JP7028607B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP7028607B2 JP7028607B2 JP2017213647A JP2017213647A JP7028607B2 JP 7028607 B2 JP7028607 B2 JP 7028607B2 JP 2017213647 A JP2017213647 A JP 2017213647A JP 2017213647 A JP2017213647 A JP 2017213647A JP 7028607 B2 JP7028607 B2 JP 7028607B2
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- JP
- Japan
- Prior art keywords
- cutting
- holding table
- cutting blade
- moving
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
- B23Q1/56—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism
- B23Q1/60—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism
- B23Q1/62—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism with perpendicular axes, e.g. cross-slides
- B23Q1/621—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism with perpendicular axes, e.g. cross-slides a single sliding pair followed perpendicularly by a single sliding pair
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2414—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for indicating desired positions guiding the positioning of tools or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q39/00—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation
- B23Q39/02—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being capable of being brought to act at a single operating station
- B23Q39/021—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being capable of being brought to act at a single operating station with a plurality of toolheads per workholder, whereby the toolhead is a main spindle, a multispindle, a revolver or the like
- B23Q39/022—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being capable of being brought to act at a single operating station with a plurality of toolheads per workholder, whereby the toolhead is a main spindle, a multispindle, a revolver or the like with same working direction of toolheads on same workholder
- B23Q39/023—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being capable of being brought to act at a single operating station with a plurality of toolheads per workholder, whereby the toolhead is a main spindle, a multispindle, a revolver or the like with same working direction of toolheads on same workholder simultaneous working of toolheads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Forests & Forestry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Optics & Photonics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Description
なお、第1切削手段30aをZ方向に対して直交するY方向に移動させる第1Y移動手段50aと、第2切削手段30bをY方向に移動させる第2Y移動手段50bとは、架設部13の他方(-X側)の側面に配設してもよい。その場合は、第1Z移動手段60a及び第2Z移動手段60b、並びに、第1切削手段30a及び第2切削手段30bも、架設部13の-X側に配設される。また、第1切削手段30a、第2切削手段30bの配設位置に対応して、各センサユニット144a、144bは、ブラケット14によって柱部12a、12bにそれぞれ取り付けられる。
10:基台 11:門型コラム 12a、12b:柱部 13:架設部
14:ブラケット 141:基部 142:腕部
144a、144b:センサユニット
145a、145b:投光部 146a、146b:受光部
147a、147b:被進入部
20:保持テーブル 200:矩形保持面 200a:吸引孔
20a:長辺 20b:短辺
21:回転手段
30:切削手段 30a:第1切削手段 30b:第2切削手段
31:スピンドル 32:ハウジング 33:切削ブレード 34:撮像手段
40:X移動手段
41:ボールネジ 42:ガイドレール 43:モータ 44:テーブルベース
50a:第1Y移動手段 50b:第2Y移動手段
51:ボールネジ 52:ガイドレール 53:モータ 54:移動基台
60a:第1Z移動手段 60b:第2Z移動手段
61:ボールネジ 62:ガイドレール 63:モータ 64:移動基台
70:制御部
W:板状ワーク
Wa:表面 L:分割予定ライン D:デバイス Wb:裏面 T:テープ
Claims (1)
- 矩形の板状ワークを保持する矩形保持面を有する保持テーブルと、該保持テーブルの中心を軸として該保持テーブルを回転させる回転手段と、回転可能なスピンドルに切削ブレードが装着され該保持テーブルが保持した板状ワークを切削する切削手段と、検出光を投光する投光部と該検出光を受光する受光部とが対向して配置され該投光部と該受光部との間に進入した該切削ブレードの先端を検出するセンサユニットと、該保持面に対して垂直な方向であるZ方向に該切削手段を移動させるZ移動手段と、該Z方向に直交し該スピンドルの軸方向であるY方向に該切削手段を移動させるY移動手段と、該Z方向と該Y方向とに直交する切削ブレードの切削方向であるX方向に該保持テーブルを移動させるX移動手段と、を備えた切削装置であって、
