JPS59109780A - Heat transfer device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to thermal engineering, and in particular to heat transfer devices.

The present invention can be successfully used in rail transport to heat railway switches, passenger compartments of transport vehicles, and railway cars on electrically powered railways.

Furthermore, the present invention is useful in the industrial field (chemical, medical, microbiological) where strict treatment requirements are imposed on the hot type of heated surfaces, as well as in transport intermediaries and gas and petroleum pipes. It can be useful for heating temporary housing, such as mobile homes used during road construction, and for heating livestock farms.

U.S. Patent No. 3. The transmission device disclosed in R.D., No. 550 is known and can be used as a heating device as well as for removing heat when cooling various objects.

The known heat transfer device includes an evaporation chamber and a condensation chamber made in the form of a tank, the space of the evaporation chamber having a liquid region and a vapor region being connected to the space of the condensation chamber through a vapor flow branch pipe and a fluid flow branch pipe. It communicates with For simplicity, these branch pipes are
'vapour-flow branch pipe
ch plpe)' and one fluid flow branch pipe (flu
id-flow branch plpe)".

When heat is supplied into the evaporation chamber, a liquid heat carrier (he
at carrier) is evaporated. The vaporized heat carrier is passed through a vapor flow branch into a condensation chamber where it condenses, imparting latent heat of vaporization to the object being heated. The condensed heat carrier flows into the evaporator through a fluid flow branch.

Due to the fact that in the known heat transfer device the condensing chamber is made in the form of a tank, the ratio of its length to diameter is close to /, this device can be used for a wide range of horizontally arranged objects. cannot be used for heating.

E, W, 5aaskl J, C, Hartl, Paper 1 ``High performance co-generated heat flow for heat recovery 9 inno'' (A
A heat transfer device disclosed in JAA Page Mother, /2♂0, V, 130g) is known.

Known heat transfer devices can be used to heat a wide range of objects arranged vertically or at a positive angle of inclination to the horizontal.

The known heat transfer device includes an evaporation chamber having a space with a vapor region and a liquid region, and a condensation chamber made in the form of a conduit, which conduit extends into the space along its longitudinal axis. A bulkhead mounted on the evaporation chamber is used to direct the vapor into the space of the condensation chamber and to return the condensed liquid to the evaporation chamber.

The space of the condensation chamber is connected to the evaporation chamber through a fluid flow branch pipe immersed into the liquid heat carrier.

In the known device, the heat carrier vapor coming from the evaporation chamber is passed upwards into the condensation chamber, where it is condensed while passing along longitudinal partitions. Most of the condensed heat carrier is
The fluid flow branches back into the condensation region under its own weight.

The known device can only be used to heat objects of a somewhat extended range (long, wide) if the object to be heated is mounted vertically or with a positive angle of inclination of the device to the horizontal. I can do it. The reason for this is that in this case a reliable return of the condensed heat carrier into the condensation chamber is provided by its own weight. If the angle of inclination of the device with respect to the horizontal is negative, the device described above will not work if the evaporation chamber is arranged above the condensation chamber. The reason is that in this case the liquid heat carrier flows into the condensation chamber and the evaporation chamber is dried.

The efficiency of operation of the device given a horizontal arrangement is not high. The reasons are that in this case, firstly, only part of the inner surface of the evaporator is covered by a liquid heat carrier, which results in a reduction of the thermal power supplied to the evaporator chamber; and secondly, , because the liquid heat carrier covers part of the heat transfer surface in the condensing chamber as a thick layer, which also reduces the thermal power transferred.

Furthermore, in the case of a horizontal arrangement of the device, increasing the length of the condensation zone and decreasing its diameter creates a stagnation zone at the end of the condensation chamber opposite the evaporation chamber. 1. The cooled liquid thermal phase body, which does not participate in the evaporation-condensation process, is accumulated in this stagnation area. Therefore, the above-mentioned transfer device can be used horizontally, which has a small length and requires low thermal power. It can only be used to heat the object on which it is placed.

A disadvantage of the known device is that it cannot be used for heating large areas (long) horizontally arranged objects.

A known heat transfer device disclosed in No. 1, No. 1, No. 1, No. 1, No. 1, No. 1, No. 1, May 2003, USA, can be used for heating subgrade foundations with solar energy.

The known heat transfer device PL includes an evaporation chamber with at least seven heating sources. The space of the evaporation chamber is divided into a liquid region and a vapor region. The condensation chamber is located below the evaporation chamber,
It is constructed in the form of a conduit and in the space there is disposed, along its longitudinal axis, a tube with internal walls communicating with the condensing chamber space and the evaporation chamber space. This tube is used to supply vapor to the condensation chamber space and return condensed liquid to the evaporation chamber.

The known heat transfer device works as follows. When heat is supplied to the evaporation chamber, the liquid heat carrier is evaporated and passed through the tube into the space of the condensation chamber.

In this space, the vapor of the heat carrier is condensed and the latent heat of vaporization is transferred to the object being heated. The process of heat transfer to the object to be heated takes place until the liquid heat carrier in the evaporation chamber is completely evaporated and the pressure in this chamber is reduced. From this moment on, the transfer of heat to the object being heated is stopped, while the liquid heat carrier is transferred from the space of the condensing chamber to the evaporation chamber through a tube that is lowered below the level of the liquid heat carrier. being pushed inside. This process takes place due to the overpressure of the uncondensed gas in the space of the condensing chamber.

When the liquid heat carrier is forced from the condensation chamber to the evaporation chamber,
The pressure in the condensation chamber decreases, while the pressure in the evaporation chamber increases due to the evaporation of the liquid heat carrier pumped into this chamber. When the pressure in the evaporation chamber exceeds the pressure in the condensation chamber, the process of heat transfer to the object to be heated is restarted. This ρ device operates in a vertical configuration of the condensing chamber or at a near-vertical angle of inclination.

If the condensation chamber is placed horizontally, its heat transfer surface is significantly reduced. The reason for this is that only the upper half of the condensing chamber serves as a heating surface, while the lower half is constantly dripped with liquid heat carrier. As a result τ, the thermal power transferred is reduced. thermal power transferred (ther
mal power ) is also reduced by requiring a reduction in the rate of vapor flow in the tubes so that the liquid heat carrier force 4 can flow under its own weight from the condensation chamber into the evaporation chamber.

However, the known heat transfer device suffers from the following drawbacks.

i.e., a long horizontally arranged J
It cannot be used to heat a frozen object.

The main object of the invention is to provide a heat transfer device suitable for heating long horizontally arranged objects.

