JPS57152150A - Cooler for semiconductor and manufacture thereof - Google Patents

Cooler for semiconductor and manufacture thereof

Info

Publication number
JPS57152150A
JPS57152150A JP56037118A JP3711881A JPS57152150A JP S57152150 A JPS57152150 A JP S57152150A JP 56037118 A JP56037118 A JP 56037118A JP 3711881 A JP3711881 A JP 3711881A JP S57152150 A JPS57152150 A JP S57152150A
Authority
JP
Japan
Prior art keywords
refrigerant
soldered
groove parts
plural
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56037118A
Other languages
Japanese (ja)
Other versions
JPS6351387B2 (en
Inventor
Ryoichi Hoshino
Yasuhisa Kutsukake
Takayuki Yasutake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Aluminum Can Corp
Original Assignee
Showa Aluminum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Aluminum Corp filed Critical Showa Aluminum Corp
Priority to JP56037118A priority Critical patent/JPS57152150A/en
Publication of JPS57152150A publication Critical patent/JPS57152150A/en
Publication of JPS6351387B2 publication Critical patent/JPS6351387B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To enhance performance of the interchange of heat at the path of refrigerant of a cooler for semiconductor by a method wherein a pair of metal comb-teeth type members are soldered facing mutually, plural pairs of groove parts constitute the path for refrigerant, and metal powder bodies are soldered to the surface of the groove parts to form the porous face. CONSTITUTION:The cooler is consisting of an evaporating part 1 at the lower part, a condensing part 2 at the upper part, and a vapor and liquid separating chamber 3 at the middle part. The semiconductor elements 4 are equipped on both end faces of the evaporating part 1, and the plural pathes 5 for refrigerant are formed inside in the vertical direction. A pair of Al members 7 having the comb-teeth type section are soldered facing mutually interposing placing sheets 6 between them, and sealing-up plate 9 is fixed to the lower end part. The plural pathes 5 for refrigerant having the elliptical section are formed by the plural pairs of the groove parts 10 of the members 7. The surface of the groove parts have the saw-teeth type uneven face, and is soldered with the Al powder bodies 11 to form the porous face. Accordingly thermal conductivity is enhanced, and performance of the interchange of heat is enhanced.
JP56037118A 1981-03-13 1981-03-13 Cooler for semiconductor and manufacture thereof Granted JPS57152150A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56037118A JPS57152150A (en) 1981-03-13 1981-03-13 Cooler for semiconductor and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56037118A JPS57152150A (en) 1981-03-13 1981-03-13 Cooler for semiconductor and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS57152150A true JPS57152150A (en) 1982-09-20
JPS6351387B2 JPS6351387B2 (en) 1988-10-13

Family

ID=12488680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56037118A Granted JPS57152150A (en) 1981-03-13 1981-03-13 Cooler for semiconductor and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57152150A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5713413A (en) * 1994-12-28 1998-02-03 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
EP0852399A1 (en) * 1995-09-08 1998-07-08 Sumitomo Precision Products Company Limited Semiconductor element cooling apparatus
US5832989A (en) * 1996-03-14 1998-11-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
US6279649B1 (en) * 1998-04-27 2001-08-28 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6357517B1 (en) * 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US6575230B1 (en) * 1996-01-29 2003-06-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357517B1 (en) * 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US5713413A (en) * 1994-12-28 1998-02-03 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
EP0852399A1 (en) * 1995-09-08 1998-07-08 Sumitomo Precision Products Company Limited Semiconductor element cooling apparatus
US6575230B1 (en) * 1996-01-29 2003-06-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US5832989A (en) * 1996-03-14 1998-11-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6279649B1 (en) * 1998-04-27 2001-08-28 Denso Corporation Cooling apparatus using boiling and condensing refrigerant

Also Published As

Publication number Publication date
JPS6351387B2 (en) 1988-10-13

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