JPS6338864B2 - - Google Patents
Info
- Publication number
- JPS6338864B2 JPS6338864B2 JP57013111A JP1311182A JPS6338864B2 JP S6338864 B2 JPS6338864 B2 JP S6338864B2 JP 57013111 A JP57013111 A JP 57013111A JP 1311182 A JP1311182 A JP 1311182A JP S6338864 B2 JPS6338864 B2 JP S6338864B2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- cooling air
- section
- passage
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 41
- 239000003507 refrigerant Substances 0.000 claims description 38
- 239000007788 liquid Substances 0.000 claims description 27
- 238000005192 partition Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000001704 evaporation Methods 0.000 claims description 13
- 238000009833 condensation Methods 0.000 claims description 11
- 230000005494 condensation Effects 0.000 claims description 11
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims 2
- 230000020169 heat generation Effects 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、半導体素子の冷却装置に係り、特
に冷却装置内に充填された冷媒の気液間相変化を
利用した沸騰式の半導体素子の冷却装置の改良に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling device for semiconductor devices, and particularly to a boiling type semiconductor device cooling device that utilizes the phase change between gas and liquid of a refrigerant filled in the cooling device. Concerning improvements in cooling devices.
［従来の説明］
従来この種の冷却装置として、特開昭50−
72587号公報に示すものが公知であり、第５図は
その全体の構成を示す図、第６図は第５図のＹ−
Ｙ線に沿つて切断し、矢印方向に見た概略断面図
である。図中３１は半導体素子、３２はこの半導
体素子３１の端面、３３は蒸発器、３４は絶縁継
手、３５は下部室、３６は上部室、３７はフイン
３８を有する細管、３９は上昇路、４０は凝縮器
である。[Conventional explanation] As a conventional cooling device of this type,
The one shown in Japanese Patent No. 72587 is publicly known, and FIG. 5 is a diagram showing the overall configuration, and FIG. 6 is a diagram showing the Y--
FIG. 2 is a schematic cross-sectional view taken along the Y line and viewed in the direction of the arrow. In the figure, 31 is a semiconductor element, 32 is an end face of this semiconductor element 31, 33 is an evaporator, 34 is an insulating joint, 35 is a lower chamber, 36 is an upper chamber, 37 is a thin tube having fins 38, 39 is an ascending path, 40 is the condenser.
この図から明らかなように、凝縮器４０の構造
は、冷却風の通る通路（フイン３８部）と、内部
冷媒通路すなわち凝縮液または蒸気の通路が互い
に、サンドイツチ状に形成され、冷却風は、フイ
ン３８部に入り、ここを通過後、装置外に直線的
に吹き抜ける構造となつている。又、内部冷媒通
路４１は、フイン３８部にかまぼこ板状にサンド
イツチされており、各内部冷媒通路４１は下部室
３５と上部室３６で連通されている。そして、各
内部冷媒通路４１内は、全く中空となつており、
特に凝縮液用通路と蒸気用通路等は仕切られてい
ない。第５図および第６図の場合、中央の冷媒通
路を、主に蒸気用通路とし、上部の連通部に蒸気
を送り、各細管３７の途中で冷却風により、冷却
凝縮した液を蒸発器３３に戻すようになつてい
る。 As is clear from this figure, the structure of the condenser 40 is such that the passage through which the cooling air passes (the fins 38) and the internal refrigerant passage, that is, the passage for condensed liquid or steam, are mutually formed in the shape of a sandwich arch. It enters the fin 38, passes through this, and then blows straight out of the device. Further, the internal refrigerant passages 41 are sandwiched in a semi-cylindrical plate shape in the fins 38, and each internal refrigerant passage 41 is communicated with the lower chamber 35 and the upper chamber 36. The inside of each internal refrigerant passage 41 is completely hollow,
In particular, the condensate passage and the steam passage are not partitioned. In the case of FIGS. 5 and 6, the central refrigerant passage is mainly used as a passage for steam, the steam is sent to the upper communication part, and the cooled and condensed liquid is sent to the evaporator 33 by cooling air in the middle of each thin tube 37. It is starting to return to .
［発明が解決しようとする問題点］
ところが、各細管３７の凝縮器４０全面が有効
に冷却用として利用されにくい。これは、蒸気が
各細管３７に行き渡り、始めて凝縮が始まるた
め、凝縮開始は細管３７の途中より始まる虞れが
あるからである。また、第６図のＢ部において、
凝縮液戻りと、上昇蒸気流とが入り混じる虞れが
あり、このためフイン３８を通過する冷却風は、
熱伝達により徐々に上昇し、後方程冷却能力が低
下するが、この配慮が何等なされていない。[Problems to be Solved by the Invention] However, it is difficult to effectively utilize the entire surface of the condenser 40 of each thin tube 37 for cooling. This is because condensation begins only after the steam has spread through each of the thin tubes 37, so there is a possibility that condensation will begin in the middle of the thin tubes 37. In addition, in part B of Fig. 6,
There is a risk that the condensate return and the rising steam flow will mix, so the cooling air passing through the fins 38 will be
It gradually rises due to heat transfer, and the cooling capacity decreases towards the rear, but no consideration has been given to this.
そこで、この発明は、冷却効率が向上する半導
体素子の冷却装置を提供することを目的とする。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a semiconductor device cooling device that improves cooling efficiency.
［実施例］
以下、この発明の実施例について図面を参照し
て説明する。第１図は、この第１の実施例の一部
を断面した正面図であり、第２図は第１図のＸ−
Ｘ線に沿つて切断し矢印方向に見た図である。以
下、これについて説明する。蒸発部１は、有底筒
状の蒸発部側壁７の外周面に形成された取付け用
凹部２１に図示しない半導体素子が取付け可能
で、蒸発部側壁７の内部空間に半導体素子の許容
温度上限以下に沸騰する冷媒液体６が充填されて
いる。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 is a partially sectional front view of this first embodiment, and FIG. 2 is a front view taken along the line X--X in FIG.
It is a view cut along the X-ray and seen in the direction of the arrow. This will be explained below. In the evaporation section 1, a semiconductor element (not shown) can be attached to a mounting recess 21 formed on the outer circumferential surface of the evaporation section side wall 7, which has a cylindrical shape with a bottom. It is filled with a refrigerant liquid 6 that boils.
そして、蒸発部側壁７内に、片面に複数の縦ス
リツト１３ａとリブ１３ｂを有する２枚の伝熱板
１４を、スリツト１３ａとリブ１３ｂを有する面
が対向配置され、ブレージングシート１５を介し
２枚の伝熱板１４を一体にろう付し、縦の冷媒通
路が形成されている。 Two heat transfer plates 14 each having a plurality of vertical slits 13a and ribs 13b on one side are placed in the side wall 7 of the evaporator section, with the surfaces having the slits 13a and ribs 13b facing each other, and the two heat transfer plates 14 are placed with a brazing sheet 15 in between. The heat exchanger plates 14 are brazed together to form a vertical refrigerant passage.
蒸発部側壁７の上端に、開口部８ａを有する液
溜り仕切り体たとえば仕切り板８を含むチヤンバ
ー例えば液溜り部２を介して凝縮部３が形成され
ている。 A condensing section 3 is formed at the upper end of the evaporating section side wall 7 via a chamber, for example, a liquid reservoir section 2, which includes a reservoir partition, for example, a partition plate 8, having an opening 8a.
この凝縮部３と液溜り部２とヘツダー４との間
を連通する複数本の凝縮管路９が連通され、この
各凝縮管路９の外周面には多数の放熱フイン１０
が設けられている。 A plurality of condensing pipes 9 communicate between the condensing part 3, the liquid reservoir part 2, and the header 4, and a large number of heat radiation fins 10 are provided on the outer peripheral surface of each condensing pipe 9.
is provided.
