TWI222127B - Pressure chamber assembly including drive means - Google Patents

Pressure chamber assembly including drive means Download PDF

Info

Publication number
TWI222127B
TWI222127B TW091111057A TW91111057A TWI222127B TW I222127 B TWI222127 B TW I222127B TW 091111057 A TW091111057 A TW 091111057A TW 91111057 A TW91111057 A TW 91111057A TW I222127 B TWI222127 B TW I222127B
Authority
TW
Taiwan
Prior art keywords
pressure chamber
pressure
fluid
assembly
substrate
Prior art date
Application number
TW091111057A
Other languages
English (en)
Chinese (zh)
Inventor
Steven Lee Worm
Original Assignee
Micell Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micell Technologies Inc filed Critical Micell Technologies Inc
Application granted granted Critical
Publication of TWI222127B publication Critical patent/TWI222127B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW091111057A 2001-09-13 2002-05-24 Pressure chamber assembly including drive means TWI222127B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/951,355 US6619304B2 (en) 2001-09-13 2001-09-13 Pressure chamber assembly including non-mechanical drive means

Publications (1)

Publication Number Publication Date
TWI222127B true TWI222127B (en) 2004-10-11

Family

ID=25491593

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091111057A TWI222127B (en) 2001-09-13 2002-05-24 Pressure chamber assembly including drive means

Country Status (7)

Country Link
US (1) US6619304B2 (https=)
EP (1) EP1425780A1 (https=)
JP (1) JP2005503017A (https=)
KR (1) KR20040035772A (https=)
CN (1) CN1585999A (https=)
TW (1) TWI222127B (https=)
WO (1) WO2003023827A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI453800B (zh) * 2004-10-28 2014-09-21 周星工程股份有限公司 用於製造顯示裝置之設備

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453800B (zh) * 2004-10-28 2014-09-21 周星工程股份有限公司 用於製造顯示裝置之設備

Also Published As

Publication number Publication date
JP2005503017A (ja) 2005-01-27
EP1425780A1 (en) 2004-06-09
CN1585999A (zh) 2005-02-23
WO2003023827A1 (en) 2003-03-20
KR20040035772A (ko) 2004-04-29
US20030047202A1 (en) 2003-03-13
US6619304B2 (en) 2003-09-16

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MM4A Annulment or lapse of patent due to non-payment of fees