JP2005123485A - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP2005123485A
JP2005123485A JP2003358593A JP2003358593A JP2005123485A JP 2005123485 A JP2005123485 A JP 2005123485A JP 2003358593 A JP2003358593 A JP 2003358593A JP 2003358593 A JP2003358593 A JP 2003358593A JP 2005123485 A JP2005123485 A JP 2005123485A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor wafer
unit
top ring
polishing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003358593A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005123485A5 (enExample
Inventor
Hiroomi Torii
弘臣 鳥居
Takuji Hayama
卓児 葉山
Tetsuya Yashima
哲也 八嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2003358593A priority Critical patent/JP2005123485A/ja
Priority to TW093130978A priority patent/TWI330570B/zh
Priority to PCT/JP2004/015566 priority patent/WO2005037488A1/en
Priority to CNB2004800301959A priority patent/CN100563926C/zh
Priority to EP04792716.5A priority patent/EP1673201B1/en
Priority to US10/572,948 priority patent/US7445543B2/en
Priority to CN2009101790463A priority patent/CN101670547B/zh
Priority to KR1020067007249A priority patent/KR101088784B1/ko
Publication of JP2005123485A publication Critical patent/JP2005123485A/ja
Priority to US12/240,040 priority patent/US7942725B2/en
Publication of JP2005123485A5 publication Critical patent/JP2005123485A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003358593A 2003-10-17 2003-10-17 研磨装置 Pending JP2005123485A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2003358593A JP2005123485A (ja) 2003-10-17 2003-10-17 研磨装置
TW093130978A TWI330570B (en) 2003-10-17 2004-10-13 Polishing apparatus
US10/572,948 US7445543B2 (en) 2003-10-17 2004-10-14 Polishing apparatus
CNB2004800301959A CN100563926C (zh) 2003-10-17 2004-10-14 抛光装置
EP04792716.5A EP1673201B1 (en) 2003-10-17 2004-10-14 Polishing apparatus and method
PCT/JP2004/015566 WO2005037488A1 (en) 2003-10-17 2004-10-14 Polishing apparatus
CN2009101790463A CN101670547B (zh) 2003-10-17 2004-10-14 抛光装置及将基片从基片保持装置上取下来的方法
KR1020067007249A KR101088784B1 (ko) 2003-10-17 2004-10-14 폴리싱 장치
US12/240,040 US7942725B2 (en) 2003-10-17 2008-09-29 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003358593A JP2005123485A (ja) 2003-10-17 2003-10-17 研磨装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010025057A Division JP5197644B2 (ja) 2010-02-08 2010-02-08 研磨装置及び研磨方法

Publications (2)

Publication Number Publication Date
JP2005123485A true JP2005123485A (ja) 2005-05-12
JP2005123485A5 JP2005123485A5 (enExample) 2009-11-26

Family

ID=34463311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003358593A Pending JP2005123485A (ja) 2003-10-17 2003-10-17 研磨装置

Country Status (7)

Country Link
US (2) US7445543B2 (enExample)
EP (1) EP1673201B1 (enExample)
JP (1) JP2005123485A (enExample)
KR (1) KR101088784B1 (enExample)
CN (2) CN100563926C (enExample)
TW (1) TWI330570B (enExample)
WO (1) WO2005037488A1 (enExample)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270425A (ja) * 2007-04-18 2008-11-06 Disco Abrasive Syst Ltd 移送装置
JP2010182814A (ja) * 2009-02-04 2010-08-19 Disco Abrasive Syst Ltd ウェーハ保持機構
US8430716B2 (en) 2008-01-30 2013-04-30 Ebara Corporation Polishing method and polishing apparatus
KR20140002515A (ko) 2012-06-29 2014-01-08 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 연마 장치
JP2014017428A (ja) * 2012-07-11 2014-01-30 Ebara Corp 研磨装置および研磨方法
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
WO2015141122A1 (ja) * 2014-03-19 2015-09-24 信越半導体株式会社 ワーク保持装置
KR101580102B1 (ko) * 2015-02-10 2015-12-28 장경덕 수압을 이용한 웨이퍼 이면 연마장치
KR20160023568A (ko) 2014-08-21 2016-03-03 가부시키가이샤 에바라 세이사꾸쇼 연마 장치
US9308621B2 (en) 2008-08-21 2016-04-12 Ebara Corporation Method and apparatus for polishing a substrate
US9539699B2 (en) 2014-08-28 2017-01-10 Ebara Corporation Polishing method
US9707661B2 (en) 2014-09-12 2017-07-18 Ebara Corporation Polishing method and polishing apparatus
CN107671714A (zh) * 2017-09-27 2018-02-09 梅州市汇胜木制品有限公司 一种板件自动上料装置
KR20180106069A (ko) * 2017-03-17 2018-10-01 주식회사 케이씨텍 기판 처리 장치 및 그 제어방법
JP2022082171A (ja) * 2020-11-20 2022-06-01 株式会社東京精密 プローバの故障検知方法及びその故障検知装置
JP2023036459A (ja) * 2021-09-02 2023-03-14 東京エレクトロン株式会社 基板処理装置

