DE60215199T2 - Plattenmaterial und dessen verwendung in leiterplatten - Google Patents
Plattenmaterial und dessen verwendung in leiterplatten Download PDFInfo
- Publication number
- DE60215199T2 DE60215199T2 DE60215199T DE60215199T DE60215199T2 DE 60215199 T2 DE60215199 T2 DE 60215199T2 DE 60215199 T DE60215199 T DE 60215199T DE 60215199 T DE60215199 T DE 60215199T DE 60215199 T2 DE60215199 T2 DE 60215199T2
- Authority
- DE
- Germany
- Prior art keywords
- fibers
- product
- tensile modulus
- high tensile
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 26
- 229920001169 thermoplastic Polymers 0.000 claims description 99
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 88
- 239000004416 thermosoftening plastic Substances 0.000 claims description 82
- 239000000835 fiber Substances 0.000 claims description 76
- 229920003235 aromatic polyamide Polymers 0.000 claims description 43
- 239000004760 aramid Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims description 22
- 238000010521 absorption reaction Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000004745 nonwoven fabric Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 229920005548 perfluoropolymer Polymers 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005470 impregnation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 73
- QEWSAPKRFOFQIU-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-6,7-dimethoxychromen-4-one Chemical compound C1=C(OC)C(OC)=CC=C1C1=CC(=O)C2=C(O)C(OC)=C(OC)C=C2O1 QEWSAPKRFOFQIU-UHFFFAOYSA-N 0.000 description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 31
- 239000002002 slurry Substances 0.000 description 26
- 239000000203 mixture Substances 0.000 description 20
- 229920000889 poly(m-phenylene isophthalamide) Polymers 0.000 description 20
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 17
- 239000000843 powder Substances 0.000 description 17
- 238000003490 calendering Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000004744 fabric Substances 0.000 description 13
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- 239000007787 solid Substances 0.000 description 12
- 239000003365 glass fiber Substances 0.000 description 11
- 239000011343 solid material Substances 0.000 description 11
- 238000001035 drying Methods 0.000 description 10
- 239000008188 pellet Substances 0.000 description 10
- 230000035699 permeability Effects 0.000 description 10
- 238000010791 quenching Methods 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 229920006231 aramid fiber Polymers 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- -1 polytetrafluoroethylene Polymers 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 229920006380 polyphenylene oxide Polymers 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010561 standard procedure Methods 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 4
- 230000004584 weight gain Effects 0.000 description 4
- 235000019786 weight gain Nutrition 0.000 description 4
- ASDNIIDZSQLDMR-UHFFFAOYSA-N 2-[2-(1,3-benzoxazol-2-yl)phenyl]-1,3-benzoxazole Chemical compound C1=CC=C2OC(C=3C(C=4OC5=CC=CC=C5N=4)=CC=CC=3)=NC2=C1 ASDNIIDZSQLDMR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 229920006355 Tefzel Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- MLVLNZHRNZLCPI-UHFFFAOYSA-N 2-[2-(1,3-benzothiazol-2-yl)phenyl]-1,3-benzothiazole Chemical compound C1=CC=C2SC(C=3C(C=4SC5=CC=CC=C5N=4)=CC=CC=3)=NC2=C1 MLVLNZHRNZLCPI-UHFFFAOYSA-N 0.000 description 2
- NQVCKXMOMGRVES-UHFFFAOYSA-N 2-[2-(1h-benzimidazol-2-yl)phenyl]-1h-benzimidazole Chemical compound C1=CC=C2NC(C=3C(C=4NC5=CC=CC=C5N=4)=CC=CC=3)=NC2=C1 NQVCKXMOMGRVES-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000011236 particulate material Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- UUFJCZCYDCAHAH-UHFFFAOYSA-N 1h-naphthalene-2,2-dicarboxylic acid Chemical compound C1=CC=C2C=CC(C(=O)O)(C(O)=O)CC2=C1 UUFJCZCYDCAHAH-UHFFFAOYSA-N 0.000 description 1
