JPS6351387B2 - - Google Patents
Info
- Publication number
- JPS6351387B2 JPS6351387B2 JP56037118A JP3711881A JPS6351387B2 JP S6351387 B2 JPS6351387 B2 JP S6351387B2 JP 56037118 A JP56037118 A JP 56037118A JP 3711881 A JP3711881 A JP 3711881A JP S6351387 B2 JPS6351387 B2 JP S6351387B2
- Authority
- JP
- Japan
- Prior art keywords
- comb
- groove
- metal powder
- cooling device
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003507 refrigerant Substances 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 16
- 238000005219 brazing Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000004264 Petrolatum Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229940066842 petrolatum Drugs 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
【発明の詳細な説明】
この発明は、半導体素子等の冷却に使用される
冷却装置の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in cooling devices used for cooling semiconductor devices and the like.
一般に、冷却装置の冷媒通路においては、熱交
換は主に沸騰伝熱によりなされる。そのため熱交
換性能を高めるためには、伝熱面の面積をできる
だけ拡大したり、伝熱面における冷媒の蒸気泡の
発生核密度を高めて、これによつて冷媒を十分に
攪拌させることが重要になつてくる。 Generally, in a refrigerant passage of a cooling device, heat exchange is mainly performed by boiling heat transfer. Therefore, in order to improve heat exchange performance, it is important to increase the area of the heat transfer surface as much as possible, increase the density of the nuclei of refrigerant vapor bubbles on the heat transfer surface, and thereby sufficiently stir the refrigerant. I'm getting older.
この発明は上記ような観点からなされたもの
で、安価に製作でき、しかも高性能の伝熱性を有
する冷却装置およびその製造方法を提供するもの
である。 The present invention has been made from the above-mentioned viewpoints, and it is an object of the present invention to provide a cooling device that can be manufactured at low cost and has high-performance heat transfer properties, and a method for manufacturing the same.
以下、この発明の実施例について図面により具
体的に説明する。なお、この説明書において上下
関係は第１図を基準とする。 Embodiments of the present invention will be specifically described below with reference to the drawings. In this manual, the vertical relationship is based on FIG. 1.
第１図、第２図において、この発明による冷却
装置は、下部の蒸発部１と上部の凝縮部２とその
間に介在された気液分離室３とからなる。蒸発部
１は両側部に半導体素子Ｓを取付ける取付面４を
有し、内部に上下方向に複数の冷媒通路５を有す
る。そして蒸発部１は、アルミニウム押出型材製
の１対の横断面櫛歯状部材７がブレージング・シ
ート６を介して、対向状にろう付せられ、得られ
た接合品の下端面に密封板９が固着されたもので
ある。１対の櫛歯状部材７の接合により、同部材
の複数対の溝部１０から横断面長円形の複数の冷
媒通路５が形成され、同通路５の下端開口が密封
板９で閉じられている。櫛歯状部材７の各溝部１
０の表面は、第４図に示すように、横断面鋸歯状
の凹凸面となされており、同表面にこれを被うよ
うにアルミニウム粉体１１がろう付せられてい
る。そして、こうしてろう付せられた同粉体１１
によつて、冷媒通路５の伝熱面１２は多孔質面と
なされている。蒸発部１は下端部に各冷媒通路５
を連通する複数の連通部１３を有し、上端部には
各冷媒通路５の各上端に通じる空胴部２２を有す
る。また両端の端部冷媒通路５ａには、後述する
気液分離室から垂下した冷媒液戻し管１４がそれ
ぞれ配されている。 1 and 2, the cooling device according to the present invention comprises a lower evaporating section 1, an upper condensing section 2, and a gas-liquid separation chamber 3 interposed therebetween. The evaporator 1 has mounting surfaces 4 on both sides to which semiconductor elements S are mounted, and has a plurality of refrigerant passages 5 in the vertical direction inside. The evaporation section 1 is constructed by brazing a pair of comb-shaped members 7 made of extruded aluminum in a facing manner through a brazing sheet 6, and attaching a sealing plate 9 to the lower end surface of the resulting joined product. is fixed. By joining a pair of comb-like members 7, a plurality of refrigerant passages 5 having an oval cross section are formed from a plurality of pairs of grooves 10 of the same member, and a lower end opening of the passage 5 is closed with a sealing plate 9. . Each groove 1 of the comb-like member 7
As shown in FIG. 4, the surface of 0 has an uneven surface with a sawtooth cross section, and aluminum powder 11 is brazed to cover this surface. The same powder 11 thus brazed
Therefore, the heat transfer surface 12 of the refrigerant passage 5 is a porous surface. The evaporator 1 has each refrigerant passage 5 at its lower end.
The refrigerant passage 5 has a plurality of communication portions 13 that communicate with each other, and has a cavity portion 22 at the upper end that communicates with each upper end of each refrigerant passage 5. Furthermore, refrigerant liquid return pipes 14 hanging down from a gas-liquid separation chamber, which will be described later, are arranged in the end refrigerant passages 5a at both ends.
気液分離室３の底壁１５には、同室３と蒸発部
１の空胴部２２を連通する透孔１６があけられ、
同室３の底部には１対の冷媒液戻し管１４の上端
が開口している。 A through hole 16 is formed in the bottom wall 15 of the gas-liquid separation chamber 3 to communicate the chamber 3 with the cavity 22 of the evaporation section 1.
At the bottom of the chamber 3, the upper ends of a pair of refrigerant liquid return pipes 14 are open.
凝縮部２は、１対の側板１７の間に平行に配さ
れた仕切板１８によつて２つに区分されており、
各区分室にはコルゲート・フイン１９を装着した
複数の偏平管２０が内装されている。そして同管
２０の各上端はヘツダ２１によつて連通され、同
下端は気液分離室３の頂壁８を貫通して同室３に
開口している。 The condensing section 2 is divided into two by a partition plate 18 arranged in parallel between a pair of side plates 17.
Each compartment is equipped with a plurality of flat tubes 20 equipped with corrugated fins 19. The upper ends of the tubes 20 are communicated with each other by headers 21, and the lower ends thereof penetrate the top wall 8 of the gas-liquid separation chamber 3 and open into the same chamber 3.
こうして半導体用冷却装置が構成されている。 In this way, a semiconductor cooling device is constructed.
つぎに、この発明による冷却装置の製造方法に
ついて説明する。 Next, a method for manufacturing a cooling device according to the present invention will be explained.
まず、１対のアルミニウム押出型材製の横断面
櫛歯状部材７の各溝部１０の表面に、アルミニウ
ム粉体とろう材粉体と有機質結合剤からなるペー
ストを塗布する。アルミニウム製櫛歯状部材およ
びアルミニウム粉体は、ろう付が可能なものであ
れば他の金属よりなるものでもよい。金属粉体は
直径20〜500μmである。直径が20μm未満かまた
は500μmを越えると、多孔質の伝熱面が形成され
ない。またろう材粉体は直径20〜200μmである。
この直径が20μm未満のものは工業的に生産困難
であり、200μmを越えると均一なペーストが得ら
れない。金属粉体とろう材粉体の組成比は、粉体
直径等にもよるが、通常重量比で８：１程度であ
る。もつともこの値は限定的なものではない。有
機質結合剤は、ペーストを形成するためのもので
あつて、後のろう付中に分解ないし蒸発して除去
される。この例としてはワセリン等があげられ
る。なお、ペーストは適当な液体の添加によつて
適度な粘度を有するスラリーとなされてもよい。 First, a paste made of aluminum powder, brazing filler metal powder, and an organic binder is applied to the surface of each groove 10 of a pair of comb-shaped members 7 made of extruded aluminum. The aluminum comb-like member and the aluminum powder may be made of other metals as long as they can be brazed. The metal powder has a diameter of 20-500 μm. If the diameter is less than 20 μm or more than 500 μm, no porous heat transfer surface is formed. The brazing filler metal powder has a diameter of 20 to 200 μm.
If the diameter is less than 20 μm, it is difficult to produce it industrially, and if it exceeds 200 μm, a uniform paste cannot be obtained. The composition ratio of the metal powder and the brazing filler metal powder is usually about 8:1 by weight, although it depends on the diameter of the powder and the like. However, this value is not limited. The organic binder is used to form a paste and is removed by decomposition or evaporation during subsequent brazing. An example of this is petrolatum. Note that the paste may be made into a slurry having an appropriate viscosity by adding an appropriate liquid.
