JP2005217334A - 切削方法 - Google Patents
切削方法 Download PDFInfo
- Publication number
- JP2005217334A JP2005217334A JP2004025036A JP2004025036A JP2005217334A JP 2005217334 A JP2005217334 A JP 2005217334A JP 2004025036 A JP2004025036 A JP 2004025036A JP 2004025036 A JP2004025036 A JP 2004025036A JP 2005217334 A JP2005217334 A JP 2005217334A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- blade
- cutting blade
- blades
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 547
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000013459 approach Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 88
- 235000012431 wafers Nutrition 0.000 description 84
- 238000001514 detection method Methods 0.000 description 26
- 230000009977 dual effect Effects 0.000 description 24
- 239000000725 suspension Substances 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 235000005811 Viola adunca Nutrition 0.000 description 1
- 240000009038 Viola odorata Species 0.000 description 1
- 235000013487 Viola odorata Nutrition 0.000 description 1
- 235000002254 Viola papilionacea Nutrition 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0363—Plural independent scoring blades
- Y10T83/037—Rotary scoring blades
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/081—With randomly actuated stopping means
- Y10T83/088—Responsive to tool detector or work-feed-means detector
- Y10T83/089—Responsive to tool characteristic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/162—With control means responsive to replaceable or selectable information program
- Y10T83/173—Arithmetically determined program
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/647—With means to convey work relative to tool station
- Y10T83/6584—Cut made parallel to direction of and during work movement
- Y10T83/6587—Including plural, laterally spaced tools
Abstract
【解決手段】 対向配置された第1及び第2の切削ブレード22a,22bを具備する切削装置において,被加工物12の略平行な複数本の切削ラインLを切削する切削方法が提供される。この切削方法は,第1および第2の切削ブレード22a,22bの消耗量を測定する工程と;複数本の切削ラインLのうち,第1および第2の切削ブレード22a,22bの双方を使用して同時に切削不可能な切削ラインL4〜6を,第1の切削ブレード22aと第2の切削ブレード22bのうち,消耗量が少ない方の切削ブレードを使用して切削するシングル切削工程と;を含むことを特徴とする。
【選択図】 図3
Description
以下に,本発明の第1の実施形態にかかる切削装置およびこの切削装置における切削方法について説明する。
12 : 半導体ウェハ
20a : 第1の切削ユニット
20b : 第2の切削ユニット
22a : 第1の切削ブレード
22b : 第2の切削ブレード
24a : 第1のスピンドル
24b : 第2のスピンドル
30 : チャックテーブル
60 : ブレード検出手段
80 : 制御装置
82 : 消耗量判断部
84 : ブレード交換通知部
86 : 選択ブレード指示部
L1〜9 : 切削ライン
A : 最接近させた第1及び第2の切削ブレードの間に挟まれた半導体ウェハ上の領域
Claims (3)
- 被加工物を保持するチャックテーブルと,前記被加工物を切削する第1の切削ブレードおよび第2の切削ブレードと,前記第1の切削ブレードが装着される第1のスピンドルと,前記第2の切削ブレードが装着される第2のスピンドルとを備え,前記第1のブレードと前記第2のブレードとが対向するように,前記第1のスピンドルと前記第2のスピンドルとが軸方向を同一にして配設された切削装置において,前記被加工物の略平行な複数本の切削ラインを切削する切削方法であって:
前記第1および第2の切削ブレードの消耗量を測定する,消耗量測定工程と;
前記複数本の切削ラインのうち,前記第1および第2の切削ブレードの双方を使用して同時に切削不可能な切削ラインを,前記第1の切削ブレードと前記第2の切削ブレードのうち,前記測定された消耗量が少ない方の切削ブレードを使用して切削する,シングル切削工程と;
を含むことを特徴とする,切削方法。 - 前記切削不可能な切削ラインとは,前記第1の切削ブレードと前記第2の切削ブレードとが前記第1および第2のスピンドルの軸方向に物理的に最接近できる間隔より狭い領域内に含まれる切削ラインであることを特徴とする,請求項1に記載の切削方法。