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KR100447332B1 (ko) * 1998-06-03 2004-09-07 광동제약 주식회사 새로운 처방의 우황청심원 조성물 및 그의 제조방법
JP2007234882A (ja) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板取り扱い方法
KR101036605B1 (ko) * 2008-06-30 2011-05-24 세메스 주식회사 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8524035B2 (en) * 2009-11-30 2013-09-03 Corning Incorporated Method and apparatus for conformable polishing
US8148266B2 (en) * 2009-11-30 2012-04-03 Corning Incorporated Method and apparatus for conformable polishing
US9138857B2 (en) 2010-08-05 2015-09-22 Hwatsing Technology Co., Ltd. Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
DE102012212249B4 (de) * 2012-07-12 2016-02-25 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes und eines Halbleitermoduls
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
JP6027454B2 (ja) * 2013-02-05 2016-11-16 株式会社荏原製作所 研磨装置
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9355882B2 (en) * 2013-12-04 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Transfer module for bowed wafers
CN103730401A (zh) * 2013-12-24 2014-04-16 苏州市奥普斯等离子体科技有限公司 一种改进型芯片夹持装置
CN104907922A (zh) * 2014-03-11 2015-09-16 上海华虹宏力半导体制造有限公司 基座及其中防止硅片出现x型缺陷的去离子水控制装置
US10464185B2 (en) * 2016-03-15 2019-11-05 Ebara Corporation Substrate polishing method, top ring, and substrate polishing apparatus
JP6427131B2 (ja) * 2016-03-18 2018-11-21 株式会社荏原製作所 研磨装置および研磨方法
JP6990980B2 (ja) * 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
KR102385573B1 (ko) * 2017-12-13 2022-04-12 삼성전자주식회사 로드 컵 및 이를 포함하는 화학기계적 연마 장치
JP7074607B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 研磨装置用の治具
CN109249309B (zh) * 2018-11-10 2024-03-08 宇晶机器（长沙）有限公司 连续式多工位抛光机真空管路自清洗控制系统
CN109048662B (zh) * 2018-11-10 2024-03-15 宇晶机器（长沙）有限公司 连续式多工位抛光机真空吸附管路系统
JP7682126B2 (ja) * 2022-04-22 2025-05-23 三菱電機株式会社 半導体装置の製造方法及び成型プレス機
CN116207009B (zh) * 2022-12-30 2023-10-27 江苏福旭科技有限公司 一种单晶硅片刻蚀抛光设备
CN117161950B (zh) * 2023-11-02 2023-12-26 南通海鹰机电集团有限公司 一种用于压力容器制造的抛光装置
CN120228607B (zh) * 2025-06-03 2025-08-19 北京特思迪半导体设备有限公司 用于方形基板抛光的压板、囊膜、抛光压头、设备及方法