そして、前記仕切り板８の開口部８ａは、図示
しない強制冷却風発生手段から前記凝縮管路９に
対して直角でかつ一方向すなわち図のＣ矢印側
（冷却風流入側）からＢ矢印側（冷却風流出側）
に吹付けるようにし、この場合開口部８ａは、Ｂ
矢印側に形成する。また、蒸発部１の内部であつ
て、前記冷却風流入側に、冷媒液体用通路例えば
液体戻り用パイプ１７を上下に配置するととも
に、前記仕切り板８に連通固定させたものであ
る。 The opening 8a of the partition plate 8 is perpendicular to the condensing pipe line 9 from a forced cooling air generating means (not shown) and is opened in one direction, that is, from the arrow C side (cooling air inflow side) to the arrow B side ( cooling air outflow side)
In this case, the opening 8a is B
Form on the arrow side. Furthermore, inside the evaporator 1, on the cooling air inflow side, refrigerant liquid passages, such as liquid return pipes 17, are disposed vertically and communicated and fixed to the partition plate 8.
尚、蒸発部１の内側底部付近には、縦スリツト
１３ａ並びにリブ１３ｂに直交するように横溝２
２が形成されている。また、前記ヘツダー４上部
には、ノズル２０を取付け、これにより、冷却装
置内部空間に真空引きした後、冷媒を注入し、ピ
ンチして冷媒の封入できるようにしてある。な
お、前記凝縮部３の上部にヘツダー４を配し、前
記蒸発部１の底部１９、蒸発部１、液溜り部２、
凝縮部３とヘツダー４とを順次積重ねた上で、ろ
う付け又は溶接により一体に結合して冷却装置を
構成している。 Incidentally, near the inner bottom of the evaporation section 1, a horizontal groove 2 is provided so as to be orthogonal to the vertical slit 13a and the rib 13b.
2 is formed. Further, a nozzle 20 is attached to the upper part of the header 4, so that after the internal space of the cooling device is evacuated, a refrigerant is injected and the refrigerant can be sealed by pinching. Note that a header 4 is disposed above the condensing section 3, and the bottom section 19 of the evaporating section 1, the evaporating section 1, the liquid reservoir section 2,
A cooling device is constructed by stacking the condensing section 3 and the header 4 one after another and then joining them together by brazing or welding.
このような構成のものにおいて、半導体素子に
負荷がかかると、半導体素子から発生熱が蒸発部
側壁７を介し、蒸発部１の内部空間に伝わり、冷
媒６が沸騰し、冷媒６の一部が気化、蒸発し、液
溜り部２の仕切り板８の開口部８ａを通り、上部
に位置する凝縮部３の凝縮管路９を実線矢印１１
のごとく上昇し、仕切り板８の液戻り用パイプよ
り蒸発部１の蒸発部側壁の空間に充填されている
冷媒液体６まで戻つてくる。 In such a structure, when a load is applied to the semiconductor element, heat generated from the semiconductor element is transmitted to the internal space of the evaporator 1 via the evaporator side wall 7, the refrigerant 6 boils, and a part of the refrigerant 6 is heated. The liquid evaporates, passes through the opening 8a of the partition plate 8 of the liquid reservoir section 2, and connects the condensation pipe 9 of the condensation section 3 located at the top with a solid line arrow 11.
The refrigerant liquid 6 rises as shown in FIG.
この第１図の場合、特に次の効果が得られる。
一般に、半導体素子の冷却装置における冷媒各部
の温度分布・気流状態を測定・分析してみると、
凝縮部３のフイン１０部への冷却風流入側（Ｃ矢
印方向）の冷媒温度の方が冷却風流出側（Ｂ矢印
方向）の冷媒温度より低くなつている。これは、
凝縮部３のフイン１０部を通過する冷却風温度が
フイン１０部入側より出側の方が劣つているため
である。すなわち、凝縮管路９中の冷媒は、冷却
風流入側（Ｃ方向）に行くに従つて凝縮が促進さ
れ、冷媒液体状態にあり、冷却風側では凝縮が不
十分で、気体冷媒状態あるいは気体混合状態を呈
している。このため、ここでは、冷媒状態を利用
し、冷却風流出側に仕切り板８の開口部８ａを形
成し、また冷却風の流入側に液戻りパイプ１７を
設けてあるので、冷却装置内を冷媒が円滑に循環
する。つまり、第１図は、凝縮液の戻りと、上昇
蒸気気流とが入り混じる虞れがなく、広い中空路
内に、蒸気が入り、低温の冷却風側にて凝縮が促
進され、例えば図の時計方向に冷媒の流路が形成
されるからである。このことから、冷却効率が向
上する。 In the case of FIG. 1, the following effects can be particularly obtained.
