KR20040035772A - 구동 수단을 포함하는 압력 챔버 조립체 - Google Patents

구동 수단을 포함하는 압력 챔버 조립체 Download PDF

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Publication number
KR20040035772A
KR20040035772A KR10-2004-7003688A KR20047003688A KR20040035772A KR 20040035772 A KR20040035772 A KR 20040035772A KR 20047003688 A KR20047003688 A KR 20047003688A KR 20040035772 A KR20040035772 A KR 20040035772A
Authority
KR
South Korea
Prior art keywords
pressure chamber
pressure
chamber
fluid
drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR10-2004-7003688A
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English (en)
Korean (ko)
Inventor
웜스티브엘
Original Assignee
미셀 테크놀로지즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미셀 테크놀로지즈, 인코포레이티드 filed Critical 미셀 테크놀로지즈, 인코포레이티드
Publication of KR20040035772A publication Critical patent/KR20040035772A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
KR10-2004-7003688A 2001-09-13 2002-07-30 구동 수단을 포함하는 압력 챔버 조립체 Withdrawn KR20040035772A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/951,355 2001-09-13
US09/951,355 US6619304B2 (en) 2001-09-13 2001-09-13 Pressure chamber assembly including non-mechanical drive means
PCT/US2002/024004 WO2003023827A1 (en) 2001-09-13 2002-07-30 Pressure chamber assembly including drive means

Publications (1)

Publication Number Publication Date
KR20040035772A true KR20040035772A (ko) 2004-04-29

Family

ID=25491593

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7003688A Withdrawn KR20040035772A (ko) 2001-09-13 2002-07-30 구동 수단을 포함하는 압력 챔버 조립체

Country Status (7)

Country Link
US (1) US6619304B2 (https=)
EP (1) EP1425780A1 (https=)
JP (1) JP2005503017A (https=)
KR (1) KR20040035772A (https=)
CN (1) CN1585999A (https=)
TW (1) TWI222127B (https=)
WO (1) WO2003023827A1 (https=)

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KR20190052616A (ko) * 2017-11-08 2019-05-16 도쿄엘렉트론가부시키가이샤 가스 공급 시스템 및 가스 공급 방법
KR20190125678A (ko) * 2018-04-30 2019-11-07 세메스 주식회사 기판 처리 장치 및 방법
WO2020197082A1 (ko) * 2019-03-25 2020-10-01 무진전자 주식회사 기판 건조 챔버

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CN113322449B (zh) * 2021-05-26 2022-10-21 北京北方华创微电子装备有限公司 半导体工艺设备及其承载装置
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KR20190052616A (ko) * 2017-11-08 2019-05-16 도쿄엘렉트론가부시키가이샤 가스 공급 시스템 및 가스 공급 방법
US11698648B2 (en) 2017-11-08 2023-07-11 Tokyo Electron Limited Gas supply system and gas supply method
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WO2020197082A1 (ko) * 2019-03-25 2020-10-01 무진전자 주식회사 기판 건조 챔버

Also Published As

Publication number Publication date
JP2005503017A (ja) 2005-01-27
EP1425780A1 (en) 2004-06-09
TWI222127B (en) 2004-10-11
CN1585999A (zh) 2005-02-23
WO2003023827A1 (en) 2003-03-20
US20030047202A1 (en) 2003-03-13
US6619304B2 (en) 2003-09-16

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