JPS56149588A - Condenser for boiling type cooler - Google Patents
Condenser for boiling type coolerInfo
- Publication number
- JPS56149588A JPS56149588A JP5249380A JP5249380A JPS56149588A JP S56149588 A JPS56149588 A JP S56149588A JP 5249380 A JP5249380 A JP 5249380A JP 5249380 A JP5249380 A JP 5249380A JP S56149588 A JPS56149588 A JP S56149588A
- Authority
- JP
- Japan
- Prior art keywords
- cooling medium
- pipe
- liquid phase
- phase
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To prevent the back-flows of cooling medium vapor as well as condensed and liquidized cooling medium liquid to smooth the circulation of the cooling medium and improve the condensing properties thereof by a method wherein the interior of the pipe of the condenser for a device cooling a heating body such as a semiconductor or the like by the phase transition of the cooling medium is partitioned into upper and lower chambers by a partitioning panel.
CONSTITUTION: When the semiconductor received in an enclosed vessel is heated, the cooling medium is varied in its phase from liquid phase into gas phase and the gas phase medium rises through the liquid phase medium in the enclosed vessel, flows into a gas phase header chamber 11A from the upper part of this vessel through a heat transporting pipe 6 and is distributed into the upper chamber 15 of the pipe for each condenser 2. The cooling medium vapor entered into the upper chamber 15A flows into the lower chamber 15B of the pipe through holes 14B and notches 14A provided in the partitioning panel 14, however, the liquid phase cooling medium produced by cooling and condensing the cooling medium vapor is also dropped into the lower chamber 15B of the pipe. Then, this liquid phase cooling medium flowed thereinto is flowed into a liquid phase header chamber 11B from the sloped condensing tube 2 and is returned into the enclosed vessel after passing through the heat transporting pipe, thus, the cooling medium is circulated in this cycle to cool the semiconductor 8.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5249380A JPS56149588A (en) | 1980-04-18 | 1980-04-18 | Condenser for boiling type cooler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5249380A JPS56149588A (en) | 1980-04-18 | 1980-04-18 | Condenser for boiling type cooler |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56149588A true JPS56149588A (en) | 1981-11-19 |
JPS6122468B2 JPS6122468B2 (en) | 1986-05-31 |
Family
ID=12916230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5249380A Granted JPS56149588A (en) | 1980-04-18 | 1980-04-18 | Condenser for boiling type cooler |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56149588A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896075U (en) * | 1981-12-22 | 1983-06-29 | 三菱重工業株式会社 | hermetic compressor |
JPS59109780A (en) * | 1982-12-15 | 1984-06-25 | インスチテユ−ト・テプロ−イ・マツソ−ブメナ・イメニ・エイ・ヴイ・リイコヴア・アカデミイ・ナウク・ベロルススコイ・エスエスア−ル | Heat transfer device |
US4554966A (en) * | 1983-06-02 | 1985-11-26 | Vasiliev Leonard L | Heat-transfer device |
US6076596A (en) * | 1996-03-14 | 2000-06-20 | Denso Corporation | Cooling apparatus for high-temperature medium by boiling and condensing refrigerant |
US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
US7004239B2 (en) | 1996-03-14 | 2006-02-28 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
-
1980
- 1980-04-18 JP JP5249380A patent/JPS56149588A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896075U (en) * | 1981-12-22 | 1983-06-29 | 三菱重工業株式会社 | hermetic compressor |
JPS59109780A (en) * | 1982-12-15 | 1984-06-25 | インスチテユ−ト・テプロ−イ・マツソ−ブメナ・イメニ・エイ・ヴイ・リイコヴア・アカデミイ・ナウク・ベロルススコイ・エスエスア−ル | Heat transfer device |
US4554966A (en) * | 1983-06-02 | 1985-11-26 | Vasiliev Leonard L | Heat-transfer device |
US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
US6076596A (en) * | 1996-03-14 | 2000-06-20 | Denso Corporation | Cooling apparatus for high-temperature medium by boiling and condensing refrigerant |
US7004239B2 (en) | 1996-03-14 | 2006-02-28 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
Also Published As
Publication number | Publication date |
---|---|
JPS6122468B2 (en) | 1986-05-31 |
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