This and other objects are achieved by providing the following heat transfer device. That is, the heat transfer device t of the present invention includes an evaporation chamber that is divided into a liquid region and a vapor region and has at least seven heating sources, and a condensation chamber in the form of a conduit. , a tube is mounted in the space along its longitudinal axis, the space of the tube communicating with the space of the condensing chamber and the space of the evaporation chamber, and used for supplying vapor into the space of the condensing chamber t' In accordance with the present invention, the condensing chamber space and the tube space are connected to at least two branch pipes, i.e. vapor flow branch pipes, in a heat transfer device used for returning the condensed liquid into the vapor flow chamber space. and vIL body flow branch pipes are connected to the space of the evaporation chamber, one of the branch pipes communicating with the vapor region of the evaporation chamber and the other branch pipe communicating with the liquid region of the evaporation chamber. In this case, the condensation chamber is a heat transfer device characterized in that it is mounted substantially horizontally along the object to be heated. This fact provides condensation of the heat carrier vapor along the entire length of the condensing chamber and therefore a constant temperature along the entire surface of the condensing chamber, I:J. The condensing stream of vapor passing through the condensing chamber captures the condensed heat carrier film and droplets.

The liquid heat carrier is transferred from the condensation chamber to the evaporation chamber through a fluid flow branch.

The movement of vapor and vapor-liquid flow inside a heat transfer device is associated with a pressure drop as it overcomes local resistance and resistance along its length. These resistances are overcome by consuming a small portion of the steam energy generated in the evaporation chamber by the heat source, which is converted back into thermal energy.

The pressure drop is the fluid retained due to the pressure drop
This is compensated by a column of liquid heat carrier in the branch pipe.

The heat transfer device can also work if the angle of inclination of the condensing chamber with respect to the horizontal is negative.

In the development of heat transfer device designs that operate under conditions of uniform or slowly varying heat removal along the condensing chamber, the tube space is coupled through vapor flow branch tubes with the vapor 'singing area of the evaporation chamber, while the condensing It is advantageous to connect the chamber space to the liquid region of the evaporation chamber through a fluid flow branch. The vapor flow moving through the tube space into the condensation chamber space picks up the condensed heat carrier film and droplets and then passes through the fluid flow branch tube i+
n and enter the liquid region of the evaporation chamber. The vapor condensing in the space of the tube transfers the latent heat of vaporization through the walls of the tube and the space and walls of the condensing chamber to the object to be heated. The remaining portion of the heat carrier vapor from the tube is directed into the space of the condensing chamber where it condenses, imparting latent heat of vaporization through the walls of the condensing chamber to the heated object. In this case, the isothermal nature of the walls of the condensing chamber is
Provided by a uniform or slightly varying flow of heat transferred to an object.

By varying the diameter of the tubes and the diameter of the condensing chamber, it is possible to select the cross-sectional area ratio of the elements that gives the smallest pressure drop in the heat transfer device.

For heat transfer devices where the operating conditions of the heat transfer device are characterized by large variations in heat flow along the length of the condensing chamber, the tube space may be communicated with the liquid region of the evaporation chamber through fluid flow branch tubes. It is advantageous, on the other hand, to communicate the condensing chamber 9 with the vapor region of the evaporation chamber through vapor flow branches.

Due to the fact that the vapor is passed directly from the evaporation region of the evaporation chamber into the condensation chamber, the heat transfer from the striped vapor to the heated object takes place directly through the walls of the condensation chamber with relatively low thermal resistance. It will be done.

The above-described embodiments of the heat transfer device are thus characterized by good isothermal properties with a high proportion of heat extraction along the length of the condensing chamber. .

In developing a reliable, mechanically strong and technically advantageous design of the heat transfer device, the vapor flow branch pipe is mounted inside the fluid flow branch pipe, into which the vapor flow from the condensing chamber space is It is expedient to isolate the heat carrier from the vapor region of the evaporation chamber and to immerse both branches into the liquid region of the evaporation chamber. In the given design, the amount of vacuum-tight welded joints is significantly reduced.

Placing the steam flow branch inside the fluid flow branch is useful when developing a wide range of heat transfer devices that operate in the open atmosphere and when the condensing chamber may be subject to accidental mechanical action. It is convenient for

In one embodiment of this design, it is advantageous to create a partition wall that intercepts the flow of heat carriers from the space of the condensing chamber into the vapor region. This partition is made in the form of a ring with a slot 9 that closes an annular gap between the wall of the vapor flow branch tube and the wall of the fluid flow branch tube, through which the condensed heat carriers pass into the evaporation chamber. Conveniently, upon return, said half-ring is mounted at an angle to a plate closing the longitudinal gap between said walls of the branch pipe. In this case, the amount of material required is reduced and the technical suitability of installation and erection operations is improved.

In order to improve the reliability of operation and expand the control range of the transferred heat load, the heat transfer device is equipped with a condenser, the space of the condenser has a vapor region and a liquid region, and has a fluid flow branch. Through the tube it communicates with the liquid region of the evaporation chamber and with the space of the condensation chamber. In this case, the condenser is equipped with a union for filling the evaporation chamber with heat carrier and for removing uncondensed gases from the device.

I The interface of liquid-vapour 1 is transferred from the space of the condensing chamber to the condenser (co
It is possible to provide an increase in the velocity of the steam flow along the entire length of the condenser space by displacing it into the space of i=J.

In one embodiment of the heat transfer device, a condenser is placed directly above the condensing chamber, in which case the heat removed by the condenser is transferred directly to the heated object.

Due to design considerations or due to the effects of the heated object,
When the supply of heat from an additional condenser to the heated object is not desired, it is advantageous to arrange the condenser directly on the fluid flow branch pipe.

Canvas iB to provide efficient heat removal from the condenser
3 may be provided with an outer lip.

In one embodiment of the heat transfer device, an additional drain is placed in the vapor region of the condenser and a drain valve is provided at the outlet from the fluid flow branch pipe into the liquid region, thereby draining the condensing chamber. This provides a reliable discharge of the condensed liquid from the space into the space of the evaporation chamber, while reducing the severity of fluid flow branches.

In order to accelerate the process of putting the device into operation and to improve its reliability, the device [σ includes an insert made of a capillary porous material and in contact with the liquid region of the evaporation chamber. The insert is rigidly coupled to the fluid flow branch tube;
Shut off steam coming from the boiling area of the evaporation chamber. The capillary porous material insert is used to prevent liquid from penetrating from the liquid region of the evaporation chamber through the fluid flow manifold into the condensation chamber during startup of the device.

In one embodiment of the transmission device, an insert is provided which is heated by an additional heat source. The advantage of utilizing said design is based on the following facts.

That is, first, the liquid evaporates from the surface of the additional heating source.
When used, the transfer of heat and darkness can be considerably strengthened,
In this case its total dimensions are reduced, no. First, the overall dimensions of the evaporation chamber should be as small as the required height of the arrangement of the condensation chamber above the evaporation chamber.

In order to improve manufacturing technology and to provide convenient transportation and convenient installation of heat transfer devices with condensing chambers several tens of meters long, this condensing chamber and tubes were made removable. Made.

In one embodiment of the device, a flange is provided on the fitting on the longitudinal chamber with a gasket, while the tube is provided with a threaded fitting, which allows the tube to be closed without reducing the cross-section of said tube and the space of the condensing chamber. and ensure the tightness of the condensing chamber bond.

