JP2005194585A5 - - Google Patents
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- Publication number
- JP2005194585A5 JP2005194585A5 JP2004002862A JP2004002862A JP2005194585A5 JP 2005194585 A5 JP2005194585 A5 JP 2005194585A5 JP 2004002862 A JP2004002862 A JP 2004002862A JP 2004002862 A JP2004002862 A JP 2004002862A JP 2005194585 A5 JP2005194585 A5 JP 2005194585A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- catalyst
- acidic solution
- solution
- catalyst solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 71
- 239000003054 catalyst Substances 0.000 claims description 55
- 239000000243 solution Substances 0.000 claims description 48
- 239000003929 acidic solution Substances 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 19
- 239000007921 spray Substances 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 238000010306 acid treatment Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 230000003197 catalytic effect Effects 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 description 7
- 150000007522 mineralic acids Chemical class 0.000 description 6
- 239000010953 base metal Substances 0.000 description 3
- 229910017053 inorganic salt Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- -1 organic acid salt Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004002862A JP2005194585A (ja) | 2004-01-08 | 2004-01-08 | 基板の湿式処理方法及び基板処理装置 |
| US11/029,675 US20050208774A1 (en) | 2004-01-08 | 2005-01-06 | Wet processing method and processing apparatus of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004002862A JP2005194585A (ja) | 2004-01-08 | 2004-01-08 | 基板の湿式処理方法及び基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005194585A JP2005194585A (ja) | 2005-07-21 |
| JP2005194585A5 true JP2005194585A5 (enExample) | 2007-02-15 |
Family
ID=34817929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004002862A Pending JP2005194585A (ja) | 2004-01-08 | 2004-01-08 | 基板の湿式処理方法及び基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005194585A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250915A (ja) * | 2006-03-16 | 2007-09-27 | Ebara Corp | 基板処理方法および基板処理装置 |
| JP5448521B2 (ja) * | 2009-03-27 | 2014-03-19 | 大日本スクリーン製造株式会社 | 処理液供給装置および処理液供給方法 |
| DE102010063178B4 (de) * | 2010-12-15 | 2014-05-22 | Siltronic Ag | Verfahren zur Reinigung einer Halbleiterscheibe aus Silizium unmittelbar nach einer Politur der Halbleiterscheibe |
| KR102146872B1 (ko) | 2013-07-03 | 2020-08-21 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 세정 장치 및 기판 세정 방법 |
| JP6431159B2 (ja) * | 2017-10-20 | 2018-11-28 | 株式会社荏原製作所 | 基板洗浄装置 |
| JP3220470U (ja) * | 2018-12-26 | 2019-03-07 | 株式会社Ｊｃｕ | 樹脂フィルムの湿式処理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05148658A (ja) * | 1991-11-22 | 1993-06-15 | Sumitomo Metal Mining Co Ltd | 無電解錫めつき方法 |
| JPH0770767A (ja) * | 1993-09-01 | 1995-03-14 | Mitsubishi Gas Chem Co Inc | 銅張積層板用表面処理液および表面処理法 |
| JPH11335858A (ja) * | 1998-05-27 | 1999-12-07 | Yuji Shikamata | 銀鏡面の形成方法及びその溶液 |
| JP2000104182A (ja) * | 1998-09-30 | 2000-04-11 | Seiko Epson Corp | ウェットエッチング方法および装置、インクジェットヘッドの振動板の製造方法、インクジェットヘッド、並びにインクジェット記録装置 |
| JP3874261B2 (ja) * | 2002-04-10 | 2007-01-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2004
- 2004-01-08 JP JP2004002862A patent/JP2005194585A/ja active Pending
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