Generally, when measuring and analyzing the temperature distribution and airflow conditions of each part of the refrigerant in a semiconductor device cooling system,
The refrigerant temperature on the cooling air inflow side (in the direction of arrow C) to the fins 10 of the condensing section 3 is lower than the refrigerant temperature on the cooling air outflow side (in the direction of arrow B). this is,
This is because the temperature of the cooling air passing through the 10 fins of the condensing section 3 is lower on the outlet side than on the inlet side of the 10 fins. That is, the refrigerant in the condensing pipe line 9 is accelerated in condensation as it goes toward the cooling air inflow side (direction C) and is in a refrigerant liquid state, whereas on the cooling air side, condensation is insufficient and it is in a gaseous refrigerant state or a gaseous refrigerant state. It is in a mixed state. For this reason, here, by utilizing the refrigerant state, the opening 8a of the partition plate 8 is formed on the outflow side of the cooling air, and the liquid return pipe 17 is provided on the inflow side of the cooling air. circulates smoothly. In other words, in Fig. 1, there is no risk of the return of condensate and the rising steam airflow mixing, steam enters the wide hollow passage, and condensation is promoted on the low-temperature cooling air side. This is because a refrigerant flow path is formed in a clockwise direction. This improves cooling efficiency.
第３図は、この発明の第２の実施例の一部を断
面した正面図であり、第４図は第３図の−線
に沿つて切断し、矢印方向に見た図である。これ
は、前述の実施例とは次の点が異なる。すなわ
ち、蒸発部１の上部に仕切り板８を有する液溜り
部２を設け、この仕切り板８の冷却風流出側（Ｂ
矢印方向）に第１の開口部８ｂを設けるととも
に、この第１の開口部８ｂとは対向する低位置す
なわち冷却風流入側方向（Ｃ矢印方向）には第２
の開口部８ｃを設けたものである。そして、液溜
り部２の上に偏平チユーブ形の凝縮管路９とフイ
ン１０と両側面に壁板とを配して凝縮部３とな
し、さらに該凝縮部３の上部にヘツダー４を配
し、前記蒸発部１の底部１９、蒸発部１、液溜り
部２、凝縮部３とヘツダー４とを順次積重ねた上
で、ろうづけ又は溶接により一体に結合してあ
る。また、前記仕切り板８は、図のように傾斜し
て取付けられ、これはヘツダー４の上部に取付け
られたノズル１８より冷却装置内部を真空引きし
た後、ノズル２０より冷媒を注入しピンチして冷
媒の封入を行ない、冷媒液体の還元を促進させる
ためである。 FIG. 3 is a partially sectional front view of the second embodiment of the present invention, and FIG. 4 is a view cut along the - line in FIG. 3 and viewed in the direction of the arrow. This differs from the previous embodiment in the following points. That is, a liquid reservoir section 2 having a partition plate 8 is provided above the evaporation section 1, and the cooling air outflow side of this partition plate 8 (B
A first opening 8b is provided in the direction of the arrow C), and a second opening 8b is provided at a lower position opposite to the first opening 8b, that is, in the direction of the cooling air inflow side (direction of the arrow C).
An opening 8c is provided. Then, a flat tube-shaped condensing pipe line 9, fins 10, and wall plates on both sides are arranged on the liquid reservoir part 2 to form a condensing part 3, and a header 4 is further arranged in the upper part of the condensing part 3. The bottom part 19 of the evaporating part 1, the evaporating part 1, the liquid reservoir part 2, the condensing part 3, and the header 4 are stacked one on top of the other, and are then integrally connected by brazing or welding. The partition plate 8 is installed at an angle as shown in the figure, and this is done by evacuating the inside of the cooling device through a nozzle 18 installed at the top of the header 4, and then injecting refrigerant through the nozzle 20 and pinching. This is to encapsulate the refrigerant and promote the reduction of the refrigerant liquid.
この実施例では、通路の狭くなつている仕切り
板８の第１の開口部８ｂを蒸気上昇専用としてい
るので、冷却装置内の蒸気の上昇が円滑に進む。
又、液溜り部２の仕切り板８第２の開口部８ｃが
下方になるように傾斜しているため、凝縮した冷
媒液体が蒸発部１に帰還するのが促進される。こ
のようなことから、この発明の第２の実施例の場
合も冷却効率が向上する。 In this embodiment, the first opening 8b of the partition plate 8, which has a narrow passage, is used exclusively for rising steam, so that the steam within the cooling device rises smoothly.
Furthermore, since the second opening 8c of the partition plate 8 of the liquid reservoir 2 is inclined downward, the return of the condensed refrigerant liquid to the evaporator 1 is promoted. For this reason, the cooling efficiency is also improved in the second embodiment of the present invention.
［発明の効果］
以上述べたこの発明によれば、冷却効率が向上
する半導体素子の冷却装置を提供することができ
る。[Effects of the Invention] According to the present invention described above, it is possible to provide a cooling device for semiconductor elements with improved cooling efficiency.
第１図はこの発明の第１の実施例の一部を断面
した正面図、第２図は第１図のＸ−Ｘ線に沿つて
矢印に見た図、第３図はこの発明の第２の実施例
の一部を断面した正面図、第４図は第１図の−
線に沿つて矢印に見た図、第５図は従来の一例
を示す正面図、第６図は第５図のＹ−Ｙ線に沿つ
て切断し矢印方向に見た断面図である。
１……蒸発部、２……液溜り部、３……凝縮
部、４……ヘツダー、６……冷媒、８ａ，８ｂ…
…開口部、８……仕切り板、９……凝縮管路、１
７……液戻り用パイプ。
FIG. 1 is a partially sectional front view of a first embodiment of the present invention, FIG. 2 is a view taken along the line X--X in FIG. 1, and FIG. FIG. 4 is a partially sectional front view of the embodiment No. 2, and FIG.
FIG. 5 is a front view showing a conventional example, and FIG. 6 is a sectional view taken along line Y--Y in FIG. 5 and viewed in the direction of the arrow. 1... Evaporation section, 2... Liquid reservoir section, 3... Condensation section, 4... Header, 6... Refrigerant, 8a, 8b...
...opening, 8...partition plate, 9...condensation pipe, 1
7...Liquid return pipe.
Claims (1)
付けられ、前記容器内部空間に充填されている冷
媒液体を前記半導体素子の発熱により蒸気を作る
蒸発部と、 この蒸発部の上部に上下方向に配置され、その
上部に形成されたヘツダーと、その下部に形成さ
れた液溜り部との間に、それぞれ上下方向に配設
されるとともに各端部がそれぞれに連通された複
数個のフイン付冷媒通路をサンドイツチ状にして
なる凝縮部と、 この凝縮部を構成している冷媒通路に対してほ
ぼ直角で一方向から強制的に冷却風を送風させる
冷却風送風手段と、 前記液溜り部内に配置され、前記蒸発部と前記
凝縮部とを仕切るとともに前記蒸発部で作られる
蒸気を前記凝縮部に導くための開口部を、前記冷
却風の流出側に形成してなる仕切り体と、 前記蒸発部内に上下方向であつて前記冷却風の
流入側に配置され、前記凝縮部で液化された冷媒
液体を前記仕切り体を通して前記蒸発部に戻す冷
媒戻り用通路とを具備し、 前記冷媒通路のうち、冷却風の流出側および流
入側にあるものをそれぞれ冷媒蒸気通路および凝
縮液通路とし、また前記以外の中間にある冷媒通
路を前記半導体素子の負荷変動による冷媒蒸気発
熱量変動に応じ冷媒蒸気通路あるいは凝縮液通路
として用いることを特徴とする半導体素子の冷却
装置。[Scope of Claims] 1. An evaporation section in which a semiconductor element to be cooled is attached to the outer wall of a bottomed container, and a refrigerant liquid filled in the inner space of the container is turned into vapor by heat generation of the semiconductor element; The header is arranged vertically on the upper part of the header, and between the header formed on the upper part and the liquid reservoir formed on the lower part, the liquid is arranged in the vertical direction, and each end is communicated with each other. a condensing section formed of a plurality of finned refrigerant passages in a sandwich-like configuration; a cooling air blowing means for forcibly blowing cooling air from one direction substantially perpendicular to the refrigerant passages constituting the condensing section; a partition disposed within the liquid reservoir, which partitions the evaporation section and the condensation section, and has an opening formed on the outflow side of the cooling air for guiding vapor produced in the evaporation section to the condensation section; a refrigerant return passage, which is disposed vertically within the evaporator and on the inflow side of the cooling air, and returns the refrigerant liquid liquefied in the condenser to the evaporator through the partition; Among the refrigerant passages, those on the outflow side and the inflow side of the cooling air are respectively referred to as the refrigerant vapor passage and the condensate passage, and the refrigerant passages located in the middle other than the above are used to handle refrigerant vapor calorific value fluctuations due to load fluctuations of the semiconductor elements. 1. A cooling device for a semiconductor device, which is used as a refrigerant vapor passage or a condensate passage depending on the requirements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1311182A JPS58131755A (en) | 1982-01-29 | 1982-01-29 | Cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1311182A JPS58131755A (en) | 1982-01-29 | 1982-01-29 | Cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58131755A JPS58131755A (en) | 1983-08-05 |
| JPS6338864B2 true JPS6338864B2 (en) | 1988-08-02 |
Family
ID=11824036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1311182A Granted JPS58131755A (en) | 1982-01-29 | 1982-01-29 | Cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58131755A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0527887Y2 (en) * | 1987-10-30 | 1993-07-16 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3487382B2 (en) * | 1994-12-28 | 2004-01-19 | 株式会社デンソー | Boiling cooling device |
| JP3255818B2 (en) * | 1995-03-20 | 2002-02-12 | カルソニックカンセイ株式会社 | Cooling device for electronic components |
| JPH08264694A (en) * | 1995-03-20 | 1996-10-11 | Calsonic Corp | Cooling device for electronic parts |
| JP3216770B2 (en) * | 1995-03-20 | 2001-10-09 | カルソニックカンセイ株式会社 | Cooling device for electronic components |
| US6073683A (en) * | 1995-07-05 | 2000-06-13 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same |
| US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
| FR2746177B1 (en) * | 1996-03-14 | 2000-04-07 | COOLING DEVICE USING A BOILING REFRIGERANT AND CONDENSING | |
| US6279649B1 (en) * | 1998-04-27 | 2001-08-28 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
| JP5163548B2 (en) * | 2009-03-10 | 2013-03-13 | トヨタ自動車株式会社 | Boiling cooler |
| JP2011174647A (en) * | 2010-02-24 | 2011-09-08 | Showa Denko Kk | Heat pipe type radiator |
| CN108955326B (en) * | 2018-07-12 | 2020-03-17 | 上海交通大学 | Micro-channel gas-liquid separation evaporator device based on distribution and recovery channel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5026142A (en) * | 1973-07-11 | 1975-03-19 | ||
| JPS5072587A (en) * | 1973-10-29 | 1975-06-16 | ||
| JPS5111330A (en) * | 1974-07-19 | 1976-01-29 | Hitachi Ltd | MOJIHYO JISOCHI |
| JPS5240859A (en) * | 1975-09-27 | 1977-03-30 | Mitsubishi Electric Corp | Heat discharging body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5080742U (en) * | 1973-11-26 | 1975-07-11 |
-
1982
- 1982-01-29 JP JP1311182A patent/JPS58131755A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5026142A (en) * | 1973-07-11 | 1975-03-19 | ||
| JPS5072587A (en) * | 1973-10-29 | 1975-06-16 | ||
| JPS5111330A (en) * | 1974-07-19 | 1976-01-29 | Hitachi Ltd | MOJIHYO JISOCHI |
| JPS5240859A (en) * | 1975-09-27 | 1977-03-30 | Mitsubishi Electric Corp | Heat discharging body |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0527887Y2 (en) * | 1987-10-30 | 1993-07-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58131755A (en) | 1983-08-05 |
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