Taking into account the high cost of this heat transfer device compared to short heat transfer devices, the condensed gas is used to simplify the process of filling the device with liquid and the periodic release of uncondensed gas from the device. A valve is provided at the location of unused gas accumulation.

The heat transfer device shown in FIGS. 1 and 2, intended for example for heating railway switches, comprises an evaporation chamber 1 with two heating sources 2, e.g. an electric heat source. includes,
This heating source 2 is sealed and cooled within the wall of the evaporation chamber 1. ``Besides an insufflation heater, the heating source 2 may be made in the form of other heaters, such as, for example, a gas flame heater.

The space of the evaporation chamber 1 has a liquid region 3 and a vapor region 4.

A condensation chamber 5 in the form of a conduit is mounted above the evaporation chamber 1. In the space 6 of the condensing chamber 5 and along its longitudinal axis, a tube 7 having a space 8 is mounted. tube 7i-1,
, is used to supply vapor into the space 6 of the condensation chamber 5 and to return the condensed liquid to the evaporation space 1.

According to the invention, the heat transfer device includes one branch pipe. namely, a steam flow branch 9 and a fluid flow branch 10 (FIG. 1) extending between the two heating sources 20.

Depending on the shape of the object to be heated 11 (FIG. 1) and the general layout of the evaporation chamber 1, the fluid flow branches 10 can be connected to the evaporation chamber 1.
The vapor region 4 of the evaporation chamber 1 is connected to the pipe 7 by means of a vapor flow branch pipe 9.
It communicates with space 8 of.

The front end of the tube 7 on the side of the steam flow branch tube 9 is closed with a graph 12. A vapor flow section 11 is connected to a skin tube 9 to the side wall of the tube 7 and extends through the side wall of the condensing chamber 5, communicating the space 8 of the tube 7 with the vapor region 4 of the evaporation chamber 1. The liquid region 3 of the evaporation chamber I communicates with the space 6 of the condensation chamber 5 through a fluid flow branch 10 . In the following description, the reference numeral 5 applies both to the condensation chamber and to the conduit. The space 8 of the tube 7 is communicated with the space 6 of the conduit 5. The pipe 7 is the condensing chamber 5
are coaxially arranged with respect to each other. The condensing chamber 5 is arranged substantially horizontally along the calorific body 11. If the object to be heated 11 is a railway switch, the condensing chamber 5 is mounted between the railway switch point and the frame rail, and is connected to the frame rail (7) part a by a special rung. Pressurized.

The number of heating sources 2 is selected based on the required thermal power to be transferred to the heated object 11 and the overall dimensions of the evaporation chamber 1. The evaporation chamber lid is partially filled with a liquid heat carrier 13 (FIG. 2). A union 14 (FIG. 1) is mounted above the condensing chamber 5 in the area of the arrangement of the fluid flow branches for filling the heat transfer device with heat carrier 13 and for removing uncondensed gases from the device. This -ion may be provided at locations where non-condensable gases are expected to accumulate.

All embodiments of the heat transfer device shown in FIGS.
It works as follows.

After the heating source 2 has been turned on, the liquid heat carrier 13 in the liquid region 3 of the evaporation chamber I is heated.

The liquid heat carrier 13 is evaporated and directed along the arrow 1a1 (and its vapor flows into the evaporation chamber l in the direction indicated by the arrow 1bl).
, and then through the steam flow branch pipe 9 into the space 8 of the pipe 7 .

When partially condensed, the vapor stream passes through the space 8 of the tube 7 into the condensation chamber 5. In the space 6 of the line 5 the steam stream is condensed. The heat transfer from the steam condensed in the space 8 of the tube 7 to the heated object 11 takes place through the gap between the inner wall of the condensing chamber 5 and the outer wall of the tube 7, which has a high thermal resistance, while the main steam The condensing chamber 5 is characterized by highly isothermal properties, since the flow is condensed in the space 6 of the line 5. The condensed heat carrier 13 returns under its own weight from the space 6 of the line 5 through the fluid flow branch 10 along the arrow wc1 into the liquid region 3 of the evaporation chamber l.

The stream of condensing vapor passing through the space 8 of the pipe 7 and the space 6 of the line 5 also interacts with the film and droplets of heat carrier condensed in this space, directing the liquid to the fluid flow branch pipe 10. Transfer to. During operation of the heat transfer device, the vapor region 4 of the evaporation chamber 1 and the line 5
A pressure drop equal to the total pressure drop is generated between the space 6 and the space 6 due to the friction and local resistance caused by the transfer of the vapor and vapor-liquid mixture inside the device. This pressure drop during operation of the device creates a column of heat carriers within the fluid flow branch tube 10. The height of this column is equal to the ratio of the total pressure loss to the specific gravity of the heat carrier in the evaporation chamber l. Therefore, the structure of the column of heat carrier 13 in the fluid flow branch pipe 10 and hence rtt'
t, the height of the body flow branch pipe itself is 11 of the heat transfer device.
It is calculated depending on the pressure drop at i1.

The transfer of vapor and vapor-liquid mixture inside the heat transfer device requires the transfer of the energy of the vapor 7 obtained in the evaporator 1, which is then transferred to the object 11 to be heated. converted back into thermal energy.

From the study of thermodynamic processes and hydrodynamic processes within the heat transfer device, the present inventors have shown that this device operates within a wide range of variations in the angle of inclination (positive and negative) of the condensing chamber 5 with respect to the horizontal. There are scales and scales. Due to the respective selection of the height of the fluid flow branch pipe 10 and the cross-sectional area of the space 8 of the neck 7 and the space 6 of the conduit 5 and their ratio, the heat transfer device can have a length of several tens of meters. Several kilowatts of thermal energy can be transferred to a horizontally placed heated object.

The heat carrier 13 is discharged from the fluid flow branch 10 into the liquid region 3 of the evaporation chamber 1+1+for example 71+] between the heat sources 2.

In the heat transfer device, the length of the condensing chamber 5 considerably exceeds the linear dimension of the evaporation chamber 1, so that the complete removal of non-condensable gas from the internal space requires an operating capacity of at least 1f. is determined by the location of anyon 14, H,'%l, which is the path for removing uncompacted gas. .

The device shown in FIGS. 1 and 1 is intended to transfer heat to the waste body when the thermal power transferred is uniformly distributed along the condensing chamber 5.

The heat transfer device shown in FIG. When the variation of the thermal power transmitted along the length of the chamber 15 is large, the amount of heat applied to the heated object 11 is high. As if to communicate, it is difficult to understand.

The X-generating layer of the heat transfer device shown in FIG. 3 is similar to the evaporator shown in FIG. 1 and is located at the same location.

The condensing chamber 15 is made in the shape of a conduit, and the vicinity 16
An arm 17 having a space 18 communicating with the space 16 of the condensing chamber 15 is mounted inside.

