BR0212702A - Folha, estrutura, placa de circuito, pacote de chip, carreador de chip e divisor de pacote de chip e um processo para a produção de um material de folha - Google Patents

Folha, estrutura, placa de circuito, pacote de chip, carreador de chip e divisor de pacote de chip e um processo para a produção de um material de folha

Info

Publication number
BR0212702A
BR0212702A BR0212702-4A BR0212702A BR0212702A BR 0212702 A BR0212702 A BR 0212702A BR 0212702 A BR0212702 A BR 0212702A BR 0212702 A BR0212702 A BR 0212702A
Authority
BR
Brazil
Prior art keywords
sheet
chip
chip package
producing
circuit board
Prior art date
Application number
BR0212702-4A
Other languages
English (en)
Portuguese (pt)
Inventor
Michael R Samuels
Subhotosh Khan
Mikhail R Levit
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR0212702A publication Critical patent/BR0212702A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00—Conditioning or physical treatment of the material to be shaped
    • B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4374—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece using different kinds of webs, e.g. by layering webs
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4382—Stretched reticular film fibres; Composite fibres; Mixed fibres; Ultrafine fibres; Fibres for artificial leather
    • D04H1/43835—Mixed fibres, e.g. at least two chemically different fibres or fibre blends
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/249941—Fiber is on the surface of a polymeric matrix having no embedded portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paper (AREA)
BR0212702-4A 2001-08-30 2002-08-29 Folha, estrutura, placa de circuito, pacote de chip, carreador de chip e divisor de pacote de chip e um processo para a produção de um material de folha BR0212702A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31588501P 2001-08-30 2001-08-30
PCT/US2002/027546 WO2003022020A2 (en) 2001-08-30 2002-08-29 Sheet material and its use in circuit boards

Publications (1)

Publication Number Publication Date
BR0212702A true BR0212702A (pt) 2004-10-19

Family

ID=23226483

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0212702-4A BR0212702A (pt) 2001-08-30 2002-08-29 Folha, estrutura, placa de circuito, pacote de chip, carreador de chip e divisor de pacote de chip e um processo para a produção de um material de folha

Country Status (12)

Country Link
US (1) US6929848B2 (enExample)
EP (1) EP1423995B1 (enExample)
JP (1) JP2005501764A (enExample)
KR (1) KR100875353B1 (enExample)
CN (1) CN105189115A (enExample)
AU (1) AU2002327571A1 (enExample)
BR (1) BR0212702A (enExample)
CA (1) CA2455053C (enExample)
DE (1) DE60215199T2 (enExample)
MX (1) MXPA04000914A (enExample)
TW (1) TWI239290B (enExample)
WO (1) WO2003022020A2 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124763A (ja) * 2000-10-16 2002-04-26 Matsushita Electric Ind Co Ltd 回路形成基板の製造方法、回路形成基板および回路形成基板用材料
JP2004202834A (ja) * 2002-12-25 2004-07-22 Sumitomo Chem Co Ltd アラミド積層体およびその製造方法
TW200615142A (en) * 2004-06-30 2006-05-16 Sumitomo Chemical Co Films
CA2499849C (en) * 2005-03-09 2010-02-02 Zcl Composites Inc. Composite laminated sheet material for containment sumps
US7524388B2 (en) * 2005-05-10 2009-04-28 World Properties, Inc. Composites, method of manufacture thereof, and articles formed therefrom
US8168292B2 (en) * 2006-06-15 2012-05-01 Innegra Technologies, Llc Composite materials including amorphous thermoplastic fibers
US20080145602A1 (en) 2006-12-15 2008-06-19 Gary Lee Hendren Processes for making shaped honeycomb and honeycombs made thereby
US7771809B2 (en) * 2006-12-15 2010-08-10 E. I. Du Pont De Nemours And Company Shaped honeycomb
US8025949B2 (en) 2006-12-15 2011-09-27 E.I. Du Pont De Nemours And Company Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom
US7785520B2 (en) * 2006-12-15 2010-08-31 E.I. Du Pont De Nemours And Company Processes for making shaped honeycomb and honeycombs made thereby
US7771811B2 (en) 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from controlled porosity paper
US7815993B2 (en) 2006-12-15 2010-10-19 E.I. Du Pont De Nemours And Company Honeycomb from paper having flame retardant thermoplastic binder
US20080286522A1 (en) * 2006-12-15 2008-11-20 Subhotosh Khan Honeycomb having a low coefficient of thermal expansion and articles made from same
US7771810B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from paper having a high melt point thermoplastic fiber
JP5014113B2 (ja) * 2007-01-26 2012-08-29 イビデン株式会社 シート材、その製造方法、排気ガス処理装置および消音装置
JP4261590B2 (ja) * 2007-01-31 2009-04-30 株式会社日立エンジニアリング・アンド・サービス 無接着剤アラミド−ポリエステル積層体、その製造方法及び製造装置
US7648758B2 (en) 2007-02-06 2010-01-19 Innegrity, Llc Low dielectric loss composite material
US20080188153A1 (en) * 2007-02-06 2008-08-07 Innegrity, Llc Method of Forming a Low Dielectric Loss Composite Material
US8118975B2 (en) * 2007-12-21 2012-02-21 E. I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
US8114251B2 (en) * 2007-12-21 2012-02-14 E.I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
US7803247B2 (en) * 2007-12-21 2010-09-28 E.I. Du Pont De Nemours And Company Papers containing floc derived from diamino diphenyl sulfone
JP4402734B1 (ja) * 2008-07-30 2010-01-20 株式会社日立エンジニアリング・アンド・サービス 無接着剤アラミド−ポリフェニレンサルファイド積層体の製造方法、回転電機の絶縁部材及び絶縁構造
JP2012116906A (ja) * 2010-11-30 2012-06-21 Sumitomo Chemical Co Ltd 樹脂含浸シート及び導電層付き樹脂含浸シート
US20150305151A1 (en) * 2011-01-27 2015-10-22 Longpont Co., Ltd. Synthetic paper
WO2014003835A1 (en) 2012-06-28 2014-01-03 3M Innovative Properties Company Thermally conductive substrate article
WO2014046014A1 (ja) * 2012-09-20 2014-03-27 株式会社クラレ 回路基板およびその製造方法
US11004792B2 (en) 2018-09-28 2021-05-11 Intel Corporation Microelectronic device including fiber-containing build-up layers
CN110154464A (zh) * 2019-06-14 2019-08-23 赣州龙邦材料科技有限公司 芳纶纸基挠性覆铜板及其制造方法
WO2021060255A1 (ja) 2019-09-25 2021-04-01 株式会社村田製作所 液晶ポリマーパウダーおよびその製造方法
CN115958851A (zh) * 2021-10-09 2023-04-14 华为技术有限公司 天线罩、以及天线罩用的堆叠板材、复合板材及制作方法
WO2026031189A1 (en) * 2024-08-09 2026-02-12 Polyone Management (Shanghai) Co. Ltd. Copper-clad laminate and process for manufacturing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857446B2 (ja) * 1977-03-10 1983-12-20 日東電工株式会社 樹脂含浸基材とその製造方法
NZ222302A (en) 1986-12-08 1989-09-27 Nordson Corp Spraying moisture absorbent particles into a layer of forming non woven wadding
US4895752A (en) * 1987-12-18 1990-01-23 E. I. Du Pont De Nemours And Company Low dielectric constant laminate of fluoropolymer and polyaramid
US5196259A (en) * 1990-12-07 1993-03-23 The Dow Chemical Company Matrix composites in which the matrix contains polybenzoxazole or polybenzothiazole
JP3312470B2 (ja) * 1994-03-16 2002-08-05 東レ株式会社 プリプレグおよび積層体
KR100398482B1 (ko) * 1997-06-10 2003-09-19 데이진 가부시키가이샤 내열성 섬유지
JPH11117184A (ja) * 1997-10-14 1999-04-27 Oji Paper Co Ltd 積層板用基材及びその製造方法ならびにプリプレグ及び積層板
JP2000334871A (ja) * 1999-05-28 2000-12-05 Oji Paper Co Ltd 積層板用基材、プリプレグ、及びその製造方法
US6258203B1 (en) * 1999-09-21 2001-07-10 Ahlstrom Glassfibre Oy Base webs for printed circuit board production using the foam process and acrylic fibers
EP1243696A3 (en) 2001-03-23 2002-11-20 Sumitomo Chemical Company, Limited Low hygroscopic paper and method of producing the same

Also Published As

Publication number Publication date
EP1423995A2 (en) 2004-06-02
CA2455053A1 (en) 2003-03-13
AU2002327571A1 (en) 2003-03-18
EP1423995B1 (en) 2006-10-04
KR20040029099A (ko) 2004-04-03
US20030087077A1 (en) 2003-05-08
TWI239290B (en) 2005-09-11
DE60215199D1 (de) 2006-11-16
DE60215199T2 (de) 2007-08-23
KR100875353B1 (ko) 2008-12-22
US6929848B2 (en) 2005-08-16
WO2003022020A2 (en) 2003-03-13
CN105189115A (zh) 2015-12-23
MXPA04000914A (es) 2004-04-02
WO2003022020A3 (en) 2003-10-09
CA2455053C (en) 2009-12-22
JP2005501764A (ja) 2005-01-20

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