JP2005166855A - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP2005166855A
JP2005166855A JP2003402369A JP2003402369A JP2005166855A JP 2005166855 A JP2005166855 A JP 2005166855A JP 2003402369 A JP2003402369 A JP 2003402369A JP 2003402369 A JP2003402369 A JP 2003402369A JP 2005166855 A JP2005166855 A JP 2005166855A
Authority
JP
Japan
Prior art keywords
liquid
liquid cooling
laminated
cooling system
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003402369A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005166855A5 (enExample
Inventor
Hitoshi Matsushima
松島　　均
Shinji Matsushita
伸二 松下
Ichiro Asano
一郎 浅野
Nobufusa Takeuchi
庸記 竹内
Atsushi Suzuki
敦 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2003402369A priority Critical patent/JP2005166855A/ja
Priority to TW093104461A priority patent/TWI255025B/zh
Priority to KR1020040014159A priority patent/KR100612810B1/ko
Priority to EP04005163A priority patent/EP1538884B1/en
Priority to DE602004027341T priority patent/DE602004027341D1/de
Priority to US10/792,690 priority patent/US7044198B2/en
Priority to CNB2004100077654A priority patent/CN100386872C/zh
Publication of JP2005166855A publication Critical patent/JP2005166855A/ja
Publication of JP2005166855A5 publication Critical patent/JP2005166855A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/0225—Retaining or protecting walls comprising retention means in the backfill
    • E02D29/0241—Retaining or protecting walls comprising retention means in the backfill the retention means being reinforced earth elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/025—Retaining or protecting walls made up of similar modular elements stacked without mortar
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/0258—Retaining or protecting walls characterised by constructional features
    • E02D29/0266—Retaining or protecting walls characterised by constructional features made up of preformed elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/20—Miscellaneous comprising details of connection between elements
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/40—Miscellaneous comprising stabilising elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Paleontology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003402369A 2003-12-02 2003-12-02 電子機器 Withdrawn JP2005166855A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003402369A JP2005166855A (ja) 2003-12-02 2003-12-02 電子機器
TW093104461A TWI255025B (en) 2003-12-02 2004-02-23 Liquid cooling system
KR1020040014159A KR100612810B1 (ko) 2003-12-02 2004-03-03 전자 기기
EP04005163A EP1538884B1 (en) 2003-12-02 2004-03-04 Liquid cooling system for use in an electronic apparatus
DE602004027341T DE602004027341D1 (de) 2003-12-02 2004-03-04 Flüssigkühlsystem für ein elektronisches Gerät
US10/792,690 US7044198B2 (en) 2003-12-02 2004-03-05 Electronic apparatus
CNB2004100077654A CN100386872C (zh) 2003-12-02 2004-03-05 液冷系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003402369A JP2005166855A (ja) 2003-12-02 2003-12-02 電子機器

Publications (2)

Publication Number Publication Date
JP2005166855A true JP2005166855A (ja) 2005-06-23
JP2005166855A5 JP2005166855A5 (enExample) 2006-07-20

Family

ID=34463949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003402369A Withdrawn JP2005166855A (ja) 2003-12-02 2003-12-02 電子機器

Country Status (7)

Country Link
US (1) US7044198B2 (enExample)
EP (1) EP1538884B1 (enExample)
JP (1) JP2005166855A (enExample)
KR (1) KR100612810B1 (enExample)
CN (1) CN100386872C (enExample)
DE (1) DE602004027341D1 (enExample)
TW (1) TWI255025B (enExample)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007095732A (ja) * 2005-09-27 2007-04-12 Seiko Epson Corp マイクロチャンネル構造体、熱交換システム及び電子機器
JP2007227476A (ja) * 2006-02-21 2007-09-06 Seiko Epson Corp 流体冷却装置、および電子機器
JP2008103400A (ja) * 2006-10-17 2008-05-01 T Rad Co Ltd 水冷ヒートシンクおよびその製造方法
KR100892626B1 (ko) * 2006-07-25 2009-04-09 후지쯔 가부시끼가이샤 액체 냉각 유닛 및 전자 기기
US7652884B2 (en) 2006-07-25 2010-01-26 Fujitsu Limited Electronic apparatus including liquid cooling unit
US7672125B2 (en) 2006-07-25 2010-03-02 Fujitsu Limited Electronic apparatus
US7701715B2 (en) 2006-07-25 2010-04-20 Fujitsu Limited Electronic apparatus
JP2011017516A (ja) * 2009-07-10 2011-01-27 Mitsubishi Electric Corp プレート積層型冷却装置及びその製造方法
JP2011114276A (ja) * 2009-11-30 2011-06-09 T Rad Co Ltd ヒートシンク
US7980296B2 (en) 2005-12-16 2011-07-19 Seiko Epson Corporation Heat exchanger, light source device, projector and electronic apparatus
WO2011136362A1 (ja) * 2010-04-28 2011-11-03 株式会社 豊田自動織機 放熱装置および半導体装置
US8096348B2 (en) 2005-10-05 2012-01-17 Seiko Epson Corporation Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment
JP2012165006A (ja) * 2010-06-09 2012-08-30 Kyocera Corp 流路部材およびこれを用いた熱交換器ならびに電子部品装置
JP2013048204A (ja) * 2011-07-28 2013-03-07 Kyocera Corp 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置
WO2017098640A1 (ja) * 2015-12-10 2017-06-15 株式会社日立製作所 造形物および電子機器ならびに造形方法

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WO2006010822A2 (fr) * 2004-06-24 2006-02-02 TECHNOLOGIES DE L'ECHANGE THERMIQUE Société Anonyme Simplifiée Dispositifs de refroidissement perfectionnes pour applications diverses
FR2880107B1 (fr) * 2004-12-27 2007-05-11 Technologies De L Echange Ther Perfectionnements aux refroidisseurs a eau pour microprocesseurs
US7327571B2 (en) * 2005-09-06 2008-02-05 Hewlett-Packard Development Company, L.P. Thermal load balancing systems and methods
US7537047B2 (en) 2006-03-23 2009-05-26 Foxconn Technology Co., Ltd. Liquid-cooling heat sink
CN100584169C (zh) * 2006-04-21 2010-01-20 富准精密工业(深圳)有限公司 液冷散热装置
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5148079B2 (ja) * 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5283836B2 (ja) 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
CN101610664B (zh) * 2008-06-20 2014-05-14 萨帕铝型材（上海）有限公司 液体冷却器及其制造方法
CN102647884B (zh) * 2011-02-17 2015-03-18 北汽福田汽车股份有限公司 散热器及其散热水道系统结构
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US20130058043A1 (en) * 2011-09-03 2013-03-07 Weiss-Aug Co. Inc Heat sink with a stack of metal layers having channels therein
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
JP5901343B2 (ja) * 2012-02-24 2016-04-06 三菱電機株式会社 冷却器及び冷却装置
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
KR101524939B1 (ko) * 2013-11-06 2015-06-02 주식회사 동양매직 발열체 냉각을 위한 수냉식 워터재킷 및 이를 포함하는 냉각탱크
US10251306B2 (en) * 2016-09-26 2019-04-02 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure
CN106711110B (zh) * 2017-03-19 2019-05-17 北京工业大学 一种用于大功率串联igbt的风冷水冷混合散热模组
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
WO2021229365A1 (en) 2020-05-11 2021-11-18 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
KR102449766B1 (ko) * 2022-03-18 2022-10-04 덕양산업 주식회사 배터리모듈용 냉각플레이트

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007095732A (ja) * 2005-09-27 2007-04-12 Seiko Epson Corp マイクロチャンネル構造体、熱交換システム及び電子機器
US8096348B2 (en) 2005-10-05 2012-01-17 Seiko Epson Corporation Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment
US7980296B2 (en) 2005-12-16 2011-07-19 Seiko Epson Corporation Heat exchanger, light source device, projector and electronic apparatus
JP2007227476A (ja) * 2006-02-21 2007-09-06 Seiko Epson Corp 流体冷却装置、および電子機器
KR100892626B1 (ko) * 2006-07-25 2009-04-09 후지쯔 가부시끼가이샤 액체 냉각 유닛 및 전자 기기
US7652884B2 (en) 2006-07-25 2010-01-26 Fujitsu Limited Electronic apparatus including liquid cooling unit
US7672125B2 (en) 2006-07-25 2010-03-02 Fujitsu Limited Electronic apparatus
US7701715B2 (en) 2006-07-25 2010-04-20 Fujitsu Limited Electronic apparatus
JP2008103400A (ja) * 2006-10-17 2008-05-01 T Rad Co Ltd 水冷ヒートシンクおよびその製造方法
JP2011017516A (ja) * 2009-07-10 2011-01-27 Mitsubishi Electric Corp プレート積層型冷却装置及びその製造方法
JP2011114276A (ja) * 2009-11-30 2011-06-09 T Rad Co Ltd ヒートシンク
WO2011136362A1 (ja) * 2010-04-28 2011-11-03 株式会社 豊田自動織機 放熱装置および半導体装置
JP5916603B2 (ja) * 2010-04-28 2016-05-11 株式会社豊田自動織機 放熱装置および半導体装置
US9379038B2 (en) 2010-04-28 2016-06-28 Kabushiki Kaisha Toyota Jidoshokki Heat dissipation device and semiconductor device
JP2012165006A (ja) * 2010-06-09 2012-08-30 Kyocera Corp 流路部材およびこれを用いた熱交換器ならびに電子部品装置
JP2013048204A (ja) * 2011-07-28 2013-03-07 Kyocera Corp 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置
JP2016171343A (ja) * 2011-07-28 2016-09-23 京セラ株式会社 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置
WO2017098640A1 (ja) * 2015-12-10 2017-06-15 株式会社日立製作所 造形物および電子機器ならびに造形方法

Also Published As

Publication number Publication date
EP1538884A2 (en) 2005-06-08
KR20050053298A (ko) 2005-06-08
DE602004027341D1 (de) 2010-07-08
CN100386872C (zh) 2008-05-07
EP1538884A3 (en) 2005-10-12
TW200520187A (en) 2005-06-16
KR100612810B1 (ko) 2006-08-18
TWI255025B (en) 2006-05-11
EP1538884B1 (en) 2010-05-26
US7044198B2 (en) 2006-05-16
US20050126752A1 (en) 2005-06-16
CN1624407A (zh) 2005-06-08

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