JP2005166855A5 - - Google Patents

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Publication number
JP2005166855A5
JP2005166855A5 JP2003402369A JP2003402369A JP2005166855A5 JP 2005166855 A5 JP2005166855 A5 JP 2005166855A5 JP 2003402369 A JP2003402369 A JP 2003402369A JP 2003402369 A JP2003402369 A JP 2003402369A JP 2005166855 A5 JP2005166855 A5 JP 2005166855A5
Authority
JP
Japan
Prior art keywords
cooling system
liquid
liquid cooling
plate
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003402369A
Other languages
English (en)
Japanese (ja)
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JP2005166855A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003402369A priority Critical patent/JP2005166855A/ja
Priority claimed from JP2003402369A external-priority patent/JP2005166855A/ja
Priority to TW093104461A priority patent/TWI255025B/zh
Priority to KR1020040014159A priority patent/KR100612810B1/ko
Priority to EP04005163A priority patent/EP1538884B1/en
Priority to DE602004027341T priority patent/DE602004027341D1/de
Priority to US10/792,690 priority patent/US7044198B2/en
Priority to CNB2004100077654A priority patent/CN100386872C/zh
Publication of JP2005166855A publication Critical patent/JP2005166855A/ja
Publication of JP2005166855A5 publication Critical patent/JP2005166855A5/ja
Withdrawn legal-status Critical Current

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JP2003402369A 2003-12-02 2003-12-02 電子機器 Withdrawn JP2005166855A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003402369A JP2005166855A (ja) 2003-12-02 2003-12-02 電子機器
TW093104461A TWI255025B (en) 2003-12-02 2004-02-23 Liquid cooling system
KR1020040014159A KR100612810B1 (ko) 2003-12-02 2004-03-03 전자 기기
EP04005163A EP1538884B1 (en) 2003-12-02 2004-03-04 Liquid cooling system for use in an electronic apparatus
DE602004027341T DE602004027341D1 (de) 2003-12-02 2004-03-04 Flüssigkühlsystem für ein elektronisches Gerät
US10/792,690 US7044198B2 (en) 2003-12-02 2004-03-05 Electronic apparatus
CNB2004100077654A CN100386872C (zh) 2003-12-02 2004-03-05 液冷系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003402369A JP2005166855A (ja) 2003-12-02 2003-12-02 電子機器

Publications (2)

Publication Number Publication Date
JP2005166855A JP2005166855A (ja) 2005-06-23
JP2005166855A5 true JP2005166855A5 (enExample) 2006-07-20

Family

ID=34463949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003402369A Withdrawn JP2005166855A (ja) 2003-12-02 2003-12-02 電子機器

Country Status (7)

Country Link
US (1) US7044198B2 (enExample)
EP (1) EP1538884B1 (enExample)
JP (1) JP2005166855A (enExample)
KR (1) KR100612810B1 (enExample)
CN (1) CN100386872C (enExample)
DE (1) DE602004027341D1 (enExample)
TW (1) TWI255025B (enExample)

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JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5148079B2 (ja) * 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5283836B2 (ja) 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
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JP4842040B2 (ja) 2006-07-25 2011-12-21 富士通株式会社 電子機器
JP2008027370A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 電子機器
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US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
CN101610664B (zh) * 2008-06-20 2014-05-14 萨帕铝型材（上海）有限公司 液体冷却器及其制造方法
JP2011017516A (ja) * 2009-07-10 2011-01-27 Mitsubishi Electric Corp プレート積層型冷却装置及びその製造方法
JP5259559B2 (ja) * 2009-11-30 2013-08-07 株式会社ティラド ヒートシンク
JP5916603B2 (ja) * 2010-04-28 2016-05-11 株式会社豊田自動織機 放熱装置および半導体装置
EP2582213B1 (en) * 2010-06-09 2021-01-20 Kyocera Corporation Flow channel member, heat exchanger using same, and electronic component device
CN102647884B (zh) * 2011-02-17 2015-03-18 北汽福田汽车股份有限公司 散热器及其散热水道系统结构
JP6005930B2 (ja) * 2011-07-28 2016-10-12 京セラ株式会社 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US20130058043A1 (en) * 2011-09-03 2013-03-07 Weiss-Aug Co. Inc Heat sink with a stack of metal layers having channels therein
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
JP5901343B2 (ja) * 2012-02-24 2016-04-06 三菱電機株式会社 冷却器及び冷却装置
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
KR101524939B1 (ko) * 2013-11-06 2015-06-02 주식회사 동양매직 발열체 냉각을 위한 수냉식 워터재킷 및 이를 포함하는 냉각탱크
WO2017098640A1 (ja) * 2015-12-10 2017-06-15 株式会社日立製作所 造形物および電子機器ならびに造形方法
US10251306B2 (en) * 2016-09-26 2019-04-02 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure
CN106711110B (zh) * 2017-03-19 2019-05-17 北京工业大学 一种用于大功率串联igbt的风冷水冷混合散热模组
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