ATE293348T1 - Verpackung für mikrowellenbauteile - Google Patents

Verpackung für mikrowellenbauteile

Info

Publication number
ATE293348T1
ATE293348T1 AT01911574T AT01911574T ATE293348T1 AT E293348 T1 ATE293348 T1 AT E293348T1 AT 01911574 T AT01911574 T AT 01911574T AT 01911574 T AT01911574 T AT 01911574T AT E293348 T1 ATE293348 T1 AT E293348T1
Authority
AT
Austria
Prior art keywords
circuit
packaging
microwave components
covered
components
Prior art date
Application number
AT01911574T
Other languages
English (en)
Inventor
Jan Hendrik Mannak
Ivo Antoni Gerardus Maatman
Original Assignee
Thales Nederland Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1014304A external-priority patent/NL1014304C1/nl
Application filed by Thales Nederland Bv filed Critical Thales Nederland Bv
Application granted granted Critical
Publication of ATE293348T1 publication Critical patent/ATE293348T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Packages (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Wrappers (AREA)
AT01911574T 2000-02-07 2001-02-01 Verpackung für mikrowellenbauteile ATE293348T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1014304A NL1014304C1 (nl) 2000-02-07 2000-02-07 Behuizing voor gemengde schakelingen.
NL1016260A NL1016260C2 (nl) 2000-02-07 2000-09-25 Behuizing voor microgolfcomponenten.
PCT/EP2001/001092 WO2001058227A1 (en) 2000-02-07 2001-02-01 Package for microwave components

Publications (1)

Publication Number Publication Date
ATE293348T1 true ATE293348T1 (de) 2005-04-15

Family

ID=26643129

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01911574T ATE293348T1 (de) 2000-02-07 2001-02-01 Verpackung für mikrowellenbauteile

Country Status (8)

Country Link
US (1) US6713867B2 (de)
EP (1) EP1256262B1 (de)
AT (1) ATE293348T1 (de)
AU (1) AU2001240574A1 (de)
CA (1) CA2398270C (de)
DE (1) DE60110042T2 (de)
NL (1) NL1016260C2 (de)
WO (1) WO2001058227A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798044B2 (en) 2000-12-04 2004-09-28 Fairchild Semiconductor Corporation Flip chip in leaded molded package with two dies
US7057264B2 (en) 2002-10-18 2006-06-06 National Starch And Chemical Investment Holding Corporation Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates
US20060142424A1 (en) * 2003-05-23 2006-06-29 Jayesh Shah Foamable underfill encapsulant
US7004375B2 (en) 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
US20060177966A1 (en) * 2005-02-09 2006-08-10 Jayesh Shah Package or pre-applied foamable underfill for lead-free process
US8969132B2 (en) 2010-09-20 2015-03-03 Nuvotronics, Llc Device package and methods for the fabrication thereof
US9337152B2 (en) 2013-03-15 2016-05-10 Nuvotronics, Inc Formulation for packaging an electronic device and assemblies made therefrom
US9478473B2 (en) * 2013-05-21 2016-10-25 Globalfoundries Inc. Fabricating a microelectronics lid using sol-gel processing

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4293519A (en) * 1978-03-27 1981-10-06 Motorola Inc. Method for potting and encapsulating electronic circuits
EP0308676A3 (de) * 1987-09-25 1990-01-10 Siemens Aktiengesellschaft Spannungsarme Umhüllung für elektrische und elektronische Bauelemente, insbesondere Hybridschaltungen
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
JPH05206325A (ja) * 1992-01-24 1993-08-13 Hitachi Ltd 半導体装置
JP2915201B2 (ja) * 1992-03-23 1999-07-05 三菱電機株式会社 携帯用半導体装置及びその製造方法
US5359488A (en) * 1993-06-21 1994-10-25 Westinghouse Electric Corporation Packaging system for a standard electronic module
DE4326825A1 (de) * 1993-08-10 1994-06-30 Siemens Ag Verfahren zur HF-Abschirmung von Schaltungen und/oder Schaltungselementen auf Leiterplatten
DE4329696C2 (de) * 1993-09-02 1995-07-06 Siemens Ag Auf Leiterplatten oberflächenmontierbares Multichip-Modul mit SMD-fähigen Anschlußelementen
US5550403A (en) * 1994-06-02 1996-08-27 Lsi Logic Corporation Improved laminate package for an integrated circuit and integrated circuit having such a package
US5773121A (en) * 1994-07-29 1998-06-30 Isorca Inc. Syntactic foam core incorporating honeycomb structure for composites
JP2871591B2 (ja) * 1996-05-14 1999-03-17 日本電気株式会社 高周波用電子部品および高周波用電子部品の製造方法
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
US6057600A (en) * 1997-11-27 2000-05-02 Kyocera Corporation Structure for mounting a high-frequency package
JP2000058691A (ja) * 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
US6229404B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Crystal oscillator
EP1058307A1 (de) * 1999-06-03 2000-12-06 Alps Electric Co., Ltd. Elektronische Einheit, die effizient die Oberfläche der Leiterplatte nützt
US6281574B1 (en) * 1999-09-27 2001-08-28 Raytheon Company High power microwave transistor amplifier
TW529109B (en) * 2001-09-11 2003-04-21 Apack Comm Inc Flip chip type monolithic microwave integrated circuit package

Also Published As

Publication number Publication date
CA2398270A1 (en) 2001-08-09
DE60110042D1 (de) 2005-05-19
EP1256262B1 (de) 2005-04-13
DE60110042T2 (de) 2006-02-23
EP1256262A1 (de) 2002-11-13
WO2001058227A1 (en) 2001-08-09
US20030107128A1 (en) 2003-06-12
CA2398270C (en) 2009-12-22
AU2001240574A1 (en) 2001-08-14
NL1016260C2 (nl) 2001-08-08
US6713867B2 (en) 2004-03-30

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties