CN100386872C - 液冷系统 - Google Patents

液冷系统 Download PDF

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Publication number
CN100386872C
CN100386872C CNB2004100077654A CN200410007765A CN100386872C CN 100386872 C CN100386872 C CN 100386872C CN B2004100077654 A CNB2004100077654 A CN B2004100077654A CN 200410007765 A CN200410007765 A CN 200410007765A CN 100386872 C CN100386872 C CN 100386872C
Authority
CN
China
Prior art keywords
heat
liquid
laminated
receiving member
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100077654A
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English (en)
Chinese (zh)
Other versions
CN1624407A (zh
Inventor
松岛均
松下伸二
浅野一郎
竹内庸记
铃木敦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1624407A publication Critical patent/CN1624407A/zh
Application granted granted Critical
Publication of CN100386872C publication Critical patent/CN100386872C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/0225—Retaining or protecting walls comprising retention means in the backfill
    • E02D29/0241—Retaining or protecting walls comprising retention means in the backfill the retention means being reinforced earth elements
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/025—Retaining or protecting walls made up of similar modular elements stacked without mortar
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/0258—Retaining or protecting walls characterised by constructional features
    • E02D29/0266—Retaining or protecting walls characterised by constructional features made up of preformed elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/20—Miscellaneous comprising details of connection between elements
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/40—Miscellaneous comprising stabilising elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Paleontology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB2004100077654A 2003-12-02 2004-03-05 液冷系统 Expired - Fee Related CN100386872C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP402369/2003 2003-12-02
JP2003402369A JP2005166855A (ja) 2003-12-02 2003-12-02 電子機器

Publications (2)

Publication Number Publication Date
CN1624407A CN1624407A (zh) 2005-06-08
CN100386872C true CN100386872C (zh) 2008-05-07

Family

ID=34463949

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100077654A Expired - Fee Related CN100386872C (zh) 2003-12-02 2004-03-05 液冷系统

Country Status (7)

Country Link
US (1) US7044198B2 (enExample)
EP (1) EP1538884B1 (enExample)
JP (1) JP2005166855A (enExample)
KR (1) KR100612810B1 (enExample)
CN (1) CN100386872C (enExample)
DE (1) DE602004027341D1 (enExample)
TW (1) TWI255025B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106711110A (zh) * 2017-03-19 2017-05-24 北京工业大学 一种用于大功率串联igbt的风冷水冷混合散热模组

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WO2006010822A2 (fr) * 2004-06-24 2006-02-02 TECHNOLOGIES DE L'ECHANGE THERMIQUE Société Anonyme Simplifiée Dispositifs de refroidissement perfectionnes pour applications diverses
FR2880107B1 (fr) * 2004-12-27 2007-05-11 Technologies De L Echange Ther Perfectionnements aux refroidisseurs a eau pour microprocesseurs
US7327571B2 (en) * 2005-09-06 2008-02-05 Hewlett-Packard Development Company, L.P. Thermal load balancing systems and methods
JP4682775B2 (ja) * 2005-09-27 2011-05-11 セイコーエプソン株式会社 マイクロチャンネル構造体、熱交換システム及び電子機器
JP2007127398A (ja) 2005-10-05 2007-05-24 Seiko Epson Corp 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
JP4449894B2 (ja) 2005-12-16 2010-04-14 セイコーエプソン株式会社 熱交換器、光源装置、プロジェクタおよび電子機器
JP4645472B2 (ja) * 2006-02-21 2011-03-09 セイコーエプソン株式会社 流体冷却装置、および電子機器
US7537047B2 (en) 2006-03-23 2009-05-26 Foxconn Technology Co., Ltd. Liquid-cooling heat sink
CN100584169C (zh) * 2006-04-21 2010-01-20 富准精密工业(深圳)有限公司 液冷散热装置
JP2008027374A (ja) * 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5148079B2 (ja) * 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5283836B2 (ja) 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP4781929B2 (ja) 2006-07-25 2011-09-28 富士通株式会社 電子機器
JP4842040B2 (ja) 2006-07-25 2011-12-21 富士通株式会社 電子機器
JP2008027370A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 電子機器
JP5005314B2 (ja) * 2006-10-17 2012-08-22 株式会社ティラド 水冷ヒートシンクおよびその製造方法
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
CN101610664B (zh) * 2008-06-20 2014-05-14 萨帕铝型材（上海）有限公司 液体冷却器及其制造方法
JP2011017516A (ja) * 2009-07-10 2011-01-27 Mitsubishi Electric Corp プレート積層型冷却装置及びその製造方法
JP5259559B2 (ja) * 2009-11-30 2013-08-07 株式会社ティラド ヒートシンク
JP5916603B2 (ja) * 2010-04-28 2016-05-11 株式会社豊田自動織機 放熱装置および半導体装置
EP2582213B1 (en) * 2010-06-09 2021-01-20 Kyocera Corporation Flow channel member, heat exchanger using same, and electronic component device
CN102647884B (zh) * 2011-02-17 2015-03-18 北汽福田汽车股份有限公司 散热器及其散热水道系统结构
JP6005930B2 (ja) * 2011-07-28 2016-10-12 京セラ株式会社 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US20130058043A1 (en) * 2011-09-03 2013-03-07 Weiss-Aug Co. Inc Heat sink with a stack of metal layers having channels therein
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
JP5901343B2 (ja) * 2012-02-24 2016-04-06 三菱電機株式会社 冷却器及び冷却装置
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
KR101524939B1 (ko) * 2013-11-06 2015-06-02 주식회사 동양매직 발열체 냉각을 위한 수냉식 워터재킷 및 이를 포함하는 냉각탱크
WO2017098640A1 (ja) * 2015-12-10 2017-06-15 株式会社日立製作所 造形物および電子機器ならびに造形方法
US10251306B2 (en) * 2016-09-26 2019-04-02 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
WO2021229365A1 (en) 2020-05-11 2021-11-18 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
KR102449766B1 (ko) * 2022-03-18 2022-10-04 덕양산업 주식회사 배터리모듈용 냉각플레이트

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JPH09102568A (ja) * 1995-10-05 1997-04-15 Mitsubishi Electric Corp プレート型ヒートシンク
US20010004370A1 (en) * 1998-08-18 2001-06-21 Hamamatsu Photonics K.K. Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same
US20020135979A1 (en) * 2001-03-20 2002-09-26 Motorola, Inc Two-phase cooling module and method of making the same
CN1375868A (zh) * 2001-03-20 2002-10-23 摩托罗拉公司 压模成型的两相冷却组件及其制作方法
JP2003007944A (ja) * 2001-06-18 2003-01-10 Showa Denko Kk 発熱部品用冷却装置
CN2577220Y (zh) * 2002-09-27 2003-10-01 天津市吉鑫达金属制品有限公司 带装饰边的异管散热器

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Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH09102568A (ja) * 1995-10-05 1997-04-15 Mitsubishi Electric Corp プレート型ヒートシンク
US20010004370A1 (en) * 1998-08-18 2001-06-21 Hamamatsu Photonics K.K. Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same
US20020135979A1 (en) * 2001-03-20 2002-09-26 Motorola, Inc Two-phase cooling module and method of making the same
CN1375868A (zh) * 2001-03-20 2002-10-23 摩托罗拉公司 压模成型的两相冷却组件及其制作方法
JP2003007944A (ja) * 2001-06-18 2003-01-10 Showa Denko Kk 発熱部品用冷却装置
CN2577220Y (zh) * 2002-09-27 2003-10-01 天津市吉鑫达金属制品有限公司 带装饰边的异管散热器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106711110A (zh) * 2017-03-19 2017-05-24 北京工业大学 一种用于大功率串联igbt的风冷水冷混合散热模组
CN106711110B (zh) * 2017-03-19 2019-05-17 北京工业大学 一种用于大功率串联igbt的风冷水冷混合散热模组

Also Published As

Publication number Publication date
EP1538884A2 (en) 2005-06-08
KR20050053298A (ko) 2005-06-08
DE602004027341D1 (de) 2010-07-08
EP1538884A3 (en) 2005-10-12
TW200520187A (en) 2005-06-16
KR100612810B1 (ko) 2006-08-18
TWI255025B (en) 2006-05-11
EP1538884B1 (en) 2010-05-26
US7044198B2 (en) 2006-05-16
JP2005166855A (ja) 2005-06-23
US20050126752A1 (en) 2005-06-16
CN1624407A (zh) 2005-06-08

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Granted publication date: 20080507