JP2005503017A5 - - Google Patents

Download PDF

Info

Publication number
JP2005503017A5
JP2005503017A5 JP2003527775A JP2003527775A JP2005503017A5 JP 2005503017 A5 JP2005503017 A5 JP 2005503017A5 JP 2003527775 A JP2003527775 A JP 2003527775A JP 2003527775 A JP2003527775 A JP 2003527775A JP 2005503017 A5 JP2005503017 A5 JP 2005503017A5
Authority
JP
Japan
Prior art keywords
pressure chamber
fluid
pressure
assembly
chamber assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003527775A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005503017A (ja
Filing date
Publication date
Priority claimed from US09/951,355 external-priority patent/US6619304B2/en
Application filed filed Critical
Publication of JP2005503017A publication Critical patent/JP2005503017A/ja
Publication of JP2005503017A5 publication Critical patent/JP2005503017A5/ja
Pending legal-status Critical Current

Links

JP2003527775A 2001-09-13 2002-07-30 駆動手段を含む圧力チャンバアセンブリ Pending JP2005503017A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/951,355 US6619304B2 (en) 2001-09-13 2001-09-13 Pressure chamber assembly including non-mechanical drive means
PCT/US2002/024004 WO2003023827A1 (en) 2001-09-13 2002-07-30 Pressure chamber assembly including drive means

Publications (2)

Publication Number Publication Date
JP2005503017A JP2005503017A (ja) 2005-01-27
JP2005503017A5 true JP2005503017A5 (https=) 2006-01-05

Family

ID=25491593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003527775A Pending JP2005503017A (ja) 2001-09-13 2002-07-30 駆動手段を含む圧力チャンバアセンブリ

Country Status (7)

