NL1016260C2 - Behuizing voor microgolfcomponenten. - Google Patents

Behuizing voor microgolfcomponenten. Download PDF

Info

Publication number
NL1016260C2
NL1016260C2 NL1016260A NL1016260A NL1016260C2 NL 1016260 C2 NL1016260 C2 NL 1016260C2 NL 1016260 A NL1016260 A NL 1016260A NL 1016260 A NL1016260 A NL 1016260A NL 1016260 C2 NL1016260 C2 NL 1016260C2
Authority
NL
Netherlands
Prior art keywords
microwave components
components
circuit
layer
syntactic foam
Prior art date
Application number
NL1016260A
Other languages
English (en)
Dutch (nl)
Inventor
Jan Hendrik Mannak
Ivo Antoni Gerardus Maatman
Original Assignee
Thales Nederland Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1014304A external-priority patent/NL1014304C1/nl
Application filed by Thales Nederland Bv filed Critical Thales Nederland Bv
Priority to NL1016260A priority Critical patent/NL1016260C2/nl
Priority to US10/182,702 priority patent/US6713867B2/en
Priority to PCT/EP2001/001092 priority patent/WO2001058227A1/en
Priority to EP01911574A priority patent/EP1256262B1/de
Priority to DE60110042T priority patent/DE60110042T2/de
Priority to AT01911574T priority patent/ATE293348T1/de
Priority to AU2001240574A priority patent/AU2001240574A1/en
Priority to CA002398270A priority patent/CA2398270C/en
Application granted granted Critical
Publication of NL1016260C2 publication Critical patent/NL1016260C2/nl

Links

Classifications

    • H10W44/20—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W42/20—
    • H10W42/276—
    • H10W74/114—
    • H10W74/473—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
NL1016260A 2000-02-07 2000-09-25 Behuizing voor microgolfcomponenten. NL1016260C2 (nl)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL1016260A NL1016260C2 (nl) 2000-02-07 2000-09-25 Behuizing voor microgolfcomponenten.
US10/182,702 US6713867B2 (en) 2000-02-07 2001-02-01 Package for microwave components
PCT/EP2001/001092 WO2001058227A1 (en) 2000-02-07 2001-02-01 Package for microwave components
EP01911574A EP1256262B1 (de) 2000-02-07 2001-02-01 Verpackung für mikrowellenbauteile
DE60110042T DE60110042T2 (de) 2000-02-07 2001-02-01 Verpackung für mikrowellenbauteile
AT01911574T ATE293348T1 (de) 2000-02-07 2001-02-01 Verpackung für mikrowellenbauteile
AU2001240574A AU2001240574A1 (en) 2000-02-07 2001-02-01 Package for microwave components
CA002398270A CA2398270C (en) 2000-02-07 2001-02-01 Package for microwave components

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NL1014304A NL1014304C1 (nl) 2000-02-07 2000-02-07 Behuizing voor gemengde schakelingen.
NL1014304 2000-02-07
NL1016260 2000-09-25
NL1016260A NL1016260C2 (nl) 2000-02-07 2000-09-25 Behuizing voor microgolfcomponenten.

Publications (1)

Publication Number Publication Date
NL1016260C2 true NL1016260C2 (nl) 2001-08-08

Family

ID=26643129

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1016260A NL1016260C2 (nl) 2000-02-07 2000-09-25 Behuizing voor microgolfcomponenten.

Country Status (8)

Country Link
US (1) US6713867B2 (de)
EP (1) EP1256262B1 (de)
AT (1) ATE293348T1 (de)
AU (1) AU2001240574A1 (de)
CA (1) CA2398270C (de)
DE (1) DE60110042T2 (de)
NL (1) NL1016260C2 (de)
WO (1) WO2001058227A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798044B2 (en) 2000-12-04 2004-09-28 Fairchild Semiconductor Corporation Flip chip in leaded molded package with two dies
US7057264B2 (en) * 2002-10-18 2006-06-06 National Starch And Chemical Investment Holding Corporation Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates
US20060142424A1 (en) * 2003-05-23 2006-06-29 Jayesh Shah Foamable underfill encapsulant
US7004375B2 (en) 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
US20060177966A1 (en) * 2005-02-09 2006-08-10 Jayesh Shah Package or pre-applied foamable underfill for lead-free process
US8969132B2 (en) 2010-09-20 2015-03-03 Nuvotronics, Llc Device package and methods for the fabrication thereof
US9337152B2 (en) 2013-03-15 2016-05-10 Nuvotronics, Inc Formulation for packaging an electronic device and assemblies made therefrom
US9478473B2 (en) * 2013-05-21 2016-10-25 Globalfoundries Inc. Fabricating a microelectronics lid using sol-gel processing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4293519A (en) * 1978-03-27 1981-10-06 Motorola Inc. Method for potting and encapsulating electronic circuits
EP0308676A2 (de) * 1987-09-25 1989-03-29 Siemens Aktiengesellschaft Spannungsarme Umhüllung für elektrische und elektronische Bauelemente, insbesondere Hybridschaltungen
JPH05206325A (ja) * 1992-01-24 1993-08-13 Hitachi Ltd 半導体装置
FR2688940A1 (fr) * 1992-03-23 1993-09-24 Mitsubishi Electric Corp Appareil semiconducteur portatif et son procede de fabrication.
DE4326825A1 (de) * 1993-08-10 1994-06-30 Siemens Ag Verfahren zur HF-Abschirmung von Schaltungen und/oder Schaltungselementen auf Leiterplatten
EP0807971A2 (de) * 1996-05-14 1997-11-19 Nec Corporation Elektronische Komponente für Ultrahochfrequenz und Herstellungsverfahren

