JP2005317978A5 - - Google Patents
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- Publication number
- JP2005317978A5 JP2005317978A5 JP2005131256A JP2005131256A JP2005317978A5 JP 2005317978 A5 JP2005317978 A5 JP 2005317978A5 JP 2005131256 A JP2005131256 A JP 2005131256A JP 2005131256 A JP2005131256 A JP 2005131256A JP 2005317978 A5 JP2005317978 A5 JP 2005317978A5
- Authority
- JP
- Japan
- Prior art keywords
- impurity
- gate
- forming
- dielectric layer
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012535 impurity Substances 0.000 claims 19
- 238000000034 method Methods 0.000 claims 17
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 230000015572 biosynthetic process Effects 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 230000001934 delay Effects 0.000 claims 2
- 239000002019 doping agent Substances 0.000 claims 2
- 239000007943 implant Substances 0.000 claims 1
- 238000002513 implantation Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/709,323 | 2004-04-28 | ||
| US10/709,323 US7056773B2 (en) | 2004-04-28 | 2004-04-28 | Backgated FinFET having different oxide thicknesses |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005317978A JP2005317978A (ja) | 2005-11-10 |
| JP2005317978A5 true JP2005317978A5 (enExample) | 2008-05-08 |
| JP5039979B2 JP5039979B2 (ja) | 2012-10-03 |
Family
ID=35187635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005131256A Expired - Fee Related JP5039979B2 (ja) | 2004-04-28 | 2005-04-28 | FinFET半導体構造 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US7056773B2 (enExample) |
| JP (1) | JP5039979B2 (enExample) |
| CN (1) | CN100375252C (enExample) |
| TW (1) | TW200539279A (enExample) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050156228A1 (en) * | 2004-01-16 | 2005-07-21 | Jeng Erik S. | Manufacture method and structure of a nonvolatile memory |
| JP2006019578A (ja) * | 2004-07-02 | 2006-01-19 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2006128494A (ja) * | 2004-10-29 | 2006-05-18 | Toshiba Corp | 半導体集積回路装置及びその製造方法 |
| NZ548087A (en) * | 2005-04-29 | 2010-10-29 | Tomizo Yamamoto | Rubber or resin foam containing zirconium or germanium |
| US7601404B2 (en) * | 2005-06-09 | 2009-10-13 | United Microelectronics Corp. | Method for switching decoupled plasma nitridation processes of different doses |
| US7288802B2 (en) * | 2005-07-27 | 2007-10-30 | International Business Machines Corporation | Virtual body-contacted trigate |
| US20070047364A1 (en) * | 2005-08-31 | 2007-03-01 | International Business Machines Corporation | Methods and apparatus for varying a supply voltage or reference voltage using independent control of diode voltage in asymmetrical double-gate devices |
| US20070085576A1 (en) * | 2005-10-14 | 2007-04-19 | Hector Sanchez | Output driver circuit with multiple gate devices |
| US7265004B2 (en) * | 2005-11-14 | 2007-09-04 | Freescale Semiconductor, Inc. | Electronic devices including a semiconductor layer and a process for forming the same |
| US7309626B2 (en) * | 2005-11-15 | 2007-12-18 | International Business Machines Corporation | Quasi self-aligned source/drain FinFET process |
| US7629220B2 (en) * | 2006-06-30 | 2009-12-08 | Freescale Semiconductor, Inc. | Method for forming a semiconductor device and structure thereof |
| KR100838378B1 (ko) * | 2006-09-29 | 2008-06-13 | 주식회사 하이닉스반도체 | 핀트랜지스터의 제조 방법 |
| US20080111185A1 (en) * | 2006-11-13 | 2008-05-15 | International Business Machines Corporation | Asymmetric multi-gated transistor and method for forming |
| US8217435B2 (en) | 2006-12-22 | 2012-07-10 | Intel Corporation | Floating body memory cell having gates favoring different conductivity type regions |
