JP2005194528A5 - - Google Patents

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Publication number
JP2005194528A5
JP2005194528A5 JP2004372027A JP2004372027A JP2005194528A5 JP 2005194528 A5 JP2005194528 A5 JP 2005194528A5 JP 2004372027 A JP2004372027 A JP 2004372027A JP 2004372027 A JP2004372027 A JP 2004372027A JP 2005194528 A5 JP2005194528 A5 JP 2005194528A5
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JP
Japan
Prior art keywords
acid
substrate
polyaniline
bis
values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004372027A
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English (en)
Japanese (ja)
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JP2005194528A (ja
JP4920886B2 (ja
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Publication date
Priority claimed from US10/748,940 external-priority patent/US7316791B2/en
Application filed filed Critical
Publication of JP2005194528A publication Critical patent/JP2005194528A/ja
Publication of JP2005194528A5 publication Critical patent/JP2005194528A5/ja
Application granted granted Critical
Publication of JP4920886B2 publication Critical patent/JP4920886B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004372027A 2003-12-30 2004-12-22 ドープされたポリアニリンを含むポリイミドベース組成物およびそれに関する方法と組成物 Expired - Fee Related JP4920886B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/748,940 US7316791B2 (en) 2003-12-30 2003-12-30 Polyimide based substrate comprising doped polyaniline
US10/748,940 2003-12-30

Publications (3)

Publication Number Publication Date
JP2005194528A JP2005194528A (ja) 2005-07-21
JP2005194528A5 true JP2005194528A5 (enExample) 2008-02-07
JP4920886B2 JP4920886B2 (ja) 2012-04-18

Family

ID=34592541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004372027A Expired - Fee Related JP4920886B2 (ja) 2003-12-30 2004-12-22 ドープされたポリアニリンを含むポリイミドベース組成物およびそれに関する方法と組成物

Country Status (3)

Country Link
US (2) US7316791B2 (enExample)
EP (1) EP1553142A3 (enExample)
JP (1) JP4920886B2 (enExample)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1954031B (zh) * 2004-03-25 2010-06-09 日产化学工业株式会社 电荷输送性清漆及使用它的有机电致发光元件
US7130569B2 (en) * 2004-07-02 2006-10-31 Xerox Corporation Polyaniline filled polyimide weldable intermediate transfer components
JP2007058154A (ja) * 2005-07-26 2007-03-08 Fuji Xerox Co Ltd 中間転写ベルト、その製造方法、及び画像形成装置
JP5044907B2 (ja) * 2005-08-26 2012-10-10 富士ゼロックス株式会社 ポリアミック酸組成物、その製造方法、ポリイミド無端ベルト、その製造方法、及び画像形成装置
WO2007043603A1 (en) * 2005-10-06 2007-04-19 Seiko Epson Corporation Composition for conductive materials
US7651744B2 (en) * 2005-10-19 2010-01-26 Industrial Technology Research Institute Liquid crystal display
GB0522122D0 (en) * 2005-10-29 2005-12-07 Eastman Kodak Co Conductive composite material
US7662449B2 (en) * 2005-11-22 2010-02-16 Industrial Technology Research Institute Liquid crystal display
TWI397136B (zh) 2006-01-12 2013-05-21 Nippon Steel & Sumikin Chem Co Ｃｏｆ用積層板及ｃｏｆ薄膜載帶以及電子裝置
JP5000310B2 (ja) * 2006-01-12 2012-08-15 新日鐵化学株式会社 Ｃｏｆ用積層板及びｃｏｆフィルムキャリアテープ並びに電子装置
JP2007332184A (ja) * 2006-06-12 2007-12-27 Yokohama Rubber Co Ltd:The 導電性ポリマー分散液の製造方法および導電性ポリマー分散液
EP2031012A4 (en) * 2006-06-12 2010-09-15 Yokohama Rubber Co Ltd PROCESS FOR PREPARING A DISPERSION OF CONDUCTIVE POLYMER AND DISPERSION OF CONDUCTIVE POLYMER
CN101506275B (zh) * 2006-08-10 2012-09-12 日产化学工业株式会社 固有导电性聚合物的有机溶剂分散液的制造方法
JP5012251B2 (ja) * 2006-10-03 2012-08-29 富士ゼロックス株式会社 ポリアミック酸の組成物及びその製造方法、並びにポリイミド樹脂、半導電性部材及び画像形成装置
JP2008122446A (ja) 2006-11-08 2008-05-29 Fuji Xerox Co Ltd 画像形成装置
US7524015B2 (en) * 2006-12-20 2009-04-28 Palo Alto Research Center Incorporated Method of printing smooth micro-scale features
EP1975741B1 (en) 2007-03-27 2016-01-06 Nitto Denko Corporation Semi-conductive polyimide film
US8729217B2 (en) 2007-03-27 2014-05-20 Nitto Denko Corporation Semi-conductive polyimide film
KR101479360B1 (ko) * 2007-04-11 2015-01-05 스미토모 베이클리트 컴퍼니 리미티드 전자 부품 포장체
US20100181094A1 (en) * 2007-04-13 2010-07-22 Magnekon, S.A. De C. V. Magnetic wire with corona-resistant coating
US8349421B2 (en) 2008-05-15 2013-01-08 Xerox Corporation Precision resistive elements and related manufacturing process
US20100190956A1 (en) * 2009-01-27 2010-07-29 Xerox Corporation Polyaniline viologen charge transfer complexes containing intermediate transfer members
US8084111B2 (en) * 2009-03-30 2011-12-27 Xerox Corporation Polyaniline dialkylsulfate complexes containing intermediate transfer members
US8629053B2 (en) * 2010-06-18 2014-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Plasma treatment for semiconductor devices
US8414815B2 (en) 2010-08-25 2013-04-09 Xerox Corporation Seamless fuser member process
JP2012145676A (ja) * 2011-01-11 2012-08-02 Konica Minolta Business Technologies Inc 光沢面形成装置、光沢面形成方法、及び、光沢面形成用のベルト部材
KR20140036141A (ko) 2011-02-03 2014-03-25 닛토덴코 가부시키가이샤 도전성 수지 조성물을 이용한 수지 필름의 제조 방법
JP2013124313A (ja) * 2011-12-15 2013-06-24 Nitto Denko Corp 導電性樹脂組成物およびその製造方法、ならびに該導電性樹脂組成物を用いた樹脂フィルムの製造方法
EP2604331B1 (en) * 2011-12-15 2017-01-25 Gambro Lundia AB Doped membranes
KR101436089B1 (ko) 2012-02-01 2014-08-29 아주대학교산학협력단 전도성 고분자 블랜드 조성물 및 이의 제조 방법
WO2013192467A1 (en) * 2012-06-22 2013-12-27 E. I. Du Pont De Nemours And Company Circuit board
US9257647B2 (en) * 2013-03-14 2016-02-09 Northrop Grumman Systems Corporation Phase change material switch and method of making the same
US9214594B2 (en) 2013-08-07 2015-12-15 Solaero Technologies Corp. Fabrication of solar cells with electrically conductive polyimide adhesive
US9768326B1 (en) 2013-08-07 2017-09-19 Solaero Technologies Corp. Fabrication of solar cells with electrically conductive polyimide adhesive
EP3091969B1 (en) 2013-12-31 2024-01-24 Johnson & Johnson Consumer Inc. Process for forming a shaped film product
WO2015103034A1 (en) * 2013-12-31 2015-07-09 Johnson & Johnson Consumer Companies, Inc. Single-pass process for forming a multilayered shaped film product
WO2015103030A1 (en) 2013-12-31 2015-07-09 Johnson & Johnson Consumer Companies, Inc. Process for forming a multi layered shaped film
KR101581105B1 (ko) * 2014-01-23 2015-12-29 울산대학교 산학협력단 폴리아닐린 나노페이스트 및 이의 제조방법
US20150228374A1 (en) * 2014-02-07 2015-08-13 E I Du Pont De Nemours And Company Thermally conductive electronic substrates and methods relating thereto
WO2016100629A1 (en) * 2014-12-17 2016-06-23 E. I. Du Pont De Nemours And Company High temperature conductive thick film pastes polyimide for heater
CN105367810B (zh) * 2015-10-09 2018-07-24 中国科学院深圳先进技术研究院 一种六氟丙烷基pmo薄膜的制备方法及应用
US9929300B2 (en) 2015-11-13 2018-03-27 Solaero Technologies Corp. Multijunction solar cells with electrically conductive polyimide adhesive
US10700270B2 (en) 2016-06-21 2020-06-30 Northrop Grumman Systems Corporation PCM switch and method of making the same
CN106496614B (zh) * 2016-11-07 2020-06-19 株洲时代华昇新材料技术有限公司 一种抗静电聚酰亚胺薄膜及其制备方法
CN109096756B (zh) * 2018-07-01 2020-11-24 常州大学 聚苯胺-聚酰胺酰亚胺单面导电纳米复合薄膜的制备方法和应用
US11546010B2 (en) 2021-02-16 2023-01-03 Northrop Grumman Systems Corporation Hybrid high-speed and high-performance switch system
WO2025177142A1 (en) * 2024-02-19 2025-08-28 Tata Steel Limited Spot-weldable polyimide-polyaniline emeraldine salt (pi-pani-es) coating with high corrosion resistance

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3347704C1 (de) 1983-12-31 1985-04-18 Zipperling Kessler & Co (Gmbh & Co), 2070 Ahrensburg Antistatika enthaltendes Konzentrat auf Basis von Polymeren,Verfahren zu dessen Herstellung sowie dessen Verwendung
DE3421993C1 (de) 1984-06-14 1985-12-12 Zipperling Kessler & Co (Gmbh & Co), 2070 Ahrensburg Verfahren zur Herstellung von Formteilen aus elektrisch leitfaehigen organischen Polymeren und/oder organischen Leitern,Vorrichtung zur Durchfuehrung des Verfahrens sowie Verwendung der Formteile
DE3422316C2 (de) 1984-06-15 1986-11-20 Zipperling Kessler & Co (Gmbh & Co), 2070 Ahrensburg Verfahren zur Herstellung von verformbaren Polymerblends aus elektrisch leitfähigen organischen Polymeren und/oder organischen Leitern, Vorrichtung zur Durchführung des Verfahrens sowie Verwendung der Polymerblends
DE3440617C1 (de) 1984-11-07 1986-06-26 Zipperling Kessler & Co (Gmbh & Co), 2070 Ahrensburg Antistatische bzw. elektrisch halbleitende thermoplastische Polymerblends,Verfahren zu deren Herstellung und deren Verwendung
JPS6470537A (en) * 1987-05-22 1989-03-16 Mitsui Mining & Smelting Co Highly electrically conductive high polymer film and production thereof
US5069820A (en) 1987-08-07 1991-12-03 Allied-Signal Inc. Thermally stable forms of electrically conductive polyaniline
DE3729566A1 (de) 1987-09-04 1989-03-16 Zipperling Kessler & Co Intrinsisch leitfaehiges polymer in form eines dispergierbaren feststoffes, dessen herstellung und dessen verwendung
US4855361A (en) * 1988-02-22 1989-08-08 Lockheed Corporation Conductive polymer-polyimide blends and method for producing same
US5137991A (en) * 1988-05-13 1992-08-11 The Ohio State University Research Foundation Polyaniline compositions, processes for their preparation and uses thereof
US5476612A (en) 1989-12-30 1995-12-19 Zipperling Kessler & Co., (Gmbh & Co.). Process for making antistatic or electrically conductive polymer compositions
FR2672126B1 (fr) 1990-11-16 1994-04-08 Alcyon Analyser Sa Segment reactionnel pour analyseur automatique d'echantillons et analyseur equipe d'un segment.
US5160456A (en) 1991-06-07 1992-11-03 Exxon Research And Engineering Company Catalyst/heat-transfer medium for syngas generation
DE4317010A1 (de) 1993-05-17 1994-11-24 Zipperling Kessler & Co Dispergierbares intrinsisch leitfähiges Polymer und Verfahren zu dessen Herstellung
JP3222990B2 (ja) * 1993-06-21 2001-10-29 隆一 山本 可溶性高分子化合物共存下の重合法
JP2536817B2 (ja) 1993-06-25 1996-09-25 ツイッパーリング ケスラー ウント コー（ゲーエムベーハー ウント コー） 腐食保護された金属材料の製造方法及びこの方法によって得られる材料
JP3409226B2 (ja) 1995-03-27 2003-05-26 日東電工株式会社 半導電性樹脂シート及びその製造方法
JP3467345B2 (ja) * 1995-03-27 2003-11-17 日東電工株式会社 半導電性樹脂シート及びその製造方法
ATE213026T1 (de) 1995-11-29 2002-02-15 Zipperling Kessler & Co Verfahren zur herstellung von metallisierten werkstoffen
US6310133B1 (en) * 1997-08-25 2001-10-30 Dai Nippon Printing Co., Ltd. Antistatic coat, thermal transfer sheet having antistatic property and antistatic agent
ATE283536T1 (de) 1997-07-25 2004-12-15 Ormecon Gmbh Chemische verbindungen von intrinsisch leitfähigen polymeren mit metallen
US6497969B2 (en) * 1997-09-05 2002-12-24 Nessdisplay Co., Ltd. Electroluminescent device having an organic layer including polyimide
JP4172147B2 (ja) * 2000-12-07 2008-10-29 富士ゼロックス株式会社 中間体転写体及びそれを備えた画像形成装置
US7130569B2 (en) * 2004-07-02 2006-10-31 Xerox Corporation Polyaniline filled polyimide weldable intermediate transfer components
JP2007058154A (ja) * 2005-07-26 2007-03-08 Fuji Xerox Co Ltd 中間転写ベルト、その製造方法、及び画像形成装置

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