BR9912488A - Composição adesiva, e, precursor de composição adesiva - Google Patents
Composição adesiva, e, precursor de composição adesivaInfo
- Publication number
- BR9912488A BR9912488A BR9912488-2A BR9912488A BR9912488A BR 9912488 A BR9912488 A BR 9912488A BR 9912488 A BR9912488 A BR 9912488A BR 9912488 A BR9912488 A BR 9912488A
- Authority
- BR
- Brazil
- Prior art keywords
- adhesive composition
- precursor
- resin
- thermoplastic resin
- resin component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
"COMPOSIçãO ADESIVA, E, PRECURSOR DE COMPOSIçãO ADESIVA" Composição adesiva compreendendo um componente de resina contendo uma resina termoplástica, uma resina epóxi e um agente de cura, caracterizada pelo fato de que a mencionada resina termoplástica contém um polímero adesivo sensível a pressão; e o mencionado componente de resina contém disperso nele um colóide inorgânico. é ainda divulgado um precursor para a composição adesiva.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10212505A JP2000053934A (ja) | 1998-07-28 | 1998-07-28 | 接着剤組成物およびその前駆体 |
PCT/US1999/013486 WO2000006661A1 (en) | 1998-07-28 | 1999-06-15 | Adhesive compositions and their precursors |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9912488A true BR9912488A (pt) | 2001-04-17 |
Family
ID=16623788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9912488-2A BR9912488A (pt) | 1998-07-28 | 1999-06-15 | Composição adesiva, e, precursor de composição adesiva |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1117747A1 (pt) |
JP (1) | JP2000053934A (pt) |
KR (1) | KR100609804B1 (pt) |
CN (1) | CN1156549C (pt) |
BR (1) | BR9912488A (pt) |
WO (1) | WO2000006661A1 (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000144082A (ja) * | 1998-11-16 | 2000-05-26 | Minnesota Mining & Mfg Co <3M> | 熱硬化性接着剤組成物、接着剤、および接着剤の製造方法 |
JP2000303046A (ja) * | 1999-04-20 | 2000-10-31 | Nitto Denko Corp | ポリエステルフイルム接着用のアクリル系感圧性接着剤組成物とその接着シ―ト類 |
JP2005217369A (ja) | 2004-02-02 | 2005-08-11 | Three M Innovative Properties Co | 発光ダイオード装置用接着シート及び発光ダイオード装置 |
US20060063015A1 (en) | 2004-09-23 | 2006-03-23 | 3M Innovative Properties Company | Protected polymeric film |
US7491287B2 (en) | 2006-06-09 | 2009-02-17 | 3M Innovative Properties Company | Bonding method with flowable adhesive composition |
TWI427130B (zh) * | 2010-07-14 | 2014-02-21 | Benq Materials Corp | 黏著劑組成物及黏著層 |
TWI491638B (zh) | 2010-11-16 | 2015-07-11 | Ind Tech Res Inst | 熱硬化型組成物 |
CN102888199B (zh) * | 2012-09-17 | 2014-06-18 | 北京京东方光电科技有限公司 | 封框胶及其制备方法和应用 |
WO2016002080A1 (ja) * | 2014-07-04 | 2016-01-07 | リンテック株式会社 | 保護膜形成用フィルム |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3515578A (en) * | 1969-03-14 | 1970-06-02 | Minnesota Mining & Mfg | Pressure-sensitive-adhesive tape |
US3765972A (en) * | 1969-07-14 | 1973-10-16 | Monsanto Co | Process for adhering preformed resinous coverings to architectural surfaces |
EP0475592A3 (en) * | 1990-09-10 | 1992-08-19 | Minnesota Mining And Manufacturing Company | Coated article having improved adhesion to organic coatings |
JP3716507B2 (ja) * | 1996-03-27 | 2005-11-16 | ぺんてる株式会社 | 滑り止め性を有する塗膜を被覆した物品 |
JPH09316306A (ja) * | 1996-05-31 | 1997-12-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
EP1249479B1 (en) * | 1996-07-15 | 2004-02-18 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Method for joining members |
-
1998
- 1998-07-28 JP JP10212505A patent/JP2000053934A/ja active Pending
-
1999
- 1999-06-15 KR KR1020017001177A patent/KR100609804B1/ko not_active IP Right Cessation
- 1999-06-15 CN CNB99810521XA patent/CN1156549C/zh not_active Expired - Fee Related
- 1999-06-15 WO PCT/US1999/013486 patent/WO2000006661A1/en active IP Right Grant
- 1999-06-15 EP EP99933514A patent/EP1117747A1/en not_active Withdrawn
- 1999-06-15 BR BR9912488-2A patent/BR9912488A/pt not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2000053934A (ja) | 2000-02-22 |
CN1156549C (zh) | 2004-07-07 |
CN1317039A (zh) | 2001-10-10 |
KR20010071044A (ko) | 2001-07-28 |
KR100609804B1 (ko) | 2006-08-09 |
WO2000006661A1 (en) | 2000-02-10 |
EP1117747A1 (en) | 2001-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FA10 | Dismissal: dismissal - article 33 of industrial property law | ||
B11Y | Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired |