CN1585999A - 包括驱动装置的压力腔 - Google Patents

包括驱动装置的压力腔 Download PDF

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Publication number
CN1585999A
CN1585999A CNA028225252A CN02822525A CN1585999A CN 1585999 A CN1585999 A CN 1585999A CN A028225252 A CNA028225252 A CN A028225252A CN 02822525 A CN02822525 A CN 02822525A CN 1585999 A CN1585999 A CN 1585999A
Authority
CN
China
Prior art keywords
pressure chamber
pressure
fluid
carbon dioxide
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028225252A
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English (en)
Chinese (zh)
Inventor
S·L·沃姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MiCell Technologies Inc
Original Assignee
MiCell Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MiCell Technologies Inc filed Critical MiCell Technologies Inc
Publication of CN1585999A publication Critical patent/CN1585999A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Cleaning Or Drying Semiconductors (AREA)
CNA028225252A 2001-09-13 2002-07-30 包括驱动装置的压力腔 Pending CN1585999A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/951,355 2001-09-13
US09/951,355 US6619304B2 (en) 2001-09-13 2001-09-13 Pressure chamber assembly including non-mechanical drive means

Publications (1)

Publication Number Publication Date
CN1585999A true CN1585999A (zh) 2005-02-23

Family

ID=25491593

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028225252A Pending CN1585999A (zh) 2001-09-13 2002-07-30 包括驱动装置的压力腔

Country Status (7)

Country Link
US (1) US6619304B2 (https=)
EP (1) EP1425780A1 (https=)
JP (1) JP2005503017A (https=)
KR (1) KR20040035772A (https=)
CN (1) CN1585999A (https=)
TW (1) TWI222127B (https=)
WO (1) WO2003023827A1 (https=)

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CN102224572A (zh) * 2008-10-02 2011-10-19 瓦里安半导体设备公司 用于真空晶圆处理系统的液体输送机制
CN106335210A (zh) * 2015-07-06 2017-01-18 法因图尔国际控股股份公司 用于驱控精冲压机的主驱动装置的装置和方法
CN112689537A (zh) * 2018-09-12 2021-04-20 Smc 株式会社 压缩流体喷出控制装置
CN113322449A (zh) * 2021-05-26 2021-08-31 北京北方华创微电子装备有限公司 半导体工艺设备及其承载装置

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KR20210077779A (ko) 2018-11-16 2021-06-25 어플라이드 머티어리얼스, 인코포레이티드 강화된 확산 프로세스를 사용한 막 증착
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KR102210830B1 (ko) * 2019-03-25 2021-02-02 무진전자 주식회사 기판 건조 챔버
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US20230072156A1 (en) * 2021-09-02 2023-03-09 Wonik Ips Co., Ltd. Substrate processing apparatus

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102224572A (zh) * 2008-10-02 2011-10-19 瓦里安半导体设备公司 用于真空晶圆处理系统的液体输送机制
CN102224572B (zh) * 2008-10-02 2013-05-08 瓦里安半导体设备公司 用于真空晶圆处理系统的液体输送机制
CN106335210A (zh) * 2015-07-06 2017-01-18 法因图尔国际控股股份公司 用于驱控精冲压机的主驱动装置的装置和方法
CN106335210B (zh) * 2015-07-06 2019-06-21 法因图尔国际控股股份公司 用于驱控精冲压机的主驱动装置的装置和方法
US10479040B2 (en) 2015-07-06 2019-11-19 Feintool International Holding Ag Device and method for controlling the primary drive of a fine blanking press
CN112689537A (zh) * 2018-09-12 2021-04-20 Smc 株式会社 压缩流体喷出控制装置
CN112689537B (zh) * 2018-09-12 2023-05-26 Smc 株式会社 压缩流体喷出控制装置
CN113322449A (zh) * 2021-05-26 2021-08-31 北京北方华创微电子装备有限公司 半导体工艺设备及其承载装置

Also Published As

Publication number Publication date
JP2005503017A (ja) 2005-01-27
EP1425780A1 (en) 2004-06-09
TWI222127B (en) 2004-10-11
WO2003023827A1 (en) 2003-03-20
KR20040035772A (ko) 2004-04-29
US20030047202A1 (en) 2003-03-13
US6619304B2 (en) 2003-09-16

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