The evaporation chamber of the heat transfer device shown in FIG. 3 is the same size as the evaporation chamber shown in FIG. 1 and is therefore designated by the reference numerals mentioned above. The space 18 of the tube 17 communicates with the liquid pore 3 of the evaporation chamber I by a fluid flow branch 19. Space 1 of condensation chamber 15
6 is condensed throughout the otuti: the space 16 of the return room 15
It communicates with the vapor region 4 of the evaporation chamber by a fluid flow branch 20 which communicates with the vapor region 4 of the evaporation chamber.

Taking into account the internal processes occurring in condensation-i415, tube 17HS? The heat transfer device shown in FIG. 3, which is preferably disposed (not shown) above the lower portion of the compression chamber 15, operates as follows.

The heat carrier 13 formed in the evaporation chamber 1 with the above-mentioned function f'F is forced into the wall space 16 of the condensing chamber 15, forcing the vapor υh to diverge 20. No.: The heat transfer from the condensing vapor of the carrier 13 to the heated object 11 is as follows:
It occurs in the gap between the inner wall of the condensing chamber 15 and the outer wall of the 'U17, which has a low thermal resistance. The film of condensed heat carrier 13 is transported through the space 16 by the steam flow, from where the condensed heat carrier 13 flows into the cavity 11411B of the tube 17 and then through the fluid flow branch tube 19f to carry out its own weight. As a result, the air flows into the i6 firing chamber 10 and the resting area 3. - The high heat flow transferred by the condensation (15) to the heated object 1! causes a considerable consumption of the condensed heat carriers flowing from the space 16 of the line into the space 18 of the tube 17. A reliable and trouble-free operation of the heating device g is ensured by the condensing chamber 1 in such a way as to eliminate the stop Eb region of the condensed heat carrier 13.
4 is obtained by placing tube 17 on the lower origin axis of 5.

The heat transfer device shown in FIG.

The evaporation chamber 1 of the heat transfer device shown in FIG. 1 is similar to the evaporation chamber 1 shown in FIG.

The condensing chamber 21 is formed in the shape of a pipe, and its space 22
Inside, there is arranged a tube 2q having a space 24 communicating with the m space 22 of the condensing chamber 21, or this is in principle the same as a conduit.

The heat transfer B fit includes a vapor flow branch 25 and a body flow branch 26, the vapor flow branch 25 being located inside the fluid flow branch 1926, in which the line 21 ρ flowing from the space 22 of the finger carrier evaporation chamber 1 to block the vapor region 4 11, the whisper 27 is attached,
Both branch pipes 25 and 26 are submerged in the liquid in the k%l zone 3.

The action of the heat transfer equipment shown in Fig.
Fig. 2, Fig. 3) and four gutter. Some special features of the fluid dynamics and power transfer that occur within the heat transfer device shown in Fig. 4 will now be described.

The partition wall 27 allows the heat carrier 1 to flow from the space 22 of the pipe line 21.
Steam A branch pipe 25 and fluid flow section 1: [mu i 26, x town evaporation chamber 1]
Due to the fact that it is immersed into the liquid region 3 of
Steam of heat carrier 13 flows from steam region 4 to fluid flow branch f26
This prevents direct penetration into the material. The process of transfer of the heat carrier from the vapor branch pipe 25 into the space 24 of the pipe 23 and the transfer of the condensed heat carrier from the space 22 of the pipe line 21 into the fluid flow branch W26 has a low Caused by hydraulic resistance. This means that the steam flow branch ``W25'' and the fluid Ui
This is because the cross-sectional area of the branch pipe 26 is equal, and the cross-sectional area of the space 24 of 'n23 and the cross-sectional area of the space 22 of the α path 21 are equal. Furthermore, these elements are connected through smooth turns with sufficiently large bending radii.

In the heat transfer device shown in FIG.
A split ring 28 that closes the annular gap 29 between the
It is made in the shape of (No. jlA), and this gap 29 is
The liquid carrier 13 then returns to the evaporation chamber l, and said half ring 28 is connected to a plate 32 (FIG. 6, Figure 7]
It is installed at an angle to τ.

The M+ wall 27 prevents the heat carrier vapor entering the vapor flow branch #25 from coming into direct contact with the liquid heat carrier passing through the fluid flow branch 26. The condensed heat carrier 13 passes through the fluid flow branch pipe 26 to the ring 28 of the halves 9;
This prevents any discharge through the annular gap 29 into the vapor region 4 of the evaporation chamber 1 . From half-split ring 28,
71 (the body carrier flows into the longitudinal space 9λ between the walls 30 and 31 and enters the liquid region of the evaporation chamber l. The plate 32
The immediate contact between the liquid heat carrier and the vapor heat carrier in the longitudinal gap 33? Prevent 911i.

The heat transfer device shown in the fpJ,r diagram is intended for heating objects with operating conditions that require high isothermal e-parameters.

The heat transfer equipment includes a condensing chamber 34 formed in the form of a conduit, and a condensing chamber 34 is installed in the space 35 of the condensing chamber 34. The space 37 of the tube 36 communicates with the space 35 of the condensing chamber 34 .

The heat transfer device also includes a condenser 38 , the space of the kQ chamber 438 has a vapor zone 39 and a liquid zone 40 , and communicates with the space 35 of the condensing chamber 34 through the adder 7° 41 . do. The space of the condenser 38 communicates with the liquid region 3 of the evaporation chamber 1 through a fluid flow branch 32, the design of which is similar to that of the evaporation chamber 1 (
77) and is therefore designated by the reference numerals mentioned above.

The condenser 38 has a union (
union ) 40.

The action of the heat transfer device shown in FIG.
The effect is similar to that shown in Figure 7). Due to the presence of the condenser 48, the condensed heat carrier is transferred from the space 45 to the adder 41.
1), flows into the condenser 4B, then enters the fluid flow branch pipe 42 and flows into the liquid region 3 of the evaporation chamber 1.

A certain amount of heat carrier vapor flows from the space 35 of the condensing chamber 34 into the space of the condenser 39 . Therefore, by removing heat from the surface of the condensate 8939, it is possible to displace the liquid-vapor 1 interface from the furnace space 5 to the condenser 38 station. This is the condensation chamber 3 for the object to be heated, which is placed horizontally in the mu area.
4. During long-term operation of the heat transfer device,
Some of the uncondensed gases may appear within the interior space, and the presence of these gases adversely affects the operation of the device. As a general rule, gases that are not condensed are stored in the condensation chamber 3.
In the farthest part of 4 (along 6ij t'L of steam)
) during operation of the heat transfer device, the condenser 38
serves as a storage tank for non-condensed gases. Therefore, (the atrophy chamber 340 isothermal/sensor is installed on the condenser 38 and the evaporation chamber l on the heat carrier 13
The union 14 used for the 111t operation makes it possible to improve the technology of making the heat transfer device and increase its reliability and service life.

This is because in this case, the gas that is not condensed is removed during photocombination.

The embodiment of the heat transfer device shown in FIG. It is installed directly on the -9 nong.

