JPS56149588A - Condenser for boiling type cooler - Google Patents

Condenser for boiling type cooler

Info

Publication number
JPS56149588A
JPS56149588A JP5249380A JP5249380A JPS56149588A JP S56149588 A JPS56149588 A JP S56149588A JP 5249380 A JP5249380 A JP 5249380A JP 5249380 A JP5249380 A JP 5249380A JP S56149588 A JPS56149588 A JP S56149588A
Authority
JP
Japan
Prior art keywords
cooling medium
pipe
liquid phase
phase
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5249380A
Other languages
Japanese (ja)
Other versions
JPS6122468B2 (en
Inventor
Haruo Tetsuno
Hiroshi Akashi
Toshio Mikane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5249380A priority Critical patent/JPS56149588A/en
Publication of JPS56149588A publication Critical patent/JPS56149588A/en
Publication of JPS6122468B2 publication Critical patent/JPS6122468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent the back-flows of cooling medium vapor as well as condensed and liquidized cooling medium liquid to smooth the circulation of the cooling medium and improve the condensing properties thereof by a method wherein the interior of the pipe of the condenser for a device cooling a heating body such as a semiconductor or the like by the phase transition of the cooling medium is partitioned into upper and lower chambers by a partitioning panel.
CONSTITUTION: When the semiconductor received in an enclosed vessel is heated, the cooling medium is varied in its phase from liquid phase into gas phase and the gas phase medium rises through the liquid phase medium in the enclosed vessel, flows into a gas phase header chamber 11A from the upper part of this vessel through a heat transporting pipe 6 and is distributed into the upper chamber 15 of the pipe for each condenser 2. The cooling medium vapor entered into the upper chamber 15A flows into the lower chamber 15B of the pipe through holes 14B and notches 14A provided in the partitioning panel 14, however, the liquid phase cooling medium produced by cooling and condensing the cooling medium vapor is also dropped into the lower chamber 15B of the pipe. Then, this liquid phase cooling medium flowed thereinto is flowed into a liquid phase header chamber 11B from the sloped condensing tube 2 and is returned into the enclosed vessel after passing through the heat transporting pipe, thus, the cooling medium is circulated in this cycle to cool the semiconductor 8.
COPYRIGHT: (C)1981,JPO&Japio
JP5249380A 1980-04-18 1980-04-18 Condenser for boiling type cooler Granted JPS56149588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5249380A JPS56149588A (en) 1980-04-18 1980-04-18 Condenser for boiling type cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5249380A JPS56149588A (en) 1980-04-18 1980-04-18 Condenser for boiling type cooler

Publications (2)

Publication Number Publication Date
JPS56149588A true JPS56149588A (en) 1981-11-19
JPS6122468B2 JPS6122468B2 (en) 1986-05-31

Family

ID=12916230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5249380A Granted JPS56149588A (en) 1980-04-18 1980-04-18 Condenser for boiling type cooler

Country Status (1)

Country Link
JP (1) JPS56149588A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896075U (en) * 1981-12-22 1983-06-29 三菱重工業株式会社 hermetic compressor
JPS59109780A (en) * 1982-12-15 1984-06-25 インスチテユ−ト・テプロ−イ・マツソ−ブメナ・イメニ・エイ・ヴイ・リイコヴア・アカデミイ・ナウク・ベロルススコイ・エスエスア−ル Heat transfer device
US4554966A (en) * 1983-06-02 1985-11-26 Vasiliev Leonard L Heat-transfer device
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US7004239B2 (en) 1996-03-14 2006-02-28 Denso Corporation Cooling apparatus boiling and condensing refrigerant

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896075U (en) * 1981-12-22 1983-06-29 三菱重工業株式会社 hermetic compressor
JPS59109780A (en) * 1982-12-15 1984-06-25 インスチテユ−ト・テプロ−イ・マツソ−ブメナ・イメニ・エイ・ヴイ・リイコヴア・アカデミイ・ナウク・ベロルススコイ・エスエスア−ル Heat transfer device
US4554966A (en) * 1983-06-02 1985-11-26 Vasiliev Leonard L Heat-transfer device
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US7004239B2 (en) 1996-03-14 2006-02-28 Denso Corporation Cooling apparatus boiling and condensing refrigerant

Also Published As

Publication number Publication date
JPS6122468B2 (en) 1986-05-31

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