- 前記消耗量測定工程は,前記被加工物の1つのチャンネルの切削毎に行われることを特徴とする,請求項1または2のいずれかに記載の切削方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004025036A JP4481667B2 (ja) | 2004-02-02 | 2004-02-02 | 切削方法 |
US11/046,801 US7484444B2 (en) | 2004-02-02 | 2005-02-01 | Cutting device with a pair of cutting blades and elements for detecting and controlling wear of the cutting blades |
CNB2005100062865A CN100456431C (zh) | 2004-02-02 | 2005-02-02 | 具有一对切削装置的切削设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004025036A JP4481667B2 (ja) | 2004-02-02 | 2004-02-02 | 切削方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005217334A true JP2005217334A (ja) | 2005-08-11 |
JP2005217334A5 JP2005217334A5 (ja) | 2005-12-15 |
JP4481667B2 JP4481667B2 (ja) | 2010-06-16 |
Family
ID=34805787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004025036A Expired - Lifetime JP4481667B2 (ja) | 2004-02-02 | 2004-02-02 | 切削方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7484444B2 (ja) |
JP (1) | JP4481667B2 (ja) |
CN (1) | CN100456431C (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007050493A (ja) * | 2005-08-19 | 2007-03-01 | Disco Abrasive Syst Ltd | 切削装置 |
JP2007098536A (ja) * | 2005-10-06 | 2007-04-19 | Disco Abrasive Syst Ltd | 切削ブレードの交換装置 |
JP2009012127A (ja) * | 2007-07-05 | 2009-01-22 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012160575A (ja) * | 2011-01-31 | 2012-08-23 | Shindengen Electric Mfg Co Ltd | 半導体ウエハーのダイシング方法及び半導体ウエハー |
KR101265706B1 (ko) | 2005-10-13 | 2013-05-21 | 가부시기가이샤 디스코 | 절삭 블레이드의 교환장치 |
JP2013158871A (ja) * | 2012-02-03 | 2013-08-19 | Disco Corp | 研削装置 |
CN104835753A (zh) * | 2014-02-11 | 2015-08-12 | 承澔科技股份有限公司 | 切割刀具的位置感测装置 |
CN105682872A (zh) * | 2013-11-30 | 2016-06-15 | 未来股份公司 | 用于刀片磨锐的控制设备 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042855A (ja) * | 2005-08-03 | 2007-02-15 | Disco Abrasive Syst Ltd | ブレード検出手段を備えた切削装置 |
GB2462745B (en) * | 2007-04-10 | 2011-09-28 | Acco Brands Usa Llc | Sheet trimmer |
DE102011119719A1 (de) * | 2011-11-30 | 2013-06-06 | GEA CFS Bühl GmbH | Verfahren zum Aufschneiden eines Lebensmittelriegels unter Verwendung eines Schwingungssensors |
US20130273717A1 (en) * | 2012-04-17 | 2013-10-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and Method for the Singulation of a Semiconductor Wafer |
CN103066937A (zh) * | 2012-12-07 | 2013-04-24 | 江苏汇成光电有限公司 | 切割机刀片侦测装置 |
KR20140112607A (ko) * | 2013-03-11 | 2014-09-24 | 삼성디스플레이 주식회사 | 나이프 검사용 광센서 조립체 및 이를 포함하는 기판 절단 장치 |
CN106079123A (zh) * | 2016-06-23 | 2016-11-09 | 无锡宏纳科技有限公司 | 一种可保护刀刃的晶圆切割刀 |
JP7028607B2 (ja) * | 2017-11-06 | 2022-03-02 | 株式会社ディスコ | 切削装置 |
JP7229093B2 (ja) * | 2019-05-13 | 2023-02-27 | 株式会社ディスコ | ブレード脱着補助装置 |
CN110739216B (zh) * | 2019-10-28 | 2022-03-29 | 东莞记忆存储科技有限公司 | 一种单轴分步切割晶圆的加工工艺方法 |
US11608642B2 (en) * | 2020-02-13 | 2023-03-21 | LVP Stairs LLC | Devices and methods for fitting luxury vinyl plank floorcovering to interior stairs |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3586944T2 (de) * | 1984-12-27 | 1993-05-06 | Disco Abrasive Systems Ltd | Vorrichtung zum abtrennen von halbleiterscheiben. |