| US7699996B2 (en) * | 2007-02-28 | 2010-04-20 | International Business Machines Corporation | Sidewall image transfer processes for forming multiple line-widths |
| US20080211568A1 (en) * | 2007-03-01 | 2008-09-04 | Infineon Technologies Ag | MuGFET POWER SWITCH |
| EP2157697B1 (en) | 2007-03-09 | 2013-02-27 | NEC Corporation | Configurable circuit and configuration method |
| US7435636B1 (en) | 2007-03-29 | 2008-10-14 | Micron Technology, Inc. | Fabrication of self-aligned gallium arsenide MOSFETs using damascene gate methods |
| US20080296680A1 (en) * | 2007-05-30 | 2008-12-04 | Qimonda Ag | Method of making an integrated circuit including doping a fin |
| US7476578B1 (en) * | 2007-07-12 | 2009-01-13 | International Business Machines Corporation | Process for finFET spacer formation |
| US20090206405A1 (en) * | 2008-02-15 | 2009-08-20 | Doyle Brian S | Fin field effect transistor structures having two dielectric thicknesses |
| CN102460660B (zh) * | 2009-06-26 | 2014-08-06 | 株式会社东芝 | 半导体装置的制造方法 |
| TWI869133B (zh) * | 2009-08-07 | 2025-01-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| US8420476B2 (en) | 2010-05-27 | 2013-04-16 | International Business Machines Corporation | Integrated circuit with finFETs and MIM fin capacitor |
| CN102468381A (zh) * | 2010-11-23 | 2012-05-23 | 孙智江 | 一种形成p型重掺杂的方法 |
| US9082849B2 (en) | 2011-09-30 | 2015-07-14 | The Institute of Microelectronics Chinese Academy of Science | Semiconductor structure and method for manufacturing the same |
| CN103035711B (zh) * | 2011-09-30 | 2016-04-20 | 中国科学院微电子研究所 | 一种半导体结构及其制造方法 |
| KR20180070718A (ko) * | 2011-12-30 | 2018-06-26 | 인텔 코포레이션 | 집적 회로 구조물 및 집적 회로 구조물의 제조 방법 |
| FR2995720B1 (fr) * | 2012-09-18 | 2014-10-24 | Commissariat Energie Atomique | Procede de realisation d'un dispositif a effet de champ a double grille a grilles independantes |
| CN103985748B (zh) * | 2013-02-08 | 2016-12-28 | 中国科学院微电子研究所 | 半导体设置及其制造方法 |
| US8987793B2 (en) * | 2013-04-23 | 2015-03-24 | Broadcom Corporation | Fin-based field-effect transistor with split-gate structure |
| CN104134668B (zh) * | 2013-05-03 | 2017-02-22 | 中国科学院微电子研究所 | 存储器件及其制造方法和存取方法 |
| US9087869B2 (en) | 2013-05-23 | 2015-07-21 | International Business Machines Corporation | Bulk semiconductor fins with self-aligned shallow trench isolation structures |
| EP4224531A3 (en) * | 2013-09-25 | 2023-08-23 | Tahoe Research, Ltd. | Isolation well doping with solid-state diffusion sources for finfet architectures |
| TWI538108B (zh) * | 2014-05-08 | 2016-06-11 | 林崇榮 | 具電阻性元件之非揮發性記憶體與其製作方法 |
| US9515188B2 (en) * | 2014-12-22 | 2016-12-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin field effect transistors having conformal oxide layers and methods of forming same |
| CN107431033B (zh) * | 2015-03-20 | 2021-10-22 | 应用材料公司 | 用于3d共形处理的原子层处理腔室 |
| US9570388B2 (en) | 2015-06-26 | 2017-02-14 | International Business Machines Corporation | FinFET power supply decoupling |
| CN105609470B (zh) * | 2015-08-20 | 2019-01-18 | 中国科学院微电子研究所 | 具有均匀阈值电压分布的半导体器件及其制造方法 |
| CN105720970B (zh) * | 2016-01-22 | 2018-06-26 | 宁波大学 | 一种基于FinFET器件的异或/同或门电路 |
| CN107039522B (zh) * | 2016-02-04 | 2019-12-31 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
| CN106057657A (zh) * | 2016-07-22 | 2016-10-26 | 上海华力微电子有限公司 | 多重图形化方法 |
| CN106356305B (zh) * | 2016-11-18 | 2019-05-31 | 上海华力微电子有限公司 | 优化鳍式场效晶体管结构的方法以及鳍式场效晶体管 |
| US9812453B1 (en) * | 2017-02-13 | 2017-11-07 | Globalfoundries Inc. | Self-aligned sacrificial epitaxial capping for trench silicide |
| CN109309005B (zh) * | 2017-07-27 | 2022-03-22 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
