JP2005347313A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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Abstract
【解決手段】 半導体基板15の表面上の層間絶縁膜17にコンタクトホール18を形成した後、Al電極19となるAl合金膜42をスパッタ法で2段階に分けて成膜する。1回目の成膜では、400℃よりも低い温度(例えば150℃)で、Al合金膜41の層間絶縁膜17上での膜厚が1〜2μmとなるように、Al合金膜41を成膜する。その後、400℃以上の温度(例えば415℃)で第1の加熱処理を行う。続いて、400℃以上の高い温度(例えば415℃)で、Al合金膜42の層間絶縁膜上での膜厚が5.5μm程度となるように、2回目の成膜を行う。このようにして、膜厚が厚く、スリットや空孔が存在しない密な状態であるAl電極19を形成する。
【選択図】 図2
Description
図1に本発明の一実施形態における半導体装置の部分断面図を示す。図1は、図9中の領域Aの拡大図であり、半導体基板15の上に形成されているAl電極19、Niメッキ層20を拡大した図である。
図5(a)、(b)に、本実施形態の半導体装置の製造工程を示す。なお、図5では、図2と同様の構成部に図2と同じ符号を付している。本実施形態は、第1実施形態の製造工程のうち、Al電極19の形成(Al合金膜42の成膜)方法を変更したものである。
図6(a)、(b)、(c)、(d)に、本実施形態の半導体装置の製造工程を示す。本実施形態は、第1実施形態の製造工程のうち、Al電極19の形成(Al合金膜42の成膜)方法を変更したものである。
(1)図7、8に他の実施形態における半導体装置の部分断面図を示す。これらの図は、図1に対応する図であり、図1と同様の構成部には図1と同じ符号を付している。
4…上側ヒートシンク、5…ヒートシンクブロック、6…半田、
7…封止用樹脂、9…リードフレーム、10…ボンディングワイヤ、
11…P+型基板、12…N−型層、13…P型層、14…N+型層、
15…半導体基板、16…ゲート電極、17…層間絶縁膜、
18…コンタクトホール、19…Al電極、
19a…凹部、19b…空孔、19c…スリット、
20…Niメッキ層、21…電極部、22…保護膜、23…コレクタ電極、
31…Al電極19における層間絶縁膜17の最上部17aからAl電極19の表面に存在する凹部19aの底面までの長さ、
32…Al電極19における層間絶縁膜17の最上部17aから空孔19bまでの長さ、
33…Al電極19における層間絶縁膜17の最上部17aからスリット19cの最下部までの長さ、
41…1回目の成膜により形成されたAl合金膜、
42…2回目の成膜により形成されたAl合金膜。
Claims (8)
- 半導体基板(15)の素子形成面(15a)上に、層間絶縁膜(17)を介して、電極部(21)としてのAlを主成分とするAl金属層(19)およびNi層(20)が順に形成された半導体チップ(2)と、電気伝導性を有する接合部材(6b)を介して、前記Ni層(20)と接合された導体部材(5)とを備える半導体装置の製造方法であって、
半導体素子が形成された前記半導体基板(15)を用意する工程と、
前記半導体基板(15)の表面上に前記層間絶縁膜(17)を形成する工程と、
密な状態である部分を有する前記Al金属層(19)であって、前記密な状態である部分の前記層間絶縁膜(17)の最上部(17a)を通って前記半導体基板(15)の表面に平行な線を引いた場合における前記平行な線からの前記半導体基板(15)の表面に垂直な方向での厚さ(31、32、33)が、温度変化によって前記接合部材(6b)および前記導体部材(5)が膨張収縮したときに、前記Al金属層(19)が塑性変形することで、前記接合部材(6b)および前記導体部材(5)の膨張収縮に追従できる厚さとなっている前記Al金属層(19)を、前記層間絶縁膜(17)上に形成する工程と、
前記Al金属層(19)上に前記Ni層(20)を形成する工程と、
前記半導体基板(15)上に前記層間絶縁膜(17)と、前記Al金属層(19)および前記Ni層(20)からなる前記電極部(21)とを有する前記半導体チップを形成する工程と、
前記半導体チップ(2)、前記接合部材(6b)および前記導体部材(5)を用意する工程と、
前記導体部材(5)を前記半導体チップ(2)の前記電極部(21)上に配置して、前記接合部材(6b)により、前記導体部材(5)と前記Ni層(20)とを接合する工程とを有することを特徴とする半導体装置の製造方法。 - 半導体基板(15)の素子形成面(15a)上に、層間絶縁膜(17)を介して、電極部(21)としてのAlを主成分とするAl金属層(19)およびNi層(20)が順に形成された半導体チップ(2)と、
電気伝導性を有する第1の接合部材(6b)を介して、前記Ni層(20)に接合された第1の導体部材(5)と、
