JPS6122468B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a condenser for a boiling cooling device that cools a heat generating element such as a semiconductor by changing the phase of a condensable cooling medium (hereinafter referred to as a refrigerant).

In order to cool a semiconductor, a condenser for a boiling cooling device transports heat to the outside by cooling and condensing the vapor of a refrigerant generated by the heat generation of the semiconductor, and changing the phase to a liquid.

Conventionally, when a boiling cooling device is used to cool a semiconductor device such as a vehicle, it is configured as shown in FIG. It has been used to improve cooling capacity. However, as shown in Fig. 1, the condensing pipes 2 of the condenser 1 are arranged in multiple stages and in multiple rows, and headers 12 and 13 forming refrigerant passages are connected to both ends of the pipes. , the cooling air can only pass through the area surrounded by the header. Therefore, when the vehicle is running, cooling air flows in the direction of travel, but the cooling efficiency of the condensing pipes in the rear row decreases due to heat dissipation from the front row. Furthermore, when the vehicle is stopped, the condenser tubes are cooled by natural convection in the vertical direction, but the cooling efficiency of the condensing tubes disposed in the upper stage is reduced due to heat dissipation from the condensing tubes in the lower stage. The larger the condenser is, the lower the speed of the vehicle is, and the lighter the wind is, the more remarkable the above-mentioned tendency becomes.
Furthermore, structurally, one of the heat transport pipes 6 and 7 that connects the headers 12 and 13 and the closed container 9 that houses the semiconductor 8 protrudes outside the device outer box 10, making the piping complicated. There is a problem.

In order to solve the above-mentioned problem, a condenser as shown in FIG. 2 can be considered. In the case shown in FIG. 2, the other end of the condensing pipe 2 with its tip closed is connected to
The header 11 is connected to a heat transport pipe 6 for sending refrigerant vapor, and a heat transport pipe 7 for returning the refrigerant liquid cooled and liquefied in the condenser. However, with this configuration, the refrigerant vapor and the condensed liquefied refrigerant liquid flow in opposite directions inside the condensing tube 2, which deteriorates the circulation of the refrigerant and reduces the condensing performance. .

The object of the present invention is to provide a condenser for a evaporative cooling device that improves the drawbacks of the conventional condensers described above.

Embodiments of the present invention will be described below with reference to the drawings.

In FIGS. 3 and 4 showing an embodiment of the present invention, 1 is a condenser, and a header 11 of this condenser 1 is shown.
As shown in FIG. 5, a condensing tube 2 is made of a tube sheet 3, header covers 4, 5, and a semicircular notch 2A formed at its base end, and welded and fixed to the tube sheet 3 and the inner header cover 5. As a result, the gas phase header chamber 11A and the liquid phase header chamber 11B are formed to overlap in the thickness direction. The condensing tube 2 has its tip closed, and a partition plate 14 having a notch 14A and a hole 14B as shown in FIGS. 6a and 6b is fixed therein along the axial direction. It is divided into an upper tube chamber 15A and a lower tube chamber 15B. and upper chamber 1
5A and the gas phase header chamber 11A are communicated with each other, and the lower tube chamber 15B and the liquid phase header chamber 11B are communicated with each other. In addition, as shown in FIG. 9, the gas phase header chamber 1
1A and liquid phase header chamber 11B are connected to a closed container 9 through heat transport pipes 6 and 7, respectively. In addition, in FIG. 9, 8 is a semiconductor installed in a closed container 9, and 10 is an outer box of the boiling cooling device.