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Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270425A (ja) * 2007-04-18 2008-11-06 Disco Abrasive Syst Ltd 移送装置
US8430716B2 (en) 2008-01-30 2013-04-30 Ebara Corporation Polishing method and polishing apparatus
US9687957B2 (en) 2008-06-04 2017-06-27 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US9358662B2 (en) 2008-06-04 2016-06-07 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US11426834B2 (en) 2008-06-04 2022-08-30 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US10486285B2 (en) 2008-06-04 2019-11-26 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US9308621B2 (en) 2008-08-21 2016-04-12 Ebara Corporation Method and apparatus for polishing a substrate
US10307882B2 (en) 2008-08-21 2019-06-04 Ebara Corporation Method and apparatus for polishing a substrate
US11548113B2 (en) 2008-08-21 2023-01-10 Ebara Corporation Method and apparatus for polishing a substrate
JP2010182814A (ja) * 2009-02-04 2010-08-19 Disco Abrasive Syst Ltd ウェーハ保持機構
JP2014008570A (ja) * 2012-06-29 2014-01-20 Ebara Corp 基板保持装置および研磨装置
US10442056B2 (en) 2012-06-29 2019-10-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
KR102033868B1 (ko) 2012-06-29 2019-10-17 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 연마 장치
KR20190008976A (ko) 2012-06-29 2019-01-25 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 연마 장치
KR101942107B1 (ko) 2012-06-29 2019-01-24 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 연마 장치
KR20140002515A (ko) 2012-06-29 2014-01-08 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 연마 장치
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
JP2014017428A (ja) * 2012-07-11 2014-01-30 Ebara Corp 研磨装置および研磨方法
US9728442B2 (en) 2014-03-19 2017-08-08 Shin-Etsu Handotai Co., Ltd. Workpiece holding apparatus
TWI613750B (zh) * 2014-03-19 2018-02-01 Shin Etsu Handotai Co Ltd 工件保持裝置
WO2015141122A1 (ja) * 2014-03-19 2015-09-24 信越半導体株式会社 ワーク保持装置
JP2015179754A (ja) * 2014-03-19 2015-10-08 信越半導体株式会社 ワーク保持装置
CN106068555B (zh) * 2014-03-19 2018-11-20 信越半导体株式会社 工件支承装置
KR102136134B1 (ko) * 2014-03-19 2020-07-22 신에쯔 한도타이 가부시키가이샤 워크유지장치
KR20160134665A (ko) * 2014-03-19 2016-11-23 신에쯔 한도타이 가부시키가이샤 워크유지장치
CN106068555A (zh) * 2014-03-19 2016-11-02 信越半导体株式会社 工件支承装置
KR20160023568A (ko) 2014-08-21 2016-03-03 가부시키가이샤 에바라 세이사꾸쇼 연마 장치
JP2016043442A (ja) * 2014-08-21 2016-04-04 株式会社荏原製作所 研磨装置
US9539699B2 (en) 2014-08-28 2017-01-10 Ebara Corporation Polishing method
US9707661B2 (en) 2014-09-12 2017-07-18 Ebara Corporation Polishing method and polishing apparatus
KR101580102B1 (ko) * 2015-02-10 2015-12-28 장경덕 수압을 이용한 웨이퍼 이면 연마장치
KR102331075B1 (ko) * 2017-03-17 2021-11-25 주식회사 케이씨텍 기판 처리 장치
KR20180106069A (ko) * 2017-03-17 2018-10-01 주식회사 케이씨텍 기판 처리 장치 및 그 제어방법
CN107671714A (zh) * 2017-09-27 2018-02-09 梅州市汇胜木制品有限公司 一种板件自动上料装置
CN107671714B (zh) * 2017-09-27 2024-01-30 宜华生活科技股份有限公司 一种板件自动上料装置
JP2022082171A (ja) * 2020-11-20 2022-06-01 株式会社東京精密 プローバの故障検知方法及びその故障検知装置
JP7529544B2 (ja) 2020-11-20 2024-08-06 株式会社東京精密 プローバの故障検知方法及びその故障検知装置
JP2023036459A (ja) * 2021-09-02 2023-03-14 東京エレクトロン株式会社 基板処理装置
JP7715464B2 (ja) 2021-09-02 2025-07-30 東京エレクトロン株式会社 基板処理装置

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Publication number Publication date
US7445543B2 (en) 2008-11-04
CN1867424A (zh) 2006-11-22
CN101670547B (zh) 2012-07-25
US7942725B2 (en) 2011-05-17
US20060292967A1 (en) 2006-12-28
TW200528234A (en) 2005-09-01
KR101088784B1 (ko) 2011-12-01
US20090068935A1 (en) 2009-03-12
EP1673201B1 (en) 2014-07-02
TWI330570B (en) 2010-09-21
WO2005037488A1 (en) 2005-04-28
CN100563926C (zh) 2009-12-02
EP1673201A1 (en) 2006-06-28
KR20070017973A (ko) 2007-02-13
CN101670547A (zh) 2010-03-17

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