The condensing chamber 44 is made in the shape of a conduit and the space 45
has a space 47 communicating with the space 45 of the condensing chamber 44? ? It accommodates 46.

The evaporation chamber l of the heat transfer device shown in FIG. 7 is similar to the heat transfer device of FIG. 1 and is designated by the reference numerals mentioned above.

The stations of the condenser 43 communicate with the liquid region 3 of the evaporation chamber 1 through a liquid flow branch pipe 48.

The space 47 of the tube 46 communicates with the vapor region 4 of the evaporation chamber 1 through a vapor flow branch 49. A union 14 is attached to the condenser 43.

The operation of the heat transfer device shown in FIG. 2 has been described above.

The heat carrier condensed in the #2 condensing chamber 44 is transferred from the space 45 into the condenser 43 and then into the liquid region 3 of the evaporation chamber 1. The surface temperature of the condensing chamber 44 can be adjusted by varying the amount of thermal energy removed from the surface of the condenser 43! 0'AJIJ
11i1, in which case this thermal energy is also transferred to the heated object 11.

The embodiment of the heat transfer device shown in FIGS. 1O and 1/1 has a constant +7! The embodiment shown in FIG. , can be used when the deviation from the average value of the amount of thermal power extracted over the length of the shrinking bird 44 is considerably large.

The condenser 50 is directly installed on the fluid v1 branch pipe 51 (701st pipe) which communicates with the space 152 of the gap width chamber 53. Borrow 1 of l slave gangbang 50 is divided into a vapor region 54 and a liquid region 55. Condensation chamber 53 rj: 'L
Make it in the shape of an f road! L, and a pipe 5G is installed between the stations 52.

The evaporation chamber 1 of the apparatus shown in FIGS. 70 and 1/' is similar to the evaporation chamber 1 of FIG.

The station gap 57 of the gf 56 communicates with the steam region 4 of the evaporation chamber 1 (Fig. 1θ). The fluid e1 branch pipe 51 has a space 52
Condensing;:;S 50 space and liquid region 3 of evaporation chamber 1
communicate with.

The station gap 52 communicates with the steam i'') region 4 of the evaporation chamber l (Fig. ε077) through the entire steam flow IL branch 'i''J 59.

In this case, the condenser 50 comprises the bulk region 3 of the evaporation chamber 1 and the tube 5.
It is mounted on a fluid branch pipe 60 that communicates the spaces 57 of 6 with each other.

Mounted on the condenser 50 (Figs. 70, 477) is a union 14, which is used to heat the device with the heat carrier 13 and to remove uncondensed gases. Do
.

The operation of the heat transfer devices shown in FIGS. 1θ and 77 was described above when explaining the operation of the devices shown in FIGS. 1 and 3, respectively. It will be appreciated that because the condenser 50 is mounted directly on the υic body flow manifold 60, the isothermal characteristics of the condensing chamber 53 (FIG. 77) are considerably modified. This is done by increasing the rate of circulation of the vapor and liquid phases of the thermal phase in the space 52 of the v''δ chamber 53, and!
56σ inside the space 57, by removing some thermal power from the condenser 500 and displacing the vapor-liquid interface from the space 57 of the condenser 50 to the space of the condenser 50, the given tL Ru. Therefore, the space 52 of the condensing chamber 53
% of the formation of a stagnation zone of the liquid thermal phase at the point of transfer from the white 56 into the space 57.
gender is reduced.

In the second embodiment of the heat transfer device, the condenser 61 is equipped with an outer rib 62 and is mounted directly on the 010 flow branch spar 53. Heat carrier 13
Attached to the condenser 61 is a union 14 used to fill the system with gas and to remove uncondensed gas from the device.

The condensation chamber 53 and evaporation chamber 1 of the heat transfer device shown in Fig. 7.2 are:
The condensation chamber 53 shown in FIG. 10 and the evaporation chamber 1 shown in FIG. 1 are similar and therefore have the same reference numerals.

The operation of the heat transfer device shown in Figure 7.2 is explained above and the hole.

If the condenser 61 exceeds the outer lip 62, the thermal surface of this condenser is increased, thus increasing the heat power taken from the condenser and reducing the heat carrier in the heat transfer device. It becomes possible to expand the controllable range of the flFJ term. Therefore, the isothermal temperature of the condensing chamber 53 is considerably improved (when the variation in the thermal power taken along the length of the condenser head 53 is large).

In the embodiments of the heat transfer device designs shown in FIGS. The reduction in height required to mount the entire condensation chamber above the evaporation chamber is due to the fact that the heater 64, e.g. The space of the condenser 65 is the vapor region 66
and a liquid region 67.

F of the heat transfer device shown in Fig. 88/3: and have the same reference numerals.

2. A drain valve '69 is installed at the outlet of the fluid flow branch W68 coupled to the liquid region 3. The space 57 of the tube 56 communicates with the vapor region 4 of the evaporation chamber I through a vapor flow branch 70.

The action of the heat transfer device shown in FIG. 73 is as follows.
The condenser 65 with 4 is constructed as follows.

The condensed heat carrier 13 flows from the space 52 of the condensing chamber 53 through the cell flow branch 68 into the condenser 65.

Since the drain valve 69 is adjusted to open at the height of the liquid region 67 corresponding to the entry of the boiler 64 into the liquid, the heater 641d in the condenser 65 and the hot phase body 13 The field is overflowing.

When the heater 64 is flooded with the heat carrier 13 and turned on, the heat phase body 3 boils violently.

#: Shrinking gangbang 5's 1) The pressure in 1j is f"f, Hg is large, the hot phase body 13 begins to move through the fluid flow branch pipe 68, and the 6 drain valves are opened up and down. The condenser 65 and The resistance of the fluid flow front 68 between the liquid region 3 and the hll shaker 6
5 Extended body U sliding branch pipe 6 between space 52 of condensation chamber 53
8, most of the heat carrier 13 is in the evaporation chamber 1.
be transferred into the

Thereafter, the operating cycle of the Φ” device is repeated, i.e.
The heat carrier 13 is connected to the fluid flow branch pipe 68 and MF until the drain valve 69 is closed and the heat carrier 3 is in contact with the crystal heater 64 and the pressure in the space of the condenser 65 increases.
The thermal energy of the heater 64 is therefore transferred to the condensed heat carrier 13.
from the space 52 of the condensing chamber 53 into the liquid region 3 of the evaporation chamber 1. 82 The main part of the heat carrier evaporated in the condenser 65 enters the space 5 of the condensing chamber 53 in a vapor state.
2, where the vapor condenses, imparting latent heat of vaporization to the heated object 11. 64 is the drain valve 69
acts as a pump. However, since the condenser 65
The hydraulic resistance of the upper fluid flow branch 68 causes the condenser 65
Provided that the hydraulic resistance of the fluid flow branch pipe 68 below is overcome, it acts as Iβy. This makes it possible to achieve a reliable operation of the heat transfer device and to provide a good isothermal relationship to the condensing chamber 63, while reducing the required height for installing the condensing chamber 53 above the evaporation chamber l. can be reduced.

