JP2005501764A - 回路基板に特に有用なシート材料 - Google Patents
回路基板に特に有用なシート材料 Download PDFInfo
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- JP2005501764A JP2005501764A JP2003525568A JP2003525568A JP2005501764A JP 2005501764 A JP2005501764 A JP 2005501764A JP 2003525568 A JP2003525568 A JP 2003525568A JP 2003525568 A JP2003525568 A JP 2003525568A JP 2005501764 A JP2005501764 A JP 2005501764A
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Images
Classifications
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- B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/036—Multilayers with layers of different types
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0251—Non-conductive microfibers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/249941—Fiber is on the surface of a polymeric matrix having no embedded portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31588501P | 2001-08-30 | 2001-08-30 | |
| PCT/US2002/027546 WO2003022020A2 (en) | 2001-08-30 | 2002-08-29 | Sheet material and its use in circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005501764A true JP2005501764A (ja) | 2005-01-20 |
| JP2005501764A5 JP2005501764A5 (enExample) | 2006-01-05 |
Family
ID=23226483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003525568A Pending JP2005501764A (ja) | 2001-08-30 | 2002-08-29 | 回路基板に特に有用なシート材料 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6929848B2 (enExample) |
| EP (1) | EP1423995B1 (enExample) |
| JP (1) | JP2005501764A (enExample) |
| KR (1) | KR100875353B1 (enExample) |
| CN (1) | CN105189115A (enExample) |
| AU (1) | AU2002327571A1 (enExample) |
| BR (1) | BR0212702A (enExample) |
| CA (1) | CA2455053C (enExample) |
| DE (1) | DE60215199T2 (enExample) |
| MX (1) | MXPA04000914A (enExample) |
| TW (1) | TWI239290B (enExample) |
| WO (1) | WO2003022020A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012116906A (ja) * | 2010-11-30 | 2012-06-21 | Sumitomo Chemical Co Ltd | 樹脂含浸シート及び導電層付き樹脂含浸シート |
| JP2024536439A (ja) * | 2021-10-09 | 2024-10-04 | 華為技術有限公司 | レドーム、レドームに用いられる積層板および複合板、ならびにそれらの製造方法 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124763A (ja) * | 2000-10-16 | 2002-04-26 | Matsushita Electric Ind Co Ltd | 回路形成基板の製造方法、回路形成基板および回路形成基板用材料 |
| JP2004202834A (ja) * | 2002-12-25 | 2004-07-22 | Sumitomo Chem Co Ltd | アラミド積層体およびその製造方法 |
| US20060019110A1 (en) * | 2004-06-30 | 2006-01-26 | Sumitomo Chemical Company, Limited | Films |
| CA2499849C (en) * | 2005-03-09 | 2010-02-02 | Zcl Composites Inc. | Composite laminated sheet material for containment sumps |
| US7524388B2 (en) * | 2005-05-10 | 2009-04-28 | World Properties, Inc. | Composites, method of manufacture thereof, and articles formed therefrom |
| US8168292B2 (en) * | 2006-06-15 | 2012-05-01 | Innegra Technologies, Llc | Composite materials including amorphous thermoplastic fibers |
| US8025949B2 (en) | 2006-12-15 | 2011-09-27 | E.I. Du Pont De Nemours And Company | Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom |
| US7771811B2 (en) | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from controlled porosity paper |
| US7785520B2 (en) * | 2006-12-15 | 2010-08-31 | E.I. Du Pont De Nemours And Company | Processes for making shaped honeycomb and honeycombs made thereby |
| US20080145602A1 (en) | 2006-12-15 | 2008-06-19 | Gary Lee Hendren | Processes for making shaped honeycomb and honeycombs made thereby |
| US7771809B2 (en) * | 2006-12-15 | 2010-08-10 | E. I. Du Pont De Nemours And Company | Shaped honeycomb |
| US7771810B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having a high melt point thermoplastic fiber |
| US7815993B2 (en) | 2006-12-15 | 2010-10-19 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having flame retardant thermoplastic binder |
| US20080286522A1 (en) * | 2006-12-15 | 2008-11-20 | Subhotosh Khan | Honeycomb having a low coefficient of thermal expansion and articles made from same |
| JP5014113B2 (ja) * | 2007-01-26 | 2012-08-29 | イビデン株式会社 | シート材、その製造方法、排気ガス処理装置および消音装置 |
| JP4261590B2 (ja) * | 2007-01-31 | 2009-04-30 | 株式会社日立エンジニアリング・アンド・サービス | 無接着剤アラミド−ポリエステル積層体、その製造方法及び製造装置 |
| US20080188153A1 (en) * | 2007-02-06 | 2008-08-07 | Innegrity, Llc | Method of Forming a Low Dielectric Loss Composite Material |
| US7648758B2 (en) | 2007-02-06 | 2010-01-19 | Innegrity, Llc | Low dielectric loss composite material |
| US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US7803247B2 (en) * | 2007-12-21 | 2010-09-28 | E.I. Du Pont De Nemours And Company | Papers containing floc derived from diamino diphenyl sulfone |
| JP4402734B1 (ja) * | 2008-07-30 | 2010-01-20 | 株式会社日立エンジニアリング・アンド・サービス | 無接着剤アラミド−ポリフェニレンサルファイド積層体の製造方法、回転電機の絶縁部材及び絶縁構造 |
| US20150305151A1 (en) * | 2011-01-27 | 2015-10-22 | Longpont Co., Ltd. | Synthetic paper |
| KR20150036178A (ko) | 2012-06-28 | 2015-04-07 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열전도성 기재 물품 |
| KR102082536B1 (ko) * | 2012-09-20 | 2020-02-27 | 주식회사 쿠라레 | 회로 기판 및 그 제조 방법 |
| US11004792B2 (en) | 2018-09-28 | 2021-05-11 | Intel Corporation | Microelectronic device including fiber-containing build-up layers |
| CN110154464A (zh) * | 2019-06-14 | 2019-08-23 | 赣州龙邦材料科技有限公司 | 芳纶纸基挠性覆铜板及其制造方法 |
| JP7405146B2 (ja) | 2019-09-25 | 2023-12-26 | 株式会社村田製作所 | 液晶ポリマーパウダーおよびその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5857446B2 (ja) * | 1977-03-10 | 1983-12-20 | 日東電工株式会社 | 樹脂含浸基材とその製造方法 |
| NZ222302A (en) | 1986-12-08 | 1989-09-27 | Nordson Corp | Spraying moisture absorbent particles into a layer of forming non woven wadding |
| US4895752A (en) * | 1987-12-18 | 1990-01-23 | E. I. Du Pont De Nemours And Company | Low dielectric constant laminate of fluoropolymer and polyaramid |
| US5196259A (en) * | 1990-12-07 | 1993-03-23 | The Dow Chemical Company | Matrix composites in which the matrix contains polybenzoxazole or polybenzothiazole |
| JP3312470B2 (ja) * | 1994-03-16 | 2002-08-05 | 東レ株式会社 | プリプレグおよび積層体 |
| US6319605B1 (en) * | 1997-06-10 | 2001-11-20 | Teijin Limited | Heat-resistant fiber paper |
| JPH11117184A (ja) | 1997-10-14 | 1999-04-27 | Oji Paper Co Ltd | 積層板用基材及びその製造方法ならびにプリプレグ及び積層板 |
| JP2000334871A (ja) * | 1999-05-28 | 2000-12-05 | Oji Paper Co Ltd | 積層板用基材、プリプレグ、及びその製造方法 |
| US6258203B1 (en) * | 1999-09-21 | 2001-07-10 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and acrylic fibers |
| TW587119B (en) | 2001-03-23 | 2004-05-11 | Sumitomo Chemical Co | Low hygroscopic paper and method of producing the same |
-
2002
- 2002-08-26 US US10/227,998 patent/US6929848B2/en not_active Expired - Fee Related
- 2002-08-29 AU AU2002327571A patent/AU2002327571A1/en not_active Abandoned
- 2002-08-29 BR BR0212702-4A patent/BR0212702A/pt not_active Application Discontinuation
- 2002-08-29 EP EP02763569A patent/EP1423995B1/en not_active Expired - Lifetime
- 2002-08-29 WO PCT/US2002/027546 patent/WO2003022020A2/en not_active Ceased
- 2002-08-29 CA CA002455053A patent/CA2455053C/en not_active Expired - Fee Related
- 2002-08-29 JP JP2003525568A patent/JP2005501764A/ja active Pending
- 2002-08-29 DE DE60215199T patent/DE60215199T2/de not_active Expired - Lifetime
- 2002-08-29 MX MXPA04000914A patent/MXPA04000914A/es unknown
- 2002-08-29 KR KR1020047002968A patent/KR100875353B1/ko not_active Expired - Fee Related
- 2002-08-29 CN CN02816862.3A patent/CN105189115A/zh active Pending
- 2002-08-30 TW TW091119805A patent/TWI239290B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012116906A (ja) * | 2010-11-30 | 2012-06-21 | Sumitomo Chemical Co Ltd | 樹脂含浸シート及び導電層付き樹脂含浸シート |
| JP2024536439A (ja) * | 2021-10-09 | 2024-10-04 | 華為技術有限公司 | レドーム、レドームに用いられる積層板および複合板、ならびにそれらの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE60215199D1 (de) | 2006-11-16 |
| AU2002327571A1 (en) | 2003-03-18 |
| US20030087077A1 (en) | 2003-05-08 |
| EP1423995B1 (en) | 2006-10-04 |
| CA2455053A1 (en) | 2003-03-13 |
| KR100875353B1 (ko) | 2008-12-22 |
| TWI239290B (en) | 2005-09-11 |
| EP1423995A2 (en) | 2004-06-02 |
| KR20040029099A (ko) | 2004-04-03 |
| BR0212702A (pt) | 2004-10-19 |
| WO2003022020A3 (en) | 2003-10-09 |
| CA2455053C (en) | 2009-12-22 |
| MXPA04000914A (es) | 2004-04-02 |
| CN105189115A (zh) | 2015-12-23 |
| US6929848B2 (en) | 2005-08-16 |
| WO2003022020A2 (en) | 2003-03-13 |
| DE60215199T2 (de) | 2007-08-23 |
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