| US10254244B1 (en) | 2017-10-11 | 2019-04-09 | International Business Machines Corporation | Biosensor having a sensing gate dielectric and a back gate dielectric |
| WO2019132887A1 (en) * | 2017-12-27 | 2019-07-04 | Intel Corporation | Reduced electric field by thickening dielectric on the drain side |
| KR102535087B1 (ko) * | 2018-04-20 | 2023-05-19 | 삼성전자주식회사 | 반도체 장치 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3607431B2 (ja) * | 1996-09-18 | 2005-01-05 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US6448615B1 (en) * | 1998-02-26 | 2002-09-10 | Micron Technology, Inc. | Methods, structures, and circuits for transistors with gate-to-body capacitive coupling |
| JP2000164868A (ja) * | 1998-11-20 | 2000-06-16 | Nec Corp | ゲート膜形成方法及び半導体装置 |
| JP2000195968A (ja) * | 1998-12-25 | 2000-07-14 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JP2002118255A (ja) * | 2000-07-31 | 2002-04-19 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP4044276B2 (ja) * | 2000-09-28 | 2008-02-06 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US6686630B2 (en) * | 2001-02-07 | 2004-02-03 | International Business Machines Corporation | Damascene double-gate MOSFET structure and its fabrication method |
| US6593192B2 (en) * | 2001-04-27 | 2003-07-15 | Micron Technology, Inc. | Method of forming a dual-gated semiconductor-on-insulator device |
| US6611023B1 (en) * | 2001-05-01 | 2003-08-26 | Advanced Micro Devices, Inc. | Field effect transistor with self alligned double gate and method of forming same |
| JP2003110109A (ja) | 2001-09-28 | 2003-04-11 | Sharp Corp | 半導体装置及びその製造方法並びに携帯電子機器 |
| US6433609B1 (en) * | 2001-11-19 | 2002-08-13 | International Business Machines Corporation | Double-gate low power SOI active clamp network for single power supply and multiple power supply applications |
| US6800905B2 (en) * | 2001-12-14 | 2004-10-05 | International Business Machines Corporation | Implanted asymmetric doped polysilicon gate FinFET |
| US6635909B2 (en) * | 2002-03-19 | 2003-10-21 | International Business Machines Corporation | Strained fin FETs structure and method |
| US6580132B1 (en) * | 2002-04-10 | 2003-06-17 | International Business Machines Corporation | Damascene double-gate FET |
| JP2003332582A (ja) * | 2002-05-13 | 2003-11-21 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6642090B1 (en) * | 2002-06-03 | 2003-11-04 | International Business Machines Corporation | Fin FET devices from bulk semiconductor and method for forming |
| JP4004040B2 (ja) * | 2002-09-05 | 2007-11-07 | 株式会社東芝 | 半導体装置 |
| US8222680B2 (en) * | 2002-10-22 | 2012-07-17 | Advanced Micro Devices, Inc. | Double and triple gate MOSFET devices and methods for making same |
| US6709982B1 (en) * | 2002-11-26 | 2004-03-23 | Advanced Micro Devices, Inc. | Double spacer FinFET formation |
| US6885055B2 (en) * | 2003-02-04 | 2005-04-26 | Lee Jong-Ho | Double-gate FinFET device and fabricating method thereof |
| JP2005167163A (ja) * | 2003-12-05 | 2005-06-23 | National Institute Of Advanced Industrial & Technology | 二重ゲート電界効果トランジスタ |
-
2004
- 2004-04-28 US US10/709,323 patent/US7056773B2/en not_active Expired - Fee Related
-
2005
- 2005-03-17 CN CNB2005100554569A patent/CN100375252C/zh not_active Expired - Lifetime
- 2005-04-04 TW TW094110756A patent/TW200539279A/zh unknown
- 2005-04-28 JP JP2005131256A patent/JP5039979B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-02 US US11/365,504 patent/US7187042B2/en not_active Expired - Fee Related
- 2006-06-28 US US11/427,222 patent/US7476946B2/en not_active Expired - Fee Related
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