1/ll - The heat transfer device shown in Figure 1 is used to transfer heat to a heated object when operating conditions require control of the force transferred. This is given by the fact that the heat transfer device comprises an insert 71 made of capillary porous material and that this insert "71 is in contact with the liquid region 3 of the evaporation chamber 1 described above. The body 71 is rigidly connected to the fluid flow branch pipe 72 and destructs steam from the vapor region 4 of the evaporation chamber 1 without allowing steam to enter into the branch pipe 72.

The condensing chamber 73 is made in the form of a conduit, which in the region of its connection with the flow branch pipe 72 is used for IQing the device with a heat carrier and for removing all uncondensed gas from the arrangement. having a union 14 of.

The operation of the heat transfer device shown in Figure 1 has been described above.

The condensed heat carrier 131''1. enters the fluid flow branch 72 from the condensing chamber 73 and passes through the insert 71 made of capillary porous material into the evaporation chamber IC/) liquid region 3. If the action or matter of heated object 1] is
For example, if you require an increase in the thermal power supplied,
A reduction in the power of the heating source 2 results in the heat carrier 13 in the liquid region 3 of the evaporation chamber 1 being boiled off and the vapor pressure in the vapor region 4 increasing. In this case, the insert 71 prevents the heat carrier 13 from penetrating from the liquid region 3 through the fluid branch pipe 72 into the condensation chamber 73 due to the pressure drop created.

The insert 71 also makes it possible to carry out an accelerated start-up of the heat transfer device from a cold state while preventing the penetration of the heat carrier into the condensing chamber. .

Special % of the heat transfer equipment shown in Figure 1, Figure 1, and Figure 77! ! a depends on the reduction of the height of mounting the condensing chamber above the evaporation chamber to increase the operational efficiency of the device under start-up and transient conditions.

This is achieved due to the fact that the insert 74 made of porous material is heated by an additional heating source 75FC. The additional heating Ujt can include, for example, an electric heater and a gas glazer heater.

The condensing chamber 3 and the evaporating chamber l of the heat transfer device shown in FIG. 1j' are similar to the condensing chamber 53 shown in FIG. have

An additional heating source 75 is mounted hermetically into the wall of the evaporation chamber 1 and is partially immersed into the liquid region 3 of the evaporation chamber 1 (Fig. 1, Fig. 7, O). Figure 77). The insert 74 of capillary porous material is made in the form of an envelope covering the additional heating @75. The storage body flow branch pipe 75 is introduced into the insert 74 (Figures 1!, 1B, Figures) and is firmly fixed there.

The vapor region 4 of the evaporation chamber l (Fig. 1!) is a tube! All 11 of Otsu
J] 57°C throughout and communicates with steam flow branch pipe 58. A union 14 is mounted above the condensing chamber 55 for heating the device with a heat carrier and for removing non-condensable gases from the device.

The operation of the heat transfer device shown in Figure 1, Figure 7, and Figure 8g77 has been described above. In the following, the internal processes that take place within the device with the thermal insert 74 made of capillary porous material will be described in detail.

If the insert 74 is heated n7:I (Fig. 1j)
, first of all, the insert 74 prevents the vapor of the heat carrier 13 from leaking from the vapor region 4 into the vIL body b1t and into the branch pipe 63 and, when starting the heat transfer device (t), prevents the vapor of the heat carrier 13 from leaking into the liquid region 3 into the space of the condensing chamber 53 is eliminated.

l1iI! 2, the heated insert 74 transfers the hot phase from the fluid flow branch tube 76 into the liquid region 3;
The thermal carrier, which also acts as a heat exchanger, is inserted into the insert 74.
Under the effect of capillary forces, the fluid flow is transferred from the branch tube 76 into the liquid region 3. The smaller the diameter of the material of the insert 74, the higher the capillary pressure, and the pressure drop l1fj between 9 of the evaporation chamber 1 and the fluid flow branch tube 76 is
It will be appreciated that this may be overcome by the capillary forces of the material of the indentation body 74. Therefore, if the insert 74 is edge-heated (FIG. 7.5'), the claimed device can provide a heat carrier with an additional heating source 75.
It is also advantageous in that the process of heat and mass transfer is mimicked when the surface of the evaporator is removed from the surface. In this case, the dimensions of the evaporation chamber 1 are such that a high-power and small-sized additional heating source 7
Decreased by 5. The ethicality of fuel burnout of the additional heating source 75 is reduced.

This is because, firstly, it is moistened by the liquid coming from the fluid flow branch 76 and penetrating into the insert 74 (FIG. 76); The idea is to draw in liquid from the liquid region 3 in which the insert 74 is immersed by the action of capillary force (Figs. 1 and 77).

The use of an insert 74 (figure ii's/j) made of capillary porous material and heated by an additional heating source 75 considerably reduces the mounting height of the condensation chamber 53 above υ of the evaporation chamber 1. To let? This shows that it is possible, and therefore the heating device's P￥
It is possible to increase the strength of the pipe for 1' and reduce its weight by 1φ.

The heat transfer device shown in No. 1 RIA is intended for heating objects with a length of several thousand meters, if it is not possible to mount the heating device in close proximity to the object to be heated. ing. In this case, it is advantageous to construct the Gt condensation chamber 7 and the tube 76 as a separable unit. The condensing chamber 75 is made up of conduits 79 and 80, while condensing chambers 786''i, .
It consists of a pipe 81 and a pipe 82. The conduits 79 and 80 are coupled together through a sealing tight fitting 83, while the tubes 81 and 82 are coupled together through a fitting 84'i where tightness is not required.

The space 85 of the conduit 79 passes through the gas flow branch pipe 26,
It is separated from the vapor region 4 of the evaporation chamber 1, which is similar to the evaporation chamber shown in FIG. The space 86 of the tube 81 is ≠, t, A,
It is connected to a steam flow branch pipe 25 similar to the steam flow branch pipe 25 shown in FIG.
71c mentioned above in explaining the apparatus shown in Figures 1/I-7.
.

The hermetically tight joint 83 prevents the leakage of the heat carrier 13 from the internal space of the heat transfer device σ and the passage of ambient air into the device.

Figure 1 shows the design of the joint on the condensing chamber 77 shown in figure ↓/f.

tube 87 is installed with gasket 88, while tube 81
and 82 are provided with a threaded joint 89. tube 81
and 82&yo, by other methods, the 1st line can be combined through the 4th line.

The operation of the device shown in Figure 1 is similar to that described above and shown in the turtle/bottom diagram.

The heat transfer device shown in FIG. 20 is intended for continuous operation. For this purpose, this heat transfer device is installed at a point of accumulation of uncondensed gas and used to periodically release one gas from the device. A valve 90 is installed.

；′■λθ The story shown in the diagram and・'',
The i chamber 53 and the evaporation chamber 1 are the same as the condensation chamber 53 and the evaporation chamber 1 shown in FIG.
Gt *: Has a character.

The valve 90 is mounted on the condenser 91.

;1τ, The operation of the heat transfer device 1′L shown in FIG. 20 has been explained above.

8I! As mentioned above, it is a good gas that cannot be injected and can accumulate in it. 1'[For equipment not used ;l,,t
The uncondensed gas is uniformly distributed in the vapor phase of the 1N carrier.

Due to the fact that in the heat transfer device during operation, the vapor phase is constantly moving from the boiling chamber to the condensing chamber 53, the uncondensed gas is directed to the farthest point of the condensing chamber 53, i.e. to the condenser 91. 8 will be sent to. Uncondensed gas is removed from the system by opening valve 90 in the running transmission gear. If necessary, the transmission device 6A can be connected to the heat carrier 13 through the valve 90.

An example heat transfer device was used to heat a railway rolling stock with a length of 2 m. The overall dimensions of the heat transfer device t'l are as follows.

Length of the condensing chamber: 4'-, jm7, diameter of the condensing chamber: o, oi-mX plane circular dimensions of the ejection chamber: 0. ．． 2'l-×0.33
Closed: The acetone railway switch was equipped with λ heat transfer devices.

In this case, #+: y<43 is the frame rail and +j
It was arranged in the space between I/T and p, where it was pressed by the 7 frame rail Heklang.

Evaporated heat and water insulators were introduced into the ruts from the entry side into special grooves between the rails and the sleepers of the railway floor. .

The test juku is 790 to 750 mm at an ambient temperature of -50 to 7 degrees Celsius.
The snowfall was so strong that it lasted for 24 hours. The speed of the fly is j~/θ7? Substitute hole in lji 已 v11 of l/sho.

Downhill type (Before operating the equipment, turn: X is 50 to 700 m.
It was covered with an evening layer of m thickness.

2θ ~ 30 minutes after voltage is applied to heating <154, 1
1! h, υf, the city started at +tn with Ij Hint and 7 Lemunur, just near Sardine Room. After 7 hours and 10 minutes, length 4 of 1111 between tip and frame rail
/、! ; There was no snow completely between the walls along m. On this length, the harm melted on the frame rail itself and on the gold 4 piece near the 7 frame rail.

The glare of the rail syx section was equal to +j~'~7.2°C, while the 17iA degree beam on the surface of the condensing chamber was set between 0 and 72°C. Active melting of snow and evaporation of moisture were observed at all times ((9).

During the operation of the heat transfer equipment, every 1' (k) operation is carried out without using any additional labor for clearing the snow. 14 After the operation has stopped. , Heat Transfer: It'i was switched off.

〔Example"〕

A heat transfer device for heating rooms and floors, such as a house or farm, had the following overall dimensions:

8゛ and length of return: 10. J-rn Outer diameter of condensing chamber: θ, 03≠mm θ2υ Number of receivers: , 2++r! 1 franc? IL of the evaporation chamber (diameter ”, 0.23; quality of the melon evaporation chamber: 0.77 m and 5 411
Body: A seven-ton body of irises 1L! body fk
:lAJ'1The device was installed at 71 degrees on the wall of the store where it was heated.

77 minutes after switching on the heat transfer device d, the surface temperature of the condensing chamber is equal to g0°C and continues to rise for 7 hours and 20 minutes, increasing the average surface temperature from 1 to 4 +0. Temperatures below ℃. heat transfer), turn on directly fc/hourr
1. f] 30 minutes of cooking, (1 [The surface temperature upon returning to the room is 750
It's ℃, and I'm going to spend 1 ゛ in the L of the history room 1, and I'm in the XL tax! The tq difference does not exceed ±0.6°C, while the temperature in part Lv is. 20~. It was equal to 2.2°C.

[Brief explanation of the drawing]

FIG. 1 shows the Den+! according to the present invention! -7 eyes, 13 shifts, overall 1.”
This is the sheet 1ζir surface diagram. Figure α5.2 is a sectional view taken along the line ■-■ in Figure 1. The TA3 diagram shows the center lαj, i of the heat transfer device jγ according to the present invention.
The seven overall r1 (1f, lt side view of the city) is shown.
Overall maple of two flow collecting modes: 49 in U1 plane view. Figure 2115 is a needle surface view of +'9') I on the V-V line of Figure ≠. Figure 6 shows hJi along the Vl-Vl green line in Figure 81111.
ini 1 diagram makes you feel good. FIG. 7 is a cross-sectional view along the 'jiIII--)'11 gland. Figure n1♂ is a general longitudinal sectional view of yet another embodiment of a heat transfer device according to the invention. r+<? The figure shows another example of the renovation of the transmission device according to the present invention. This is an overall longitudinal cross-sectional 1rff diagram of the I-form tap. 84'! Figure 0 shows yet another practical aspect of the heat transfer device according to the invention. FIG. 72 is a general longitudinal Iat view of another embodiment of a heat transfer device according to the invention. FIG. It is necessary to have the whole vertical + ur side view of Tsunoji h'lj 4 gauze. Et/3 ICC10, heat transfer device (
7 is an overall jrl;I: cross-sectional view of yet another performance m aspect. Fig. 14/- shows the heat transfer device 1 according to the present invention,
:Mountain - is an overall longitudinal sectional view of another seven real gun embodiments. 1st. The left figure shows a general longitudinal sectional view of seven further embodiments of the heat transfer device according to the invention. Figure 1 is an overall multi-phase sectional view of still another embodiment of the heat transfer device due to the misfire. Figure 77C, seven more advantages of the heat transfer device according to the present invention! Figure 1 is an overall cross-sectional view of still another seven embodiments of the heat transfer device according to the present invention. This is another example of the heat transfer device according to J.
Figure 1 shows an overall mechanical view of two embodiments. FIG. 20 shows yet another embodiment of the heat transfer device according to the present invention! FIG. 3 is a full-f, cross-section sectional view of the U mode. l...evaporation chamber, 2...heating chamber, 3...limb chain acid, 4...vapor region 1 5...condensation chamber, 6...space of condensation chamber, 7. ...U, 8...Pipe space, 9...Steam p+c branch, M, 10°...υ1 body υIL branch pipe, 11...Heated object, 12...Plug, 13... Heat carrier, 14... Secondion, 15... Condensing chamber, 16... Space of condensing chamber, 17... Tube, 181... Space of tube, 19... Fluid flow branch pipe , 20... Steam flow branch pipe, 21... Condensation chamber, 22... Space of return room, 23... Tube, 24... Space of pipe, 25... Steam flow branch・a , 26... Fluid flow branch a. 27...Partition wall, 28...Half ring, 29...Monkey-shaped gap, 30・◆-wall, 31-・wall, 321・temporary, 33...vertical gap, 34 ...Condensation chamber, 35...Condensation chamber space, 36...G, 37...Den space, 38...Condenser, 39...Vapor trap area, 40...Liquid chain Acid, 41... Agegeta, 42°... Fluid flow branch pipe, 43... Condenser, 44... Gas return chamber, 45... Space of condensation chamber, 46... E-pipe, 47...・Pipe space, 48...Fluid flow branch pipe, 49...Steam flow branch pipe, 50...Vertical-TBS 51...Fluid flow branch pipe, 52...Condensation chamber space, 53. ... Condensation chamber, 54 ... Vapor region, 55 ... Liquid region, 56 ... Pipe, 57 ... Space of pipe, 59 ... Air flow branch pipe, 60 ... Fluid flow branch pipe, 61...carpet 4 [photograph], 62...outside, lllrip, 63...fluid flow branch pipe, 64...heater, 65...jumping device, 66... Steam/head area, 67... Liquid area, 68... UIt, body flow branch pipe, 69... Drain valve, 70... Steam flow branch d, 71... Pusher body, 72... Fluid flow branch tube, 73... Condensation chamber, 74... Insert, 75... Additional heating source, 715... Fluid flow branch/surface, 77... Condensation chamber, 78... Tube , 79-・-a line, 80...-pipe line, 8 l...・gl 82... pipe, 83... hand to tightly sealed 1, 84... joint, 85... pipe path space, 86...tube space, 87...2 runs, 88...gasket, 89...threaded joint, 90...-masu, 91...@radiator. Continued from page 1 0 Inventor Varyliy Andreevitch Morgun Soviet Union Minsk Ulissa Slavinskogo 35 Cavy 40 0 Inventor Anatoly Mikhailovich Marchenko Soviet Union Minsk Leninsky Prospekt 72 A. K.V. 73 0 Inventor Yevgeny Anatolyevich Rudnev Soviet Union Kharkov-Ulitsa Krasnoarmeyskaya 8-10 KAVY 23 0 Inventor Vasily Andreevitsch Nesvy Tatsovyet Kharkov-Ulitsa Sverdlova 119. Inventor: Leonid Markovitch Dunayevsky Soviet Union, Kharkov-Ulitsa Dozerdinskogo, 59 Cavy 19 0 Inventor: Nikolai Fedorovich Tverdokhleb Soviet Union, Kharkov-Melevyanskoye Show, 30 Cavy 50 ( 0 Inventor Vladimir Mikhailovich Bogdanov Soviet Union Minsk Leninsky Prospekt 127 Cavy 89 0 Inventor Mikhail Ivanovitch Labetsky Soviet Union Minsk Ulitsa P. Glebki 84 Cave