- YCGKJPVUGMBDDS-UHFFFAOYSA-N 3-(6-azabicyclo[3.1.1]hepta-1(7),2,4-triene-6-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2C=3C=C2C=CC=3)=C1 YCGKJPVUGMBDDS-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 101100170991 Caenorhabditis elegans dpf-6 gene Proteins 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241000287828 Gallus gallus Species 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- FDYSLPWVICIMPK-UHFFFAOYSA-N NC(=O)c1ccc(cc1)C(N)=O.N(ONc1ccccc1)c1ccccc1 Chemical compound NC(=O)c1ccc(cc1)C(N)=O.N(ONc1ccccc1)c1ccccc1 FDYSLPWVICIMPK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- D04H1/4374—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece using different kinds of webs, e.g. by layering webs
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- D04H1/4382—Stretched reticular film fibres; Composite fibres; Mixed fibres; Ultrafine fibres; Fibres for artificial leather
- D04H1/43835—Mixed fibres, e.g. at least two chemically different fibres or fibre blends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/249941—Fiber is on the surface of a polymeric matrix having no embedded portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Paper (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31588501P | 2001-08-30 | 2001-08-30 | |
| US315885P | 2001-08-30 | ||
| PCT/US2002/027546 WO2003022020A2 (en) | 2001-08-30 | 2002-08-29 | Sheet material and its use in circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60215199D1 DE60215199D1 (de) | 2006-11-16 |
| DE60215199T2 true DE60215199T2 (de) | 2007-08-23 |
Family
ID=23226483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60215199T Expired - Lifetime DE60215199T2 (de) | 2001-08-30 | 2002-08-29 | Plattenmaterial und dessen verwendung in leiterplatten |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6929848B2 (enExample) |
| EP (1) | EP1423995B1 (enExample) |
| JP (1) | JP2005501764A (enExample) |
| KR (1) | KR100875353B1 (enExample) |
| CN (1) | CN105189115A (enExample) |
| AU (1) | AU2002327571A1 (enExample) |
| BR (1) | BR0212702A (enExample) |
| CA (1) | CA2455053C (enExample) |
| DE (1) | DE60215199T2 (enExample) |
| MX (1) | MXPA04000914A (enExample) |
| TW (1) | TWI239290B (enExample) |
| WO (1) | WO2003022020A2 (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124763A (ja) * | 2000-10-16 | 2002-04-26 | Matsushita Electric Ind Co Ltd | 回路形成基板の製造方法、回路形成基板および回路形成基板用材料 |
| JP2004202834A (ja) * | 2002-12-25 | 2004-07-22 | Sumitomo Chem Co Ltd | アラミド積層体およびその製造方法 |
| TW200615142A (en) * | 2004-06-30 | 2006-05-16 | Sumitomo Chemical Co | Films |
| CA2499849C (en) * | 2005-03-09 | 2010-02-02 | Zcl Composites Inc. | Composite laminated sheet material for containment sumps |
| US7524388B2 (en) * | 2005-05-10 | 2009-04-28 | World Properties, Inc. | Composites, method of manufacture thereof, and articles formed therefrom |
| US8168292B2 (en) * | 2006-06-15 | 2012-05-01 | Innegra Technologies, Llc | Composite materials including amorphous thermoplastic fibers |
| US20080145602A1 (en) | 2006-12-15 | 2008-06-19 | Gary Lee Hendren | Processes for making shaped honeycomb and honeycombs made thereby |
| US7771809B2 (en) * | 2006-12-15 | 2010-08-10 | E. I. Du Pont De Nemours And Company | Shaped honeycomb |
| US8025949B2 (en) | 2006-12-15 | 2011-09-27 | E.I. Du Pont De Nemours And Company | Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom |
| US7785520B2 (en) * | 2006-12-15 | 2010-08-31 | E.I. Du Pont De Nemours And Company | Processes for making shaped honeycomb and honeycombs made thereby |
| US7771811B2 (en) | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from controlled porosity paper |
| US7815993B2 (en) | 2006-12-15 | 2010-10-19 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having flame retardant thermoplastic binder |
| US20080286522A1 (en) * | 2006-12-15 | 2008-11-20 | Subhotosh Khan | Honeycomb having a low coefficient of thermal expansion and articles made from same |
| US7771810B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having a high melt point thermoplastic fiber |
| JP5014113B2 (ja) * | 2007-01-26 | 2012-08-29 | イビデン株式会社 | シート材、その製造方法、排気ガス処理装置および消音装置 |
| JP4261590B2 (ja) * | 2007-01-31 | 2009-04-30 | 株式会社日立エンジニアリング・アンド・サービス | 無接着剤アラミド−ポリエステル積層体、その製造方法及び製造装置 |
| US7648758B2 (en) | 2007-02-06 | 2010-01-19 | Innegrity, Llc | Low dielectric loss composite material |