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
US5359488A (en) * 1993-06-21 1994-10-25 Westinghouse Electric Corporation Packaging system for a standard electronic module
DE4329696C2 (de) * 1993-09-02 1995-07-06 Siemens Ag Auf Leiterplatten oberflächenmontierbares Multichip-Modul mit SMD-fähigen Anschlußelementen
US5550403A (en) * 1994-06-02 1996-08-27 Lsi Logic Corporation Improved laminate package for an integrated circuit and integrated circuit having such a package
US5773121A (en) * 1994-07-29 1998-06-30 Isorca Inc. Syntactic foam core incorporating honeycomb structure for composites
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
US6057600A (en) * 1997-11-27 2000-05-02 Kyocera Corporation Structure for mounting a high-frequency package
JP2000058691A (ja) * 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
US6229404B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Crystal oscillator
EP1058307A1 (de) * 1999-06-03 2000-12-06 Alps Electric Co., Ltd. Elektronische Einheit, die effizient die Oberfläche der Leiterplatte nützt
US6281574B1 (en) * 1999-09-27 2001-08-28 Raytheon Company High power microwave transistor amplifier
TW529109B (en) * 2001-09-11 2003-04-21 Apack Comm Inc Flip chip type monolithic microwave integrated circuit package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4293519A (en) * 1978-03-27 1981-10-06 Motorola Inc. Method for potting and encapsulating electronic circuits
EP0308676A2 (de) * 1987-09-25 1989-03-29 Siemens Aktiengesellschaft Spannungsarme Umhüllung für elektrische und elektronische Bauelemente, insbesondere Hybridschaltungen
JPH05206325A (ja) * 1992-01-24 1993-08-13 Hitachi Ltd 半導体装置
FR2688940A1 (fr) * 1992-03-23 1993-09-24 Mitsubishi Electric Corp Appareil semiconducteur portatif et son procede de fabrication.
DE4326825A1 (de) * 1993-08-10 1994-06-30 Siemens Ag Verfahren zur HF-Abschirmung von Schaltungen und/oder Schaltungselementen auf Leiterplatten
EP0807971A2 (de) * 1996-05-14 1997-11-19 Nec Corporation Elektronische Komponente für Ultrahochfrequenz und Herstellungsverfahren

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 640 (E - 1465) 26 November 1993 (1993-11-26) *

Also Published As

Publication number Publication date
US20030107128A1 (en) 2003-06-12
US6713867B2 (en) 2004-03-30
CA2398270A1 (en) 2001-08-09
WO2001058227A1 (en) 2001-08-09
EP1256262A1 (de) 2002-11-13
ATE293348T1 (de) 2005-04-15
AU2001240574A1 (en) 2001-08-14
EP1256262B1 (de) 2005-04-13
DE60110042T2 (de) 2006-02-23
CA2398270C (en) 2009-12-22
DE60110042D1 (de) 2005-05-19

Similar Documents

Publication Publication Date Title
NL1016260C2 (nl) Behuizing voor microgolfcomponenten.
KR100634907B1 (ko) 개시기 및 가스 발생기
US8269666B2 (en) High frequency module for filling level measurements in the W-band
EP0447884A2 (de) Halbleitervorrichtung mit einer bei niederer Temperatur ausgehärteten Epoxy-Vergussmasse und Verfahren zu ihrer Herstellung
US20100020518A1 (en) RF shielding arrangement for semiconductor packages
US20150359107A1 (en) Electronic module with a plastic-coated electronic circuit and method for the production thereof
US20120069288A1 (en) Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
CA2067784A1 (fr) Procede et dispositif d'encapsulation hermetique de composants electroniques
US9974158B2 (en) Air-cavity package with two heat dissipation interfaces
JPS595650A (ja) ハイブリツドソリツドステ−ト電子デバイス等のための気密封止パツケ−ジ
KR910009127A (ko) 인쇄 회로판, 그의 제조방법 및 인쇄 회로판에 전자 부품을 부착시키는 방법
US6518496B1 (en) Non-silicone conductive paste for the electrical industry, and its use
US20180102304A1 (en) Electronic module and method for encapsulation thereof
JP2002020637A (ja) 電子部品を製造するための電磁遮蔽特性を有する封止用又は埋込用コンパウンド
NL1014304C1 (nl) Behuizing voor gemengde schakelingen.
EP1153985A4 (de) Leitfähige harzzusammensetzung; elektronisches modul das diese verwendet und verfahren zur herstellung dieses moduls
US20120057313A1 (en) Package for system level electronic products
US6733613B2 (en) Method for curing an anisotropic conductive compound
US6214650B1 (en) Method and apparatus for sealing a ball grid array package and circuit card interconnection
WO2004012300A2 (en) Anisotropic conductive compound
CN1717800A (zh) 功率半导体模块
KR930016000A (ko) 도전성 동페이스트
CN107637186A (zh) 具有用于传动装置控制单元的阿尔法射线保护的电子装置模块以及传动装置控制单元
WO1997025847A1 (en) Shielding of electronic components embedded in plastics directly on circuit board
TW200746957A (en) Method for connecting printed circuit boards

Legal Events

Date Code Title Description
PD2B A search report has been drawn up
VD1 Lapsed due to non-payment of the annual fee

Effective date: 20050401