TWI239290B - Sheet material especially useful for circuit boards - Google Patents
Sheet material especially useful for circuit boards Download PDFInfo
- Publication number
- TWI239290B TWI239290B TW091119805A TW91119805A TWI239290B TW I239290 B TWI239290 B TW I239290B TW 091119805 A TW091119805 A TW 091119805A TW 91119805 A TW91119805 A TW 91119805A TW I239290 B TWI239290 B TW I239290B
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- patent application
- scope
- item
- paper
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims description 36
- 239000000835 fiber Substances 0.000 claims abstract description 70
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 68
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 53
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 229920001410 Microfiber Polymers 0.000 claims description 28
- 239000003658 microfiber Substances 0.000 claims description 28
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 8
- 239000004974 Thermotropic liquid crystal Substances 0.000 claims description 2
- 229920005548 perfluoropolymer Polymers 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 3
- 238000003780 insertion Methods 0.000 claims 3
- 239000004793 Polystyrene Substances 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 239000000344 soap Substances 0.000 claims 1
- 210000002784 stomach Anatomy 0.000 claims 1
- 239000004634 thermosetting polymer Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 96
- 239000000123 paper Substances 0.000 description 56
- 239000004416 thermosoftening plastic Substances 0.000 description 51
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 38
- QEWSAPKRFOFQIU-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-6,7-dimethoxychromen-4-one Chemical compound C1=C(OC)C(OC)=CC=C1C1=CC(=O)C2=C(O)C(OC)=C(OC)C=C2O1 QEWSAPKRFOFQIU-UHFFFAOYSA-N 0.000 description 28
- -1 polyethylene Polymers 0.000 description 19
- 239000010408 film Substances 0.000 description 18
- 239000002002 slurry Substances 0.000 description 16
- 239000010949 copper Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000000843 powder Substances 0.000 description 14
- 239000007787 solid Substances 0.000 description 14
- 229920000742 Cotton Polymers 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 125000003118 aryl group Chemical group 0.000 description 9
- 238000003490 calendering Methods 0.000 description 9
- 239000003365 glass fiber Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000011343 solid material Substances 0.000 description 9
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 239000008188 pellet Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 210000001161 mammalian embryo Anatomy 0.000 description 6
- 238000010791 quenching Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 230000000171 quenching effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000007670 refining Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 3
- 229920001230 polyarylate Polymers 0.000 description 3
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001409 amidines Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229960005192 methoxamine Drugs 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 235000015067 sauces Nutrition 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical compound C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- XFDQLDNQZFOAFK-UHFFFAOYSA-N 2-benzoyloxyethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOC(=O)C1=CC=CC=C1 XFDQLDNQZFOAFK-UHFFFAOYSA-N 0.000 description 1
- IKCQWKJZLSDDSS-UHFFFAOYSA-N 2-formyloxyethyl formate Chemical compound O=COCCOC=O IKCQWKJZLSDDSS-UHFFFAOYSA-N 0.000 description 1
- VGUWZCUCNQXGBU-UHFFFAOYSA-N 3-[(4-methylpiperazin-1-yl)methyl]-5-nitro-1h-indole Chemical compound C1CN(C)CCN1CC1=CNC2=CC=C([N+]([O-])=O)C=C12 VGUWZCUCNQXGBU-UHFFFAOYSA-N 0.000 description 1
- KMDVKKNVWWOMQF-UHFFFAOYSA-N 4-benzylcyclohexa-1,5-diene-1,4-diamine Chemical compound C1C=C(C=CC1(CC2=CC=CC=C2)N)N KMDVKKNVWWOMQF-UHFFFAOYSA-N 0.000 description 1
- 125000003143 4-hydroxybenzyl group Chemical group [H]C([*])([H])C1=C([H])C([H])=C(O[H])C([H])=C1[H] 0.000 description 1
- 241000616862 Belliella Species 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 241001674044 Blattodea Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241000426099 Buddleja salviifolia Species 0.000 description 1
- 241000218691 Cupressaceae Species 0.000 description 1
- BWLUMTFWVZZZND-UHFFFAOYSA-N Dibenzylamine Chemical compound C=1C=CC=CC=1CNCC1=CC=CC=C1 BWLUMTFWVZZZND-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920001474 Flashspun fabric Polymers 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920006293 Polyphenylene terephthalamide Polymers 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- RULQFHYVEFDIGL-UHFFFAOYSA-N [Ca].[Os] Chemical compound [Ca].[Os] RULQFHYVEFDIGL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- PNUPSASLQPUQMK-UHFFFAOYSA-N argon boron Chemical compound [B].[Ar] PNUPSASLQPUQMK-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004751 flashspun nonwoven Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 230000002218 hypoglycaemic effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000470 poly(p-phenylene terephthalate) polymer Polymers 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- D04H1/4374—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece using different kinds of webs, e.g. by layering webs
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- D04H1/4382—Stretched reticular film fibres; Composite fibres; Mixed fibres; Ultrafine fibres; Fibres for artificial leather
- D04H1/43835—Mixed fibres, e.g. at least two chemically different fibres or fibre blends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/249941—Fiber is on the surface of a polymeric matrix having no embedded portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31588501P | 2001-08-30 | 2001-08-30 | |
| US10/227,998 US6929848B2 (en) | 2001-08-30 | 2002-08-26 | Sheet material especially useful for circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI239290B true TWI239290B (en) | 2005-09-11 |
Family
ID=23226483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091119805A TWI239290B (en) | 2001-08-30 | 2002-08-30 | Sheet material especially useful for circuit boards |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6929848B2 (enExample) |
| EP (1) | EP1423995B1 (enExample) |
| JP (1) | JP2005501764A (enExample) |
| KR (1) | KR100875353B1 (enExample) |
| CN (1) | CN105189115A (enExample) |
| AU (1) | AU2002327571A1 (enExample) |
| BR (1) | BR0212702A (enExample) |
| CA (1) | CA2455053C (enExample) |
| DE (1) | DE60215199T2 (enExample) |
| MX (1) | MXPA04000914A (enExample) |
| TW (1) | TWI239290B (enExample) |
| WO (1) | WO2003022020A2 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124763A (ja) * | 2000-10-16 | 2002-04-26 | Matsushita Electric Ind Co Ltd | 回路形成基板の製造方法、回路形成基板および回路形成基板用材料 |
| JP2004202834A (ja) * | 2002-12-25 | 2004-07-22 | Sumitomo Chem Co Ltd | アラミド積層体およびその製造方法 |
| US20060019110A1 (en) * | 2004-06-30 | 2006-01-26 | Sumitomo Chemical Company, Limited | Films |
| CA2499849C (en) * | 2005-03-09 | 2010-02-02 | Zcl Composites Inc. | Composite laminated sheet material for containment sumps |
| US7524388B2 (en) * | 2005-05-10 | 2009-04-28 | World Properties, Inc. | Composites, method of manufacture thereof, and articles formed therefrom |
| US8168292B2 (en) * | 2006-06-15 | 2012-05-01 | Innegra Technologies, Llc | Composite materials including amorphous thermoplastic fibers |
| US8025949B2 (en) | 2006-12-15 | 2011-09-27 | E.I. Du Pont De Nemours And Company | Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom |
| US7771811B2 (en) | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from controlled porosity paper |
| US7785520B2 (en) * | 2006-12-15 | 2010-08-31 | E.I. Du Pont De Nemours And Company | Processes for making shaped honeycomb and honeycombs made thereby |
| US20080145602A1 (en) | 2006-12-15 | 2008-06-19 | Gary Lee Hendren | Processes for making shaped honeycomb and honeycombs made thereby |
| US7771809B2 (en) * | 2006-12-15 | 2010-08-10 | E. I. Du Pont De Nemours And Company | Shaped honeycomb |
| US7771810B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having a high melt point thermoplastic fiber |
| US7815993B2 (en) | 2006-12-15 | 2010-10-19 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having flame retardant thermoplastic binder |
| US20080286522A1 (en) * | 2006-12-15 | 2008-11-20 | Subhotosh Khan | Honeycomb having a low coefficient of thermal expansion and articles made from same |
| JP5014113B2 (ja) * | 2007-01-26 | 2012-08-29 | イビデン株式会社 | シート材、その製造方法、排気ガス処理装置および消音装置 |
| JP4261590B2 (ja) * | 2007-01-31 | 2009-04-30 | 株式会社日立エンジニアリング・アンド・サービス | 無接着剤アラミド−ポリエステル積層体、その製造方法及び製造装置 |
| US20080188153A1 (en) * | 2007-02-06 | 2008-08-07 | Innegrity, Llc | Method of Forming a Low Dielectric Loss Composite Material |
| US7648758B2 (en) | 2007-02-06 | 2010-01-19 | Innegrity, Llc | Low dielectric loss composite material |
| US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US7803247B2 (en) * | 2007-12-21 | 2010-09-28 | E.I. Du Pont De Nemours And Company | Papers containing floc derived from diamino diphenyl sulfone |
| JP4402734B1 (ja) * | 2008-07-30 | 2010-01-20 | 株式会社日立エンジニアリング・アンド・サービス | 無接着剤アラミド−ポリフェニレンサルファイド積層体の製造方法、回転電機の絶縁部材及び絶縁構造 |
| JP2012116906A (ja) * | 2010-11-30 | 2012-06-21 | Sumitomo Chemical Co Ltd | 樹脂含浸シート及び導電層付き樹脂含浸シート |
| US20150305151A1 (en) * | 2011-01-27 | 2015-10-22 | Longpont Co., Ltd. | Synthetic paper |
| KR20150036178A (ko) | 2012-06-28 | 2015-04-07 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열전도성 기재 물품 |
| KR102082536B1 (ko) * | 2012-09-20 | 2020-02-27 | 주식회사 쿠라레 | 회로 기판 및 그 제조 방법 |
| US11004792B2 (en) | 2018-09-28 | 2021-05-11 | Intel Corporation | Microelectronic device including fiber-containing build-up layers |
| CN110154464A (zh) * | 2019-06-14 | 2019-08-23 | 赣州龙邦材料科技有限公司 | 芳纶纸基挠性覆铜板及其制造方法 |
| JP7405146B2 (ja) | 2019-09-25 | 2023-12-26 | 株式会社村田製作所 | 液晶ポリマーパウダーおよびその製造方法 |
| CN115958851A (zh) * | 2021-10-09 | 2023-04-14 | 华为技术有限公司 | 天线罩、以及天线罩用的堆叠板材、复合板材及制作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5857446B2 (ja) * | 1977-03-10 | 1983-12-20 | 日東電工株式会社 | 樹脂含浸基材とその製造方法 |
| NZ222302A (en) | 1986-12-08 | 1989-09-27 | Nordson Corp | Spraying moisture absorbent particles into a layer of forming non woven wadding |
| US4895752A (en) * | 1987-12-18 | 1990-01-23 | E. I. Du Pont De Nemours And Company | Low dielectric constant laminate of fluoropolymer and polyaramid |
| US5196259A (en) * | 1990-12-07 | 1993-03-23 | The Dow Chemical Company | Matrix composites in which the matrix contains polybenzoxazole or polybenzothiazole |
| JP3312470B2 (ja) * | 1994-03-16 | 2002-08-05 | 東レ株式会社 | プリプレグおよび積層体 |
| US6319605B1 (en) * | 1997-06-10 | 2001-11-20 | Teijin Limited | Heat-resistant fiber paper |
| JPH11117184A (ja) | 1997-10-14 | 1999-04-27 | Oji Paper Co Ltd | 積層板用基材及びその製造方法ならびにプリプレグ及び積層板 |
| JP2000334871A (ja) * | 1999-05-28 | 2000-12-05 | Oji Paper Co Ltd | 積層板用基材、プリプレグ、及びその製造方法 |
| US6258203B1 (en) * | 1999-09-21 | 2001-07-10 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and acrylic fibers |
| TW587119B (en) | 2001-03-23 | 2004-05-11 | Sumitomo Chemical Co | Low hygroscopic paper and method of producing the same |
-
2002
- 2002-08-26 US US10/227,998 patent/US6929848B2/en not_active Expired - Fee Related
- 2002-08-29 AU AU2002327571A patent/AU2002327571A1/en not_active Abandoned
- 2002-08-29 BR BR0212702-4A patent/BR0212702A/pt not_active Application Discontinuation
- 2002-08-29 EP EP02763569A patent/EP1423995B1/en not_active Expired - Lifetime
- 2002-08-29 WO PCT/US2002/027546 patent/WO2003022020A2/en not_active Ceased
- 2002-08-29 CA CA002455053A patent/CA2455053C/en not_active Expired - Fee Related
- 2002-08-29 JP JP2003525568A patent/JP2005501764A/ja active Pending
- 2002-08-29 DE DE60215199T patent/DE60215199T2/de not_active Expired - Lifetime
- 2002-08-29 MX MXPA04000914A patent/MXPA04000914A/es unknown
- 2002-08-29 KR KR1020047002968A patent/KR100875353B1/ko not_active Expired - Fee Related
- 2002-08-29 CN CN02816862.3A patent/CN105189115A/zh active Pending
- 2002-08-30 TW TW091119805A patent/TWI239290B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE60215199D1 (de) | 2006-11-16 |
| AU2002327571A1 (en) | 2003-03-18 |
| US20030087077A1 (en) | 2003-05-08 |
| EP1423995B1 (en) | 2006-10-04 |
| CA2455053A1 (en) | 2003-03-13 |
| KR100875353B1 (ko) | 2008-12-22 |
| EP1423995A2 (en) | 2004-06-02 |
| KR20040029099A (ko) | 2004-04-03 |
| BR0212702A (pt) | 2004-10-19 |
| WO2003022020A3 (en) | 2003-10-09 |
| JP2005501764A (ja) | 2005-01-20 |
| CA2455053C (en) | 2009-12-22 |
| MXPA04000914A (es) | 2004-04-02 |
| CN105189115A (zh) | 2015-12-23 |
| US6929848B2 (en) | 2005-08-16 |
| WO2003022020A2 (en) | 2003-03-13 |
| DE60215199T2 (de) | 2007-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI239290B (en) | Sheet material especially useful for circuit boards | |
| US4729921A (en) | High density para-aramid papers | |
| US4698267A (en) | High density para-aramid papers | |
| TWI299696B (en) | Solid sheet material especially useful for circuit boards | |
| US7459044B2 (en) | Sheet material especially useful for circuit boards | |
| TWI763889B (zh) | 纖維強化體及使用其之構件 | |
| US20040132372A1 (en) | Solid sheet material especially useful for circuit boards | |
| JP4580704B2 (ja) | 電気絶縁用基材とその製造方法、および同基材を用いたプリプレグとプリント配線用基板 | |
| CN104674594A (zh) | 具有负热膨胀系数和高耐热的电路板用合成纤维纸及其制备方法与应用 | |
| JP4778833B2 (ja) | 積層板用基材及びプリプレグ、並びに積層板 | |
| JPH11254592A (ja) | フェノール樹脂コンポジット積層板 | |
| JPH02225025A (ja) | プリプレグおよび銅張積層板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |