FR2746177B1 - Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant - Google Patents

Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant

Info

Publication number
FR2746177B1
FR2746177B1 FR9702287A FR9702287A FR2746177B1 FR 2746177 B1 FR2746177 B1 FR 2746177B1 FR 9702287 A FR9702287 A FR 9702287A FR 9702287 A FR9702287 A FR 9702287A FR 2746177 B1 FR2746177 B1 FR 2746177B1
Authority
FR
France
Prior art keywords
condensing
cooling device
boiling refrigerant
refrigerant
boiling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9702287A
Other languages
English (en)
Other versions
FR2746177A1 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP05738096A external-priority patent/JP3608286B2/ja
Priority claimed from JP8057361A external-priority patent/JPH09246768A/ja
Application filed filed Critical
Publication of FR2746177A1 publication Critical patent/FR2746177A1/fr
Application granted granted Critical
Publication of FR2746177B1 publication Critical patent/FR2746177B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/126—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element consisting of zig-zag shaped fins
    • F28F1/128—Fins with openings, e.g. louvered fins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR9702287A 1996-03-14 1997-02-26 Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant Expired - Fee Related FR2746177B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05738096A JP3608286B2 (ja) 1996-03-14 1996-03-14 沸騰冷却装置
JP8057361A JPH09246768A (ja) 1996-03-14 1996-03-14 沸騰冷却装置

Publications (2)

Publication Number Publication Date
FR2746177A1 FR2746177A1 (fr) 1997-09-19
FR2746177B1 true FR2746177B1 (fr) 2000-04-07

Family

ID=26398397

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9702287A Expired - Fee Related FR2746177B1 (fr) 1996-03-14 1997-02-26 Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant

Country Status (3)

Country Link
US (1) US5832989A (fr)
DE (1) DE19708282B4 (fr)
FR (1) FR2746177B1 (fr)

Families Citing this family (21)

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US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
DE19709934B4 (de) * 1996-03-14 2008-04-17 Denso Corp., Kariya Kühlgerät zum Sieden und Kondensieren eines Kältemittels
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
JPH11204709A (ja) * 1998-01-19 1999-07-30 Denso Corp 沸騰冷却装置
US6223810B1 (en) * 1998-03-31 2001-05-01 International Business Machines Extended air cooling with heat loop for dense or compact configurations of electronic components
US6279649B1 (en) 1998-04-27 2001-08-28 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6657121B2 (en) 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6536510B2 (en) 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US6856037B2 (en) * 2001-11-26 2005-02-15 Sony Corporation Method and apparatus for converting dissipated heat to work energy
TW531634B (en) * 2002-03-08 2003-05-11 Ching-Feng Wang Counter flow type heat exchanger with integrally formed fin and tube
KR100537666B1 (ko) * 2003-06-27 2005-12-20 현대자동차주식회사 자동차의 오일쿨러
JP2005166855A (ja) * 2003-12-02 2005-06-23 Hitachi Ltd 電子機器
FR2872266A1 (fr) * 2004-06-24 2005-12-30 Technologies De L Echange Ther Refroidisseurs a eau perfectionnes procedes pour leur mise en oeuvre
FR2872265A1 (fr) * 2004-06-24 2005-12-30 Technologies De L Echange Ther Procede et dispositif de refroidissement notamment pour microprocesseurs
US20070184320A1 (en) * 2004-06-24 2007-08-09 Jean-Paul Domen Cooling devices for various applications
WO2011067929A1 (fr) * 2009-12-03 2011-06-09 パナソニック株式会社 Unité de rayonnement de dispositif électronique et dispositif électronique l'utilisant
US20120255716A1 (en) * 2011-04-07 2012-10-11 Wu Wen-Yuan Heat dissipation device and manufacturing method thereof
US10209003B2 (en) 2012-02-21 2019-02-19 Thermal Corp. Electronics cabinet and rack cooling system and method
EP3040766B1 (fr) * 2015-01-05 2018-01-31 Samsung Electronics Co., Ltd. Dispositif d'affichage
EP3489604B1 (fr) * 2017-11-24 2020-12-23 TitanX Holding AB Condenseur de véhicule

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US3476175A (en) * 1967-11-02 1969-11-04 Bell Telephone Labor Inc Vapor-phase cooling of electronic components
JPS4847264U (fr) * 1971-10-04 1973-06-21
JPS5241149B2 (fr) * 1974-03-16 1977-10-17
JPS5241193B2 (fr) * 1974-03-16 1977-10-17
DE2417031A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule
JPS5249418A (en) * 1975-10-17 1977-04-20 Kozo Shiaku Conservator panel peplacing conservator of oil-immersed transformer
JPS53109249A (en) * 1977-03-04 1978-09-22 Hitachi Ltd Thermosyphon tube assembly
JPS55118561A (en) * 1979-03-05 1980-09-11 Hitachi Ltd Constant pressure type boiling cooler
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JPS58131755A (ja) * 1982-01-29 1983-08-05 Toshiba Corp 半導体素子の冷却装置
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FR2592988B1 (fr) * 1986-01-16 1988-03-18 Jeumont Schneider Dispositifs de refroidissement de semi-conducteurs
JPS62162847U (fr) * 1986-04-03 1987-10-16
JP2646580B2 (ja) * 1986-12-11 1997-08-27 株式会社デンソー 冷媒蒸発器
GB8704411D0 (en) * 1987-02-25 1987-04-01 Gen Electric Co Plc Cabinet
JPH0724293B2 (ja) * 1987-09-30 1995-03-15 株式会社日立製作所 沸騰冷却装置
JPH01263491A (ja) * 1988-04-14 1989-10-19 Asahi Glass Co Ltd ヒートパイプを用いた熱交換体
JP2636337B2 (ja) * 1988-06-02 1997-07-30 株式会社デンソー 冷媒蒸発器
JPH023320A (ja) * 1988-06-17 1990-01-08 Canon Inc インクジェット記録装置
JPH0293270A (ja) * 1988-09-29 1990-04-04 Nec Corp ヒートパイプによる冷却機構
US4944344A (en) * 1988-10-31 1990-07-31 Sundstrand Corporation Hermetically sealed modular electronic cold plate utilizing reflux cooling
JPH02233993A (ja) * 1989-03-07 1990-09-17 Furukawa Electric Co Ltd:The 密閉筐体の冷却器
JPH02251187A (ja) * 1989-03-24 1990-10-08 Okuma Mach Works Ltd Ｃｏ↓２ガスレーザ発振器
EP0409179B1 (fr) * 1989-07-19 1995-01-18 Showa Aluminum Corporation Tube caloporteur
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
JP3042541B2 (ja) * 1990-11-05 2000-05-15 古河電気工業株式会社 ヒートパイプ式筐体冷却器
JPH04267593A (ja) * 1991-02-22 1992-09-24 Furukawa Electric Co Ltd:The ヒ−トパイプ式筐体冷却構造
JPH0560476A (ja) * 1991-09-04 1993-03-09 Furukawa Electric Co Ltd:The ヒ−トパイプの取付構造
JP2695076B2 (ja) * 1991-09-26 1997-12-24 日本碍子株式会社 Ｘ線源用ベリリウム窓の製造方法
JPH05102687A (ja) * 1991-10-04 1993-04-23 Furukawa Electric Co Ltd:The 筐体の冷却装置
JPH05141811A (ja) * 1991-11-22 1993-06-08 Nippondenso Co Ltd 熱交換装置
JP3049453B2 (ja) * 1992-01-08 2000-06-05 株式会社日立製作所 半導体冷却装置
US5479985A (en) * 1992-03-24 1996-01-02 Nippondenso Co., Ltd. Heat exchanger
JPH0612554A (ja) * 1992-06-26 1994-01-21 Furukawa Electric Co Ltd:The たばこ自動販売機
JP3456713B2 (ja) * 1992-07-30 2003-10-14 株式会社東芝 半導体素子冷却ユニット
JPH0730023A (ja) * 1993-07-13 1995-01-31 Toshiba Corp 半導体素子冷却装置
JP3351034B2 (ja) * 1993-07-27 2002-11-25 栗田工業株式会社 有機性固形分を含む排液の処理方法および装置
JP3337789B2 (ja) * 1993-10-15 2002-10-21 古河電気工業株式会社 ヒートパイプ式筐体冷却器
JPH07236968A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 溝付き管のろう付方法及び溝付き管のろう付け構造
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
JP3546473B2 (ja) 1994-07-19 2004-07-28 株式会社デンソー 沸騰冷却装置
JPH0829041A (ja) 1994-07-19 1996-02-02 Nippondenso Co Ltd 沸騰冷却装置

Also Published As

Publication number Publication date
FR2746177A1 (fr) 1997-09-19
US5832989A (en) 1998-11-10
DE19708282B4 (de) 2006-04-06
DE19708282A1 (de) 1997-10-30

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20131031