Country Link
US (1) US6619304B2 (https=)
EP (1) EP1425780A1 (https=)
JP (1) JP2005503017A (https=)
KR (1) KR20040035772A (https=)
CN (1) CN1585999A (https=)
TW (1) TWI222127B (https=)
WO (1) WO2003023827A1 (https=)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6314601B1 (en) * 1999-09-24 2001-11-13 Mcclain James B. System for the control of a carbon dioxide cleaning apparatus
US7080651B2 (en) * 2001-05-17 2006-07-25 Dainippon Screen Mfg. Co., Ltd. High pressure processing apparatus and method
JP3836765B2 (ja) * 2002-08-02 2006-10-25 株式会社神戸製鋼所 高圧処理装置
US7392815B2 (en) * 2003-03-31 2008-07-01 Lam Research Corporation Chamber for wafer cleaning and method for making the same
US20050022850A1 (en) * 2003-07-29 2005-02-03 Supercritical Systems, Inc. Regulation of flow of processing chemistry only into a processing chamber
EP1503401A1 (en) * 2003-08-01 2005-02-02 Vlaamse Instelling Voor Technologisch Onderzoek (Vito) Method and apparatus for cleaning a substrate by using a supercritical fluid
WO2005092487A1 (ja) * 2004-03-26 2005-10-06 National Institute Of Advanced Industrial Science And Technology 超臨界処理方法およびそれに用いる装置
TWI250559B (en) * 2004-07-09 2006-03-01 Innolux Display Corp Coating apparatus and coating method using the same
KR101121417B1 (ko) * 2004-10-28 2012-03-15 주성엔지니어링(주) 표시소자의 제조장치
JP2007036109A (ja) * 2005-07-29 2007-02-08 Dainippon Screen Mfg Co Ltd 高圧処理装置
US20090179158A1 (en) * 2008-01-16 2009-07-16 Varian Semiconductor Equpiment Associate, Inc. In-vacuum protective liners
US8020398B2 (en) * 2008-10-02 2011-09-20 Varian Semiconductor Equipment Associates, Inc. Fluid delivery mechanism for vacuum wafer processing system
US8282268B2 (en) * 2009-02-24 2012-10-09 Island Oasis Frozen Cocktail Co., Inc. Magnetic drive for food processing apparatus
US9166139B2 (en) * 2009-05-14 2015-10-20 The Neothermal Energy Company Method for thermally cycling an object including a polarizable material
US8550388B2 (en) 2010-03-15 2013-10-08 Moog Inc. Drive circuit with integrated power factor correction for blender/shaver machine
US8888086B2 (en) * 2011-05-11 2014-11-18 Sematech, Inc. Apparatus with surface protector to inhibit contamination
US9597701B2 (en) * 2013-12-31 2017-03-21 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US9657397B2 (en) * 2013-12-31 2017-05-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
EP3115190B1 (de) * 2015-07-06 2020-11-18 Feintool International Holding AG Vorrichtung und verfahren zum steuern des hauptantriebs einer feinschneidpresse
GB201703549D0 (en) * 2017-03-06 2017-04-19 Hodges & Drake Design Ltd Apparatus for dispensing a flowable product
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10847360B2 (en) 2017-05-25 2020-11-24 Applied Materials, Inc. High pressure treatment of silicon nitride film
KR102574914B1 (ko) 2017-06-02 2023-09-04 어플라이드 머티어리얼스, 인코포레이티드 보론 카바이드 하드마스크의 건식 스트리핑
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 高圧高温下のアニールチャンバ
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
CN111095524B (zh) 2017-09-12 2023-10-03 应用材料公司 用于使用保护阻挡物层制造半导体结构的设备和方法
US10643867B2 (en) 2017-11-03 2020-05-05 Applied Materials, Inc. Annealing system and method
JP7122102B2 (ja) 2017-11-08 2022-08-19 東京エレクトロン株式会社 ガス供給システム及びガス供給方法
KR102585074B1 (ko) 2017-11-11 2023-10-04 마이크로머티어리얼즈 엘엘씨 고압 프로세싱 챔버를 위한 가스 전달 시스템
SG11202003438QA (en) 2017-11-16 2020-05-28 Applied Materials Inc High pressure steam anneal processing apparatus
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 高圧処理システムのためのコンデンサシステム
JP7299898B2 (ja) 2018-01-24 2023-06-28 アプライド マテリアルズ インコーポレイテッド 高圧アニールを用いたシーム修復
CN111902929B (zh) 2018-03-09 2025-09-19 应用材料公司 用于含金属材料的高压退火处理
US10714331B2 (en) 2018-04-04 2020-07-14 Applied Materials, Inc. Method to fabricate thermally stable low K-FinFET spacer
KR102126180B1 (ko) * 2018-04-30 2020-06-26 세메스 주식회사 기판 처리 장치 및 방법
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10566188B2 (en) 2018-05-17 2020-02-18 Applied Materials, Inc. Method to improve film stability
US10704141B2 (en) 2018-06-01 2020-07-07 Applied Materials, Inc. In-situ CVD and ALD coating of chamber to control metal contamination
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
US11964290B2 (en) * 2018-09-12 2024-04-23 Smc Corporation Compressed-fluid discharge control device
JP7179172B6 (ja) 2018-10-30 2022-12-16 アプライド マテリアルズ インコーポレイテッド 半導体用途の構造体をエッチングするための方法
KR20210077779A (ko) 2018-11-16 2021-06-25 어플라이드 머티어리얼스, 인코포레이티드 강화된 확산 프로세스를 사용한 막 증착
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
WO2020149936A1 (en) * 2019-01-18 2020-07-23 Applied Materials, Inc. Heated pedestal design for improved heat transfer and temperature uniformity
KR102616514B1 (ko) * 2019-03-14 2023-12-26 주식회사 케이씨텍 기판 처리 장치 및 기판 처리 방법
KR102210830B1 (ko) * 2019-03-25 2021-02-02 무진전자 주식회사 기판 건조 챔버
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
EP4189150A4 (en) * 2020-07-30 2024-08-21 Cool Clean Technologies, LLC PROCEDURES FOR HANDLING PERSONAL PROTECTIVE EQUIPMENT
KR102852007B1 (ko) * 2020-12-30 2025-08-29 세메스 주식회사 지지 장치 및 지지 장치를 포함하는 기판 처리 장치
CN113322449B (zh) * 2021-05-26 2022-10-21 北京北方华创微电子装备有限公司 半导体工艺设备及其承载装置
US20230072156A1 (en) * 2021-09-02 2023-03-09 Wonik Ips Co., Ltd. Substrate processing apparatus