Claims (1)

[Scope of Claims] / A heat transfer device including an evaporation chamber 1 provided with at least seven heating sources 2, wherein the space of the evaporation chamber 1 is connected to a liquid region 3, a vapor region 4 and a pipe line. It is divided into a shaped condensing chamber 5, in which space 6 a tube 7 is installed with its longitudinal axis substantially horizontal; and the space of the evaporation chamber 1, and the ridge chamber 5
In a heat transfer device used for supplying steam into the space 6 of the evaporation chamber 1 and returning condensed liquid into the space of the evaporation chamber 1: At least two branch pipes are provided, namely a vapor flow branch pipe 9 and a fluid flow branch pipe 10, one of said branch pipes communicating with the vapor region 4 of the evaporation chamber 1 and one of said branch pipes communicating with the vapor region 4 of said branch pipe. Heat transfer device, characterized in that the other side communicates with the liquid region 3 of the evaporation chamber 1 and that the condensation chamber 5 is arranged substantially horizontally along the object 11 to be heated. 2. The space 8 of the tube 7 communicates with the vapor region 4 of the evaporation chamber 1 through a vapor flow branch pipe 9, while the space 6 of the condensation chamber 5 communicates with the liquid region of the evaporation chamber 1 through a fluid flow branch pipe 10. 3. The heat transfer device according to claim 1, wherein the heat transfer device is in communication with 3. 3. The space 18 of the tube 17 communicates with the liquid region 3 of the evaporation chamber 1 through a fluid flow branch 19, while the space 16 of the condensation chamber 15 communicates with the aeration region 4 of the evaporation chamber 1 through a vapor flow branch 20. The steam flow branch pipe 25 is located in the interior of the fluid flow branch pipe 26], and is in communication with the fluid flow branch pipe 26. 27 is fitted, the partition wall 27 intercepts the heat carrier 13 flowing from the space 22 of the condensing chamber 21 from the vapor region of the evaporation chamber 1 into which both branch pipes 25, 26 are immersed. The heat transfer device according to claim 9, item 1. The partition wall 27 that blocks the heat carrier 13 flowing from the space 22 of the condensing chamber 21 from the steam region 4 is a steam flow branch pipe. It is made in the form of a half-sill 28 which closes the annular gap 29 between the wall 30 of 25 and the wall 31 of the fluid flow branch pipe 26, so that the condensed heat carrier 13 evaporates through the annular gap 29. Returning into the chamber 1, the half shilling 28 is inserted into the branch pipe 25.
The transmission device according to feature f1 and claim ≠, characterized in that the transmission device is attached at an angle to a plate 32 that closes a vertical gap 33 between the walls 30, 31 of 26. B, includes a condenser 38, the space of the condenser 38 having a vapor region 39, and the liquid region 40 communicating with the space 35 of the condensing chamber 34 and communicating with the liquid region of the evaporation chamber 1 through a fluid flow branch pipe 42; 3, the condenser V 38 is provided with one ion 14 for filling the evaporation chamber 1 with a heat carrier 13 and for removing non-condensed gases from the device. A transmission device according to scope 1. 7. The heat transfer device according to claim 6, wherein the heat transfer device is installed directly on the condenser 43 or the condensing chamber 44. The transmission device according to claim 2, characterized in that the @gangbang 50 is mounted directly on the fluid flow branch pipe 51. Z. The heat transfer device according to item 6 of the scope of patent n11, characterized in that the condenser 61 is provided with an outer rib 62. 10. Claim characterized in that a heater 64 is installed in the vapor region 66 of the condenser 65, while a drain valve 69 is provided at the outlet of the fluid flow branch pipe 68 into the liquid region 3 The heat transfer device according to item 4. 773 an insert 71 made of capillary porous material and in contact with the liquid region 3 of the evaporation chamber 1 is also coupled to the fluid flow branch tube 72, blocking off the vapor coming from the vapor region 4 of the evaporation chamber 1; A heat transfer device according to claim 1, characterized in that: /,! , a patent characterized in that the insert 74 is heated by an additional heating valve 75. 1'-1 The transmission device according to item 7. /3. 2. The heat transfer device according to claim 1, wherein the condensing chamber 77 and the pipe 78 are separated. /lA 7 lunge 87 and gasket 88! To my friend #M
14. Heat transfer device according to claim 13, characterized in that the fitting is mounted on the chamber 77 and the threaded fitting 89 is mounted on the u78. /j The transmission according to claim 1, characterized in that the place of accumulation of non-condensed gases is fitted with a sump valve 90 for periodically releasing these gases from the device. thermal equipment.