JPS57204156A - Ebullition type cooling device - Google Patents

Ebullition type cooling device

Info

Publication number
JPS57204156A
JPS57204156A JP56090098A JP9009881A JPS57204156A JP S57204156 A JPS57204156 A JP S57204156A JP 56090098 A JP56090098 A JP 56090098A JP 9009881 A JP9009881 A JP 9009881A JP S57204156 A JPS57204156 A JP S57204156A
Authority
JP
Japan
Prior art keywords
gaseous
phase
refrigerant
section
guide plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56090098A
Other languages
Japanese (ja)
Inventor
Kiyoshi Kasahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56090098A priority Critical patent/JPS57204156A/en
Publication of JPS57204156A publication Critical patent/JPS57204156A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the lowering of the circulating function of a refrigerant due to the interference of a steam current and a condensed liquid by mounting a guide plate to the lower gaseous-phase chamber of a condenser and separating the passages of the gaseous phase and the liquid phase. CONSTITUTION:The refrigerant 3 enters into the sealed vessel 2 of a boiling section 1, and a heating element 4 is immersed into the refrigerant 3. A condensing section 5 connected to the sealed vessel 2 is mounted to the upper section of the boiling section 1. A large number of refrigerant passages 12 are formed to the condensing section 5, and these upper ends are opened to an upper gaseous-phase chamber 10 and these lower ends to the lower gaseous-phase chamber 11 respectively. The guide plate 13 is mounted slantingly into the lower gaseous-phase chamber 11. The upper end of the guide plate 13 contacts with the inlet section of the lower end of a gaseous-phase refrigerant passage 12', and the guide plate introduces the steam current of a gaseous-phase refrigerant 8. Some clearance is formed between a lower end and the wall of the lower gaseous-phase chamber in the lower end so that a liquid-phase refrigerant 9 as the condensed liquid can fall to the boiling section.
JP56090098A 1981-06-09 1981-06-09 Ebullition type cooling device Pending JPS57204156A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56090098A JPS57204156A (en) 1981-06-09 1981-06-09 Ebullition type cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56090098A JPS57204156A (en) 1981-06-09 1981-06-09 Ebullition type cooling device

Publications (1)

Publication Number Publication Date
JPS57204156A true JPS57204156A (en) 1982-12-14

Family

ID=13989040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56090098A Pending JPS57204156A (en) 1981-06-09 1981-06-09 Ebullition type cooling device

Country Status (1)

Country Link
JP (1) JPS57204156A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949164A (en) * 1987-07-10 1990-08-14 Hitachi, Ltd. Semiconductor cooling apparatus and cooling method thereof
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
JPH0878588A (en) * 1994-09-06 1996-03-22 Nippondenso Co Ltd Boiling/cooling device
JPH08236669A (en) * 1994-12-28 1996-09-13 Nippondenso Co Ltd Boiling cooler
US5832989A (en) * 1996-03-14 1998-11-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US5998863A (en) * 1996-07-19 1999-12-07 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
EP1035398A1 (en) * 1999-03-05 2000-09-13 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
EP0969261A3 (en) * 1998-06-30 2000-09-27 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US7017657B2 (en) 2001-05-11 2006-03-28 Denso Corporation Cooling device boiling and condensing refrigerant
CN103733746A (en) * 2011-05-27 2014-04-16 阿威德热合金有限公司 Thermal transfer device with reduced vertical profile
JP2016153720A (en) * 2016-03-22 2016-08-25 アアヴィッド・サーマロイ・エルエルシー Height-reduced heat transfer device
WO2019126995A1 (en) * 2017-12-26 2019-07-04 曙光信息产业(北京)有限公司 Efficient phase-change condenser for supercomputer

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949164A (en) * 1987-07-10 1990-08-14 Hitachi, Ltd. Semiconductor cooling apparatus and cooling method thereof
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5871043A (en) * 1994-09-06 1999-02-16 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
JPH0878588A (en) * 1994-09-06 1996-03-22 Nippondenso Co Ltd Boiling/cooling device
JPH08236669A (en) * 1994-12-28 1996-09-13 Nippondenso Co Ltd Boiling cooler
US5713413A (en) * 1994-12-28 1998-02-03 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
US5832989A (en) * 1996-03-14 1998-11-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US5998863A (en) * 1996-07-19 1999-12-07 Denso Corporation Cooling apparatus boiling and condensing refrigerant
EP0969261A3 (en) * 1998-06-30 2000-09-27 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6257324B1 (en) * 1998-06-30 2001-07-10 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US6857466B2 (en) 1998-06-30 2005-02-22 Denso Corporation Cooling apparatus boiling and condensing refrigerant
EP1035398A1 (en) * 1999-03-05 2000-09-13 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6561262B1 (en) 1999-03-05 2003-05-13 Denso Corporation Boiling and cooling apparatus
US7017657B2 (en) 2001-05-11 2006-03-28 Denso Corporation Cooling device boiling and condensing refrigerant
CN103733746A (en) * 2011-05-27 2014-04-16 阿威德热合金有限公司 Thermal transfer device with reduced vertical profile
JP2014517906A (en) * 2011-05-27 2014-07-24 アアヴィッド・サーマロイ・エルエルシー Heat transfer device with reduced height
JP2016153720A (en) * 2016-03-22 2016-08-25 アアヴィッド・サーマロイ・エルエルシー Height-reduced heat transfer device
WO2019126995A1 (en) * 2017-12-26 2019-07-04 曙光信息产业(北京)有限公司 Efficient phase-change condenser for supercomputer

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