ついで１対の櫛歯状部材７をブレージング・シ
ート６を介して密接状に対向させる。ついで得ら
れた対向品を真空ろう付炉に装入して、真空下に
加熱する。ろう付法は真空ろう付法に限定され
ず、たとえば非酸化性雰囲気または還元性雰囲気
中で行う方法でもよい。その結果、１対の櫛歯状
部材７が接合されて、複数対の溝部１０からそれ
ぞれ冷媒通路５が形成されるとともに、ペースト
塗布物中のアルミニウム粉体１１が各溝部１０の
表面にろう付せられ、冷媒通路５の伝熱面が多孔
質面となされる。 Next, the pair of comb-like members 7 are closely opposed to each other with the brazing sheet 6 in between. Then, the resulting counterpiece is placed in a vacuum brazing furnace and heated under vacuum. The brazing method is not limited to a vacuum brazing method, and may be performed in a non-oxidizing atmosphere or a reducing atmosphere, for example. As a result, the pair of comb-shaped members 7 are joined, and the refrigerant passages 5 are formed from the plurality of pairs of grooves 10, and the aluminum powder 11 in the paste coating is brazed on the surface of each groove 10. The heat transfer surface of the refrigerant passage 5 is made into a porous surface.
こうして蒸発部１が製造される。なお、凝縮部
２および気液分離室３は常法の組立てにより製造
される。 In this way, the evaporator 1 is manufactured. Note that the condensing section 2 and the gas-liquid separation chamber 3 are manufactured by a conventional assembly method.
第５図はこの発明のもう１つの実施例を示すも
のである。この実施例による半導体用冷却装置
は、アルミニウム押出型材製の横断面櫛歯状部材
７と、同部材７の歯先側に溝開口を閉じるように
ろう付された平板とからなり、櫛歯状部材７の複
数の溝部１０からそれぞれ冷媒通路５が形成さ
れ、各溝部１０の表面を被うように金属粉体がろ
う付されて、冷媒通路５の伝熱面１２が多孔質面
となされているものである。 FIG. 5 shows another embodiment of the invention. The semiconductor cooling device according to this embodiment is composed of a comb-shaped member 7 in cross section made of an aluminum extruded material, and a flat plate brazed to the tooth tip side of the member 7 so as to close the groove opening. A refrigerant passage 5 is formed from each of the plurality of grooves 10 of the member 7, and metal powder is brazed to cover the surface of each groove 10, so that the heat transfer surface 12 of the refrigerant passage 5 is made into a porous surface. It is something that exists.
また、この実施例による半導体用冷却装置は、
つぎのような方法で製造される。すなわち、アル
ミニウム押出型材製の横断面櫛歯状部材７の溝部
１０の表面に、アルミニウム粉末とろう材粉体と
有機質結合剤からなるペーストを塗布する。同部
材７の歯先側に溝開口を閉じるようにブレージン
グ・シート６を密接に組付ける。得られた組付け
品を加熱することにより、櫛歯状部材７の複数の
溝部１０からそれぞれ冷媒通路５を形成するとと
もに、ペースト塗布物中のアルミニウム粉体を各
溝部１０の表面にろう付し、冷媒通路５の伝熱面
１２を多孔質面にする。 Furthermore, the semiconductor cooling device according to this embodiment is as follows:
It is manufactured by the following method. That is, a paste made of aluminum powder, brazing filler metal powder, and an organic binder is applied to the surface of the groove portion 10 of the comb-like cross-sectional member 7 made of an aluminum extrusion. A brazing sheet 6 is closely attached to the tooth tip side of the member 7 so as to close the groove opening. By heating the obtained assembly, the refrigerant passages 5 are formed from the plurality of grooves 10 of the comb-like member 7, and the aluminum powder in the paste coating is brazed to the surface of each groove 10. , the heat transfer surface 12 of the refrigerant passage 5 is made a porous surface.
この発明による冷却装置は以上のとおり構成さ
れており、冷媒通路の伝熱面がろう付金属粉体よ
りなる多孔質面となされているので、伝熱面積を
大幅に拡大することができるとともに、多孔空隙
を冷媒の蒸気泡の発生核となして、同核の密度を
大幅に増大することができ、したがつて伝熱性の
改良により冷却性能を飛躍的に向上させることが
できる。またこの発明の製造方法により、上記の
ような高性能の冷却装置を簡単な操作で安価に製
作することができる。 The cooling device according to the present invention is configured as described above, and since the heat transfer surface of the refrigerant passage is a porous surface made of brazed metal powder, the heat transfer area can be greatly expanded, and By using the porous voids as nuclei for generating vapor bubbles of the refrigerant, the density of the nuclei can be significantly increased, and therefore cooling performance can be dramatically improved by improving heat conductivity. Further, by the manufacturing method of the present invention, a high-performance cooling device as described above can be manufactured with simple operations and at low cost.
図面はこの発明の実施例を示すもので、第１図
は冷却装置の正面図、第２図は第１図上の−
線に沿う断面図、第３図は第１図上の−線に
沿う断面図、第４図は要部拡大断面図、第５図は
他の実施例を示す第３図相当の断面図である。
１……蒸発部、２……凝縮部、３……気液分離
室、４……半導体素子の取付面、５……冷媒通
路、６……ブレージング・シート、７……櫛歯状
部材、９……密封板、１０……溝部、１１……ア
ルミニウム粉体、１２……伝熱面。
The drawings show an embodiment of the present invention, and FIG. 1 is a front view of the cooling device, and FIG.
3 is a sectional view taken along the - line in FIG. 1, FIG. 4 is an enlarged sectional view of the main part, and FIG. 5 is a sectional view equivalent to FIG. 3 showing another embodiment. be. DESCRIPTION OF SYMBOLS 1... Evaporation section, 2... Condensation section, 3... Gas-liquid separation chamber, 4... Mounting surface of the semiconductor element, 5... Refrigerant passage, 6... Brazing sheet, 7... Comb tooth-shaped member, 9... Sealing plate, 10... Groove, 11... Aluminum powder, 12... Heat transfer surface.
Claims (1)
と、同部材の歯先側に溝開口を閉じるようにろう
付された平板とからなり、櫛歯状部材の複数の溝
部からそれぞれ冷媒通路が形成され、各溝部の表
面を被うように金属粉体がろう付されて、冷媒通
路の伝熱面が多孔質面となされていることを特徴
とする半導体用冷却装置。 ２ 金属製の横断面櫛歯状部材の溝部の表面に、
金属粉体とろう材粉体と有機質結合剤からなるペ
ーストを塗布し、少なくとも１つの櫛歯状部材の
歯先側に溝開口を閉じるようにブレージング・シ
ートを密接に組付け、得られた組付け品を加熱し
て、櫛歯状部材の複数の溝部からそれぞれ冷媒通
路を形成するとともに、ペースト塗布物中の金属
粉体を各溝部の表面にろう付し、冷媒通路の伝熱
面を多孔質面にすることを特徴とする半導体用冷
却装置の製造方法。[Scope of Claims] 1. Consisting of at least one comb-shaped member in cross section made of metal, and a flat plate brazed to the tip side of the member so as to close the groove opening, the plurality of comb-shaped members A semiconductor cooling device characterized in that coolant passages are formed from the grooves, metal powder is brazed to cover the surface of each groove, and the heat transfer surface of the coolant passage is a porous surface. . 2. On the surface of the groove of the metal cross-section comb-shaped member,
A paste consisting of metal powder, brazing filler metal powder, and organic binder is applied, and a brazing sheet is closely assembled on the tooth tip side of at least one comb-like member so as to close the groove opening. The attachment is heated to form refrigerant passages from the plurality of grooves of the comb-like member, and the metal powder in the paste coating is brazed to the surface of each groove to form a porous heat transfer surface of the refrigerant passage. A method of manufacturing a cooling device for semiconductors, characterized in that the cooling device has a high quality surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037118A JPS57152150A (en) | 1981-03-13 | 1981-03-13 | Cooler for semiconductor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037118A JPS57152150A (en) | 1981-03-13 | 1981-03-13 | Cooler for semiconductor and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57152150A JPS57152150A (en) | 1982-09-20 |
| JPS6351387B2 true JPS6351387B2 (en) | 1988-10-13 |
Family
ID=12488680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56037118A Granted JPS57152150A (en) | 1981-03-13 | 1981-03-13 | Cooler for semiconductor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57152150A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6357517B1 (en) * | 1994-07-04 | 2002-03-19 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
| JP3487382B2 (en) * | 1994-12-28 | 2004-01-19 | 株式会社デンソー | Boiling cooling device |
| US6073683A (en) * | 1995-07-05 | 2000-06-13 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same |
| JP3634028B2 (en) * | 1995-09-08 | 2005-03-30 | 住友精密工業株式会社 | Semiconductor element cooling device |
| US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
| FR2746177B1 (en) * | 1996-03-14 | 2000-04-07 | COOLING DEVICE USING A BOILING REFRIGERANT AND CONDENSING | |
| US6279649B1 (en) * | 1998-04-27 | 2001-08-28 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
-
1981
- 1981-03-13 JP JP56037118A patent/JPS57152150A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57152150A (en) | 1982-09-20 |
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