In the boiling cooling device configured as described above, when the semiconductor 8 in the closed container 9 generates heat, the refrigerant changes phase from the liquid phase to the gas phase, and this vapor phase refrigerant is mixed with the liquid phase refrigerant in the closed container 9. The heat enters the gas phase header chamber 11A from the upper part of the container 9 through the heat transport pipe 6, and is distributed to the upper tube chamber 15A of each condensing tube 2. The refrigerant vapor that has entered the upper tube chamber 15A flows into the lower tube chamber 15 through the hole 14B and notch 14a provided in the partition plate 14.
However, the liquid-phase refrigerant, which is the cooled and condensed refrigerant vapor, also falls into the sub-pipe chamber 15B.
As shown in FIGS. 3 and 9, the header 11 side of the condensing tube 2 is inclined lower by a predetermined angle with respect to the horizontal, so that the liquid phase refrigerant flowing into the lower tube chamber 15B flows into the liquid phase header chamber. 11B, and further returns to the closed container 9 through the heat transport pipe 7. In this cycle, the refrigerant circulates and the semiconductor 8 is cooled.

In this invention, FIGS. 7a and 7b show another example of the condensing tube 2, in which the partition plate 14 is tilted so that one side is downward by a predetermined angle from the horizontal plane.
There is a notch 1 on the lower side edge.
4c is provided. Further, FIGS. 8a and 8b show still another example of the condensing pipe 2, in which a hole 14b is provided in the valley of a partition plate 14 having a V-shaped cross section. The condensing pipe 2 shown in FIGS. 7 and 8 is
Compared to the one in FIG. 6, there is an advantage that the liquid phase refrigerant flows easily from the upper tube chamber 15A to the lower tube chamber 15B.

When the boiling cooling device shown in FIG. 9 equipped with the condenser 1 configured as described above is mounted on a vehicle 16 such as a train as shown in FIG. 10, each end of the condenser 1 becomes independent. Since the condensing tubes 2 protrude like rods, fresh cooling air can freely flow in and out from the gaps between the condensing tubes 2 in directions other than the vertical and horizontal directions.

Therefore, according to the present invention, it is possible to minimize the decrease in cooling efficiency of the condensing pipe at the rear stage when the vehicle is running and the condensing pipe at the upper stage when the vehicle is stopped. , cleaning can be easily performed from the left and right and from the front side, and furthermore, all the heat transport pipes can be housed within the outer box of the device, making piping work easier.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of the configuration of a conventional evaporative cooling device, Fig. 2 is a side sectional view of a condenser conceived prior to the present invention, and Fig. 3 is a side sectional view of a condenser according to an embodiment of the present invention. 4 is a front view of the same, FIG. 5 is a perspective view of one end of the condensing tube, FIGS. 6 a and b are a cross-sectional view of the condensing tube and a perspective view of the partition plate according to an embodiment of the present invention, FIGS. 7a and b are a cross-sectional view and a perspective view of a partition plate showing a modified example of the condensing pipe, and FIGS. 8 a and b are a cross-sectional view and a perspective view of a partition plate showing another modified example of the condensing pipe. , FIG. 9 is a structural explanatory diagram showing an evaporative cooling device equipped with a condenser according to an embodiment of the present invention, and FIG. 10 is a structural explanatory diagram showing an example of use of the evaporative cooling device of FIG. 9. 1... Condenser, 2... Condensing pipe, 11... Header, 11A... Gas phase header chamber, 11B... Liquid phase header chamber, 14... Partition plate, 14a... Notch,
14b... Hole, 14c... Notch, 15A... Upper tube chamber, 15B... Lower tube chamber. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Scope of Claims] 1. A device comprising condensing pipes arranged in multiple stages and rows, and a header for forming a cooling medium passage communicating with these condensing pipes, wherein the header is configured to cool a gas phase. A gas-phase header chamber for distributing a medium and a liquid-phase header chamber for collecting a liquid-phase cooling medium are stacked on top of each other, and the inside of the condensing tube is divided into an upper tube chamber and a lower tube chamber by a partition plate, A condenser for a boiling cooling device, characterized in that a gas phase header chamber of the header and an upper tube chamber of the condensing tube are communicated with each other, and a liquid phase header chamber and a lower tube chamber are communicated with each other. 2. The condenser for a cooling device according to claim 1, wherein a notch or a hole is provided in a partition plate that divides the inside of the condensing tube to communicate the upper tube chamber and the lower tube chamber.