該矩形保持面は、短辺と長辺とを備え、
該センサユニットは、その上端が、該保持テーブルの下端よりも該Z方向の位置が低く、かつ、該スピンドルの軸心延在方向の該Z方向下方に配設され、該回転手段が該保持テーブルを回転させて該矩形保持面の該短辺を該Y方向と平行にしたときに、該チャックテーブルの位置にかかわらず該切削ブレードが進入可能に該センサユニットの上方が開放され、該投光部と該受光部との間に該切削ブレードを進入させることを可能とする切削装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017213647A JP7028607B2 (ja) | 2017-11-06 | 2017-11-06 | 切削装置 |
TW107134917A TWI759553B (zh) | 2017-11-06 | 2018-10-03 | 切割裝置 |
MYPI2018703886A MY191253A (en) | 2017-11-06 | 2018-10-19 | Cutting apparatus |
US16/174,514 US10639811B2 (en) | 2017-11-06 | 2018-10-30 | Cutting apparatus |
CN201811284629.8A CN109746506B (zh) | 2017-11-06 | 2018-10-31 | 切削装置 |
KR1020180133540A KR102654619B1 (ko) | 2017-11-06 | 2018-11-02 | 절삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017213647A JP7028607B2 (ja) | 2017-11-06 | 2017-11-06 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019084612A JP2019084612A (ja) | 2019-06-06 |
JP7028607B2 true JP7028607B2 (ja) | 2022-03-02 |
Family
ID=66328135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017213647A Active JP7028607B2 (ja) | 2017-11-06 | 2017-11-06 | 切削装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10639811B2 (ja) |
JP (1) | JP7028607B2 (ja) |
KR (1) | KR102654619B1 (ja) |
CN (1) | CN109746506B (ja) |
MY (1) | MY191253A (ja) |
TW (1) | TWI759553B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7028607B2 (ja) * | 2017-11-06 | 2022-03-02 | 株式会社ディスコ | 切削装置 |
CN110434742A (zh) * | 2019-07-24 | 2019-11-12 | 安徽海通塑胶科技有限公司 | Mpp电力管的切割装置 |
CN110722374B (zh) * | 2019-10-23 | 2021-10-01 | 温州职业技术学院 | 基于机器视觉的智慧零件加工操作台 |
JP7222941B2 (ja) * | 2020-02-10 | 2023-02-15 | Towa株式会社 | 加工装置 |
NL2024961B1 (en) * | 2020-02-21 | 2021-10-13 | Besi Netherlands Bv | Sawing device and method for forming saw-cuts into a semiconductor product |
CN112996255B (zh) * | 2021-04-21 | 2021-08-03 | 四川超声印制板有限公司 | 印制电路板边沿铜箔切除装置 |
JP2022184119A (ja) * | 2021-05-31 | 2022-12-13 | 株式会社ディスコ | シート貼着装置 |
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2017
- 2017-11-06 JP JP2017213647A patent/JP7028607B2/ja active Active
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2018
- 2018-10-03 TW TW107134917A patent/TWI759553B/zh active
- 2018-10-19 MY MYPI2018703886A patent/MY191253A/en unknown
- 2018-10-30 US US16/174,514 patent/US10639811B2/en active Active
- 2018-10-31 CN CN201811284629.8A patent/CN109746506B/zh active Active
- 2018-11-02 KR KR1020180133540A patent/KR102654619B1/ko active IP Right Grant
Patent Citations (3)
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JP2007081101A (ja) | 2005-09-14 | 2007-03-29 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012169557A (ja) | 2011-02-16 | 2012-09-06 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2015208783A (ja) | 2014-04-23 | 2015-11-24 | 株式会社ディスコ | 切削装置 |
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KR102654619B1 (ko) | 2024-04-03 |
US10639811B2 (en) | 2020-05-05 |
JP2019084612A (ja) | 2019-06-06 |
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MY191253A (en) | 2022-06-10 |
US20190134837A1 (en) | 2019-05-09 |
CN109746506A (zh) | 2019-05-14 |
KR20190051836A (ko) | 2019-05-15 |
TW201922411A (zh) | 2019-06-16 |
TWI759553B (zh) | 2022-04-01 |
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