電気伝導性を有する第2の接合部材(6a)を介して、前記半導体基板(15)の前記素子形成面(15a)とは反対側の面に接合された第2の導体部材(3)と、
前記第1の導体部材(5)の前記電極部(21)が接合された面とは反対側の面に電気伝導性を有する第3の接合部材(6c)を介して接合された第3の導体部材(4)と、
前記半導体チップ(2)、前記第1の導体部材(5)、前記第2の導体部材(3)における前記半導体チップ(2)と接合している面および前記第3の導体部材(4)における前記第1の導体部材(5)と接合している面を封止する封止部材(7)とを備える半導体装置の製造方法であって、
半導体素子が形成された前記半導体基板(15)を用意する工程と、
前記半導体基板(15)の表面上に前記層間絶縁膜(17)を形成する工程と、
密な状態である部分を有する前記Al金属層(19)であって、前記密な状態である部分の前記層間絶縁膜(17)の最上部(17a)を通って前記半導体基板(15)の表面に平行な線を引いた場合における前記平行な線からの前記半導体基板(15)の表面に垂直な方向での厚さ(31、32、33)が、温度変化によって前記接合部材(6b)および前記導体部材(5)が膨張収縮したときに、前記Al金属層(19)が塑性変形することで、前記接合部材(6b)および前記導体部材(5)の膨張収縮に追従できる厚さとなっている前記Al金属層(19)を、前記層間絶縁膜(17)上に形成する工程と、
前記Al金属層(19)上に前記Ni層(20)を形成する工程と、
前記半導体基板(15)上に前記層間絶縁膜(17)と、前記Al金属層(19)および前記Ni層(20)からなる前記電極部(21)とを有する前記半導体チップ(2)を形成する工程と、
前記半導体チップ(2)、前記第1、第2、第3の接合部材(6b、6a、6c)、前記第1、第2、第3の導体部材(5、3、4)を用意する工程と、
前記半導体チップ(2)の前記半導体基板(15)の前記素子形成面(15a)とは反対側の面に、前記第2の導体部材(3)を前記第2の接合部材(6a)により接合し、前記半導体チップ(2)の前記Ni層(20)に前記第1の導体部材(5)を前記第1の接合部材(6b)により接合し、前記第1の導体部材(5)の前記Ni層(20)と接合された面とは反対側の面に第3の導体部材(4)を第3の接合部材(6c)により接合する工程と、
前記半導体チップ(2)、前記第1の導体部材(5)、前記第2の導体部材(3)における前記半導体チップ(2)と接合している面および前記第3の導体部材(4)における前記第1の導体部材(5)と接合している面を前記封止部材(7)により封止する工程とを有することを特徴とする半導体装置の製造方法。 - 前記Al金属層(19)を形成する工程では、前記Al金属層(19)上に前記Ni層(20)を形成した後において、前記Al金属層(19)の密な状態である部分の前記厚さ(31、32、33)が、1.8μm以上となるように、前記Al金属層(19)を形成することを特徴とする請求項1または2に記載の半導体装置の製造方法。
- 前記層間絶縁膜(17)を形成する工程と前記Al金属層(19)を形成する工程との間に、前記層間絶縁膜(17)にコンタクトホール(18)を形成する工程を有し、
前記Al金属層(19)を形成する工程は、前記コンタクトホール(18)内から前記層間絶縁膜(17)上にわたって、前記Al金属層(19)を形成するために、400℃よりも低い温度で、膜厚が前記層間絶縁膜(17)の前記半導体基板(15)表面からの高さよりも大きく、かつ、シャドゥイングの変化点よりも小さいAlを主成分とする第1のAl金属膜(41)を成膜する第1の成膜工程と、
前記第1のAl金属膜(41)を400℃以上の温度で加熱する第1の加熱工程と、
前記第1のAl金属膜(41)の上に、少なくとも、前記第1のAl金属膜(41)と同じ成分で構成される第2のAl金属膜(42)を成膜することで、前記電極部(21)としてのAl金属層(19)を形成する第2の成膜工程とを有することを特徴とする請求項1ないし3のいずれか1つに記載の半導体装置の製造方法。 - 前記第2の成膜工程では、前記第1の成膜工程と同じ成膜条件で第2のAl金属膜(42)を成膜し、
前記Al金属層(19)を形成する工程は、前記第2の成膜工程の後に、前記第2のAl金属膜(42)を400℃以上の温度で加熱する第2の加熱工程を有することを特徴とする請求項4に記載の半導体装置の製造方法。 - 前記第2の成膜工程では、前記第1の加熱工程を行った後、400℃以上の温度に加熱しながら、前記第2のAl金属膜(42)を成膜することで、前記Al金属層(19)を形成することを特徴とする請求項4に記載の半導体装置の製造方法。
- 前記第1の加熱工程と前記第2の成膜工程とを同時に行うことを特徴とする請求項4に記載の半導体装置の製造方法。
- 前記温度を445℃以下とすることを特徴とする請求項4ないし7のいずれか1つに記載の半導体装置の製造方法。
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