en) 2001-09-10 2004-10-19 3M Innovative Properties Company Method for making conductive circuits using powdered metals
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder

Similar Documents

Publication Publication Date Title
JP2005503030A5 (enExample)
JP2003073964A5 (enExample)
ATE166916T1 (de) Herstellung von formkörpern durch siebdruck
JP2005518474A5 (enExample)
JP2002532274A5 (enExample)
WO2007109594A3 (en) Articles and methods including patterned substrates formed from densified, adhered metal powders
DE60110996D1 (de) Reibungsmaterial dass durch Absetzung von Reibungsmodifiziermitteln aus kohlenstoffenthaltenden Reibungsmaterialien hergestellt ist
JP2008540856A5 (enExample)
BR0213945A (pt) Processo, composição e revestimento de material laminado
CA2054269A1 (en) High loft and high strength nonwoven fabric
WO1979001014A1 (fr) Methode de fabrication de tissus non tisses
CA2485730A1 (en) Stitch-bonded fabrics utilizing stretchable substrates
MY134873A (en) Dual cured abrasive articles
EP1743971A3 (fr) Non-tissé comprenant une nappe en filaments continus, son procédé de fabrication et son application en tant que chiffon d'essuyage
JP2003507417A5 (enExample)
IL165211A0 (en) Triggered start products and processes for the production and use thereof
JP2004204085A5 (enExample)
KR960014037A (ko) 플라즈마 불소 저항 다결정 알루미나 세라믹 재료 및 그 제조방법
CA2574299A1 (en) Fabric structure for use in paper machine and manufacturing method thereof
WO2002022522A3 (de) Silicium-bor-kohlenstoff-stickstoff-keramiken und vorläuferverbindungen, verfahren zu deren herstellung sowie deren verwendung
JP2007511372A5 (enExample)
JPWO2019195406A5 (enExample)
ATE70754T1 (de) Herstellung von flachen produkten aus pulvermaterial.
JP2000079754A5 (enExample)
JPH11291376A5 (enExample)