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4106825A (en) 1976-12-13 1978-08-15 Autoclave Engineers, Inc. High pressure magnetic drive including magnetic thrust bearings
WO1992005922A1 (en) 1990-09-27 1992-04-16 Genmark Automation Vacuum elevator
JP3512796B2 (ja) 1992-03-27 2004-03-31 ザ ユニバーシティ オブ ノース カロライナ アット チャペル ヒル フルオロポリマーの製造方法
US5324540A (en) * 1992-08-17 1994-06-28 Tokyo Electron Limited System and method for supporting and rotating substrates in a process chamber
US5514220A (en) 1992-12-09 1996-05-07 Wetmore; Paula M. Pressure pulse cleaning
DE69523208T2 (de) 1994-04-08 2002-06-27 Texas Instruments Inc., Dallas Verfahren zur Reinigung von Halbleiterscheiben mittels verflüssigter Gase
US5482564A (en) 1994-06-21 1996-01-09 Texas Instruments Incorporated Method of unsticking components of micro-mechanical devices
US5522938A (en) 1994-08-08 1996-06-04 Texas Instruments Incorporated Particle removal in supercritical liquids using single frequency acoustic waves
US5982986A (en) 1995-02-03 1999-11-09 Applied Materials, Inc. Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
DE19506404C1 (de) 1995-02-23 1996-03-14 Siemens Ag Verfahren zum Freiätzen (Separieren) und Trocknen mikromechanischer Komponenten
JPH08330266A (ja) 1995-05-31 1996-12-13 Texas Instr Inc <Ti> 半導体装置等の表面を浄化し、処理する方法
TW331652B (en) * 1995-06-16 1998-05-11 Ebara Corp Thin film vapor deposition apparatus
US5783082A (en) 1995-11-03 1998-07-21 University Of North Carolina Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
US5868856A (en) 1996-07-25 1999-02-09 Texas Instruments Incorporated Method for removing inorganic contamination by chemical derivitization and extraction
US5868862A (en) 1996-08-01 1999-02-09 Texas Instruments Incorporated Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media
US5908510A (en) 1996-10-16 1999-06-01 International Business Machines Corporation Residue removal by supercritical fluids
US6149828A (en) 1997-05-05 2000-11-21 Micron Technology, Inc. Supercritical etching compositions and method of using same
US6500605B1 (en) 1997-05-27 2002-12-31 Tokyo Electron Limited Removal of photoresist and residue from substrate using supercritical carbon dioxide process
EP0986667B1 (en) 1997-05-30 2009-01-07 Micell Integrated Systems, Inc. Surface treatment
EP0899857B1 (de) * 1997-08-25 2007-11-28 LUST ANTRIEBSTECHNIK GmbH Magnetgelagerte Rotationsanordnung
US6001418A (en) 1997-12-16 1999-12-14 The University Of North Carolina At Chapel Hill Spin coating method and apparatus for liquid carbon dioxide systems
US6067728A (en) 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
US6242165B1 (en) 1998-08-28 2001-06-05 Micron Technology, Inc. Supercritical compositions for removal of organic material and methods of using same
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
JP3579278B2 (ja) * 1999-01-26 2004-10-20 東京エレクトロン株式会社 縦型熱処理装置及びシール装置
US6412503B1 (en) * 1999-06-01 2002-07-02 Applied Materials, Inc. Magnetically coupled substrate roller
KR100744888B1 (ko) 1999-11-02 2007-08-01 동경 엘렉트론 주식회사 소재를 초임계 처리하기 위한 장치 및 방법

Similar Documents

Publication Publication Date Title
JP2005503017A5 (https=)
CN102712352B (zh) 海底压力补偿系统
US20150267704A1 (en) Sealed magnetic drive for rotary machine
DE69721549D1 (en) Ferrofluidabdichtung
WO2000011237A1 (en) Drive mechanism for vacuum device and vacuum device
KR20220024277A (ko) 스테이지 장치 및 처리 장치
JPS63174802A (ja) 回転駆動装置
SG86289A1 (en) Underwater servicing device
WO2001089763A3 (en) Multilayer retaining ring for chemical mechanical polishing
JP2016537558A (ja) ピストン式圧縮機および極低温ガス状媒体、特に水素を圧縮する方法
CA2288479A1 (en) Gimbal and seal for the drivehead of a downhole rotary pump
US20150113915A1 (en) Food vessel packing apparatus
US9488180B2 (en) Efficient and reliable subsea compression system
WO2014135033A1 (zh) 磁力密封展箱
CN1690490B (zh) 关闭真空室开口的关闭阀和方法
TW201034352A (en) Motor drive particularly for subnersed electric pumps
JP2018051707A (ja) 水槽壁面研磨装置及び水槽壁面研磨方法
CN112825278B (zh) 一种用于磁共振成像设备的低温恒温器构造及磁共振成像设备
JP5481079B2 (ja) ゲートバルブ及びゲートバルブの開閉方法
CN112110323A (zh) 一种真空吸附装置及系统
CN113939903B (zh) 吸附装置以及真空处理装置
CN215045410U (zh) 一种真空保鲜设备的抽真空阀体及真空保鲜设备
JP4106683B2 (ja) 流体の吸引吐出装置
JP2006337619A (ja) 基板貼り合わせ装置及び基板貼り合わせ方法
JPH05126051A (ja) ダイヤフラムポンプ