DE69205786T2 (de) * | 1991-08-21 | 1996-03-28 | Tokyo Seimitsu Co Ltd | Blattpositiondetektionsvorrichtung. |
EP1000706B1 (en) * | 1996-06-15 | 2008-05-07 | Cinetic Landis Grinding Limited | Grinding machine spindle flexibly attached to platform |
JP3223421B2 (ja) * | 1996-08-13 | 2001-10-29 | 株式会社東京精密 | ダイシング装置 |
US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
US5904083A (en) * | 1997-04-10 | 1999-05-18 | J.R. Simplot Company | Knife fixture with broken blade detector |
US6102023A (en) * | 1997-07-02 | 2000-08-15 | Disco Corporation | Precision cutting apparatus and cutting method using the same |
US6348943B1 (en) * | 1998-10-30 | 2002-02-19 | Industrial Technology Research Institute | Digital non-contact blade position detection apparatus |
JP3282145B2 (ja) * | 1998-12-21 | 2002-05-13 | 株式会社東京精密 | ダイシング装置 |
KR20000076987A (ko) * | 1999-03-31 | 2000-12-26 | 다구마시로오 | 피가공물 연삭방법 및 장치 |
JP4447074B2 (ja) * | 1999-06-21 | 2010-04-07 | 株式会社ディスコ | 切削装置 |
JP4640715B2 (ja) * | 2000-07-14 | 2011-03-02 | 株式会社ディスコ | アライメント方法及びアライメント装置 |
JP2002217135A (ja) * | 2001-01-19 | 2002-08-02 | Disco Abrasive Syst Ltd | 切削装置 |
JP2002359211A (ja) * | 2001-05-30 | 2002-12-13 | Disco Abrasive Syst Ltd | 切削機 |
SG118084A1 (en) * | 2001-08-24 | 2006-01-27 | Micron Technology Inc | Method and apparatus for cutting semiconductor wafers |
US6761615B2 (en) * | 2001-11-01 | 2004-07-13 | Advanced Dicing Technologies, Ltd. | In-situ wear measurement apparatus for dicing saw blades |
JP2003236748A (ja) * | 2002-02-14 | 2003-08-26 | Sumitomo Heavy Ind Ltd | 研削装置 |
US6767615B1 (en) * | 2003-04-02 | 2004-07-27 | Ren Judkins | Cellular material having cells with swirled strands |
-
2004
- 2004-02-02 JP JP2004025036A patent/JP4481667B2/ja not_active Expired - Lifetime
-
2005
- 2005-02-01 US US11/046,801 patent/US7484444B2/en active Active
- 2005-02-02 CN CNB2005100062865A patent/CN100456431C/zh active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007050493A (ja) * | 2005-08-19 | 2007-03-01 | Disco Abrasive Syst Ltd | 切削装置 |
JP2007098536A (ja) * | 2005-10-06 | 2007-04-19 | Disco Abrasive Syst Ltd | 切削ブレードの交換装置 |
KR101272806B1 (ko) * | 2005-10-06 | 2013-06-10 | 가부시기가이샤 디스코 | 절삭 블레이드의 교환장치 |
KR101265706B1 (ko) | 2005-10-13 | 2013-05-21 | 가부시기가이샤 디스코 | 절삭 블레이드의 교환장치 |
JP2009012127A (ja) * | 2007-07-05 | 2009-01-22 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012160575A (ja) * | 2011-01-31 | 2012-08-23 | Shindengen Electric Mfg Co Ltd | 半導体ウエハーのダイシング方法及び半導体ウエハー |
JP2013158871A (ja) * | 2012-02-03 | 2013-08-19 | Disco Corp | 研削装置 |
CN105682872A (zh) * | 2013-11-30 | 2016-06-15 | 未来股份公司 | 用于刀片磨锐的控制设备 |
CN104835753A (zh) * | 2014-02-11 | 2015-08-12 | 承澔科技股份有限公司 | 切割刀具的位置感测装置 |
Also Published As
Publication number | Publication date |
---|---|
US20050166745A1 (en) | 2005-08-04 |
CN100456431C (zh) | 2009-01-28 |
US7484444B2 (en) | 2009-02-03 |
CN1652305A (zh) | 2005-08-10 |
JP4481667B2 (ja) | 2010-06-16 |
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