| US20080188153A1 (en) * | 2007-02-06 | 2008-08-07 | Innegrity, Llc | Method of Forming a Low Dielectric Loss Composite Material |
| US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US7803247B2 (en) * | 2007-12-21 | 2010-09-28 | E.I. Du Pont De Nemours And Company | Papers containing floc derived from diamino diphenyl sulfone |
| JP4402734B1 (ja) * | 2008-07-30 | 2010-01-20 | 株式会社日立エンジニアリング・アンド・サービス | 無接着剤アラミド−ポリフェニレンサルファイド積層体の製造方法、回転電機の絶縁部材及び絶縁構造 |
| JP2012116906A (ja) * | 2010-11-30 | 2012-06-21 | Sumitomo Chemical Co Ltd | 樹脂含浸シート及び導電層付き樹脂含浸シート |
| US20150305151A1 (en) * | 2011-01-27 | 2015-10-22 | Longpont Co., Ltd. | Synthetic paper |
| WO2014003835A1 (en) | 2012-06-28 | 2014-01-03 | 3M Innovative Properties Company | Thermally conductive substrate article |
| WO2014046014A1 (ja) * | 2012-09-20 | 2014-03-27 | 株式会社クラレ | 回路基板およびその製造方法 |
| US11004792B2 (en) | 2018-09-28 | 2021-05-11 | Intel Corporation | Microelectronic device including fiber-containing build-up layers |
| CN110154464A (zh) * | 2019-06-14 | 2019-08-23 | 赣州龙邦材料科技有限公司 | 芳纶纸基挠性覆铜板及其制造方法 |
| WO2021060255A1 (ja) | 2019-09-25 | 2021-04-01 | 株式会社村田製作所 | 液晶ポリマーパウダーおよびその製造方法 |
| CN115958851A (zh) * | 2021-10-09 | 2023-04-14 | 华为技术有限公司 | 天线罩、以及天线罩用的堆叠板材、复合板材及制作方法 |
| WO2026031189A1 (en) * | 2024-08-09 | 2026-02-12 | Polyone Management (Shanghai) Co. Ltd. | Copper-clad laminate and process for manufacturing the same |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5857446B2 (ja) * | 1977-03-10 | 1983-12-20 | 日東電工株式会社 | 樹脂含浸基材とその製造方法 |
| NZ222302A (en) | 1986-12-08 | 1989-09-27 | Nordson Corp | Spraying moisture absorbent particles into a layer of forming non woven wadding |
| US4895752A (en) * | 1987-12-18 | 1990-01-23 | E. I. Du Pont De Nemours And Company | Low dielectric constant laminate of fluoropolymer and polyaramid |
| US5196259A (en) * | 1990-12-07 | 1993-03-23 | The Dow Chemical Company | Matrix composites in which the matrix contains polybenzoxazole or polybenzothiazole |
| JP3312470B2 (ja) * | 1994-03-16 | 2002-08-05 | 東レ株式会社 | プリプレグおよび積層体 |
| KR100398482B1 (ko) * | 1997-06-10 | 2003-09-19 | 데이진 가부시키가이샤 | 내열성 섬유지 |
| JPH11117184A (ja) * | 1997-10-14 | 1999-04-27 | Oji Paper Co Ltd | 積層板用基材及びその製造方法ならびにプリプレグ及び積層板 |
| JP2000334871A (ja) * | 1999-05-28 | 2000-12-05 | Oji Paper Co Ltd | 積層板用基材、プリプレグ、及びその製造方法 |
| US6258203B1 (en) * | 1999-09-21 | 2001-07-10 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and acrylic fibers |
| EP1243696A3 (en) | 2001-03-23 | 2002-11-20 | Sumitomo Chemical Company, Limited | Low hygroscopic paper and method of producing the same |
-
2002
- 2002-08-26 US US10/227,998 patent/US6929848B2/en not_active Expired - Fee Related
- 2002-08-29 BR BR0212702-4A patent/BR0212702A/pt not_active Application Discontinuation
- 2002-08-29 DE DE60215199T patent/DE60215199T2/de not_active Expired - Lifetime
- 2002-08-29 AU AU2002327571A patent/AU2002327571A1/en not_active Abandoned
- 2002-08-29 CN CN02816862.3A patent/CN105189115A/zh active Pending
- 2002-08-29 JP JP2003525568A patent/JP2005501764A/ja active Pending
- 2002-08-29 CA CA002455053A patent/CA2455053C/en not_active Expired - Fee Related
- 2002-08-29 MX MXPA04000914A patent/MXPA04000914A/es unknown
- 2002-08-29 EP EP02763569A patent/EP1423995B1/en not_active Expired - Lifetime
- 2002-08-29 KR KR1020047002968A patent/KR100875353B1/ko not_active Expired - Fee Related
- 2002-08-29 WO PCT/US2002/027546 patent/WO2003022020A2/en not_active Ceased
- 2002-08-30 TW TW091119805A patent/TWI239290B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1423995A2 (en) | 2004-06-02 |
| CA2455053A1 (en) | 2003-03-13 |
| BR0212702A (pt) | 2004-10-19 |
| AU2002327571A1 (en) | 2003-03-18 |
| EP1423995B1 (en) | 2006-10-04 |
| KR20040029099A (ko) | 2004-04-03 |
| US20030087077A1 (en) | 2003-05-08 |
| TWI239290B (en) | 2005-09-11 |
| DE60215199D1 (de) | 2006-11-16 |
| KR100875353B1 (ko) | 2008-12-22 |
| US6929848B2 (en) | 2005-08-16 |
| WO2003022020A2 (en) | 2003-03-13 |
| CN105189115A (zh) | 2015-12-23 |
| MXPA04000914A (es) | 2004-04-02 |
| WO2003022020A3 (en) | 2003-10-09 |
| CA2455053C (en) | 2009-12-22 |
| JP2005